Commit Graph

4 Commits

Author SHA1 Message Date
Vineet Gupta fa1c3ff935 ARC: Module support
Signed-off-by: Vineet Gupta <vgupta@synopsys.com>
2013-02-15 23:16:01 +05:30
Vineet Gupta 547f112571 ARC: ptrace support
Signed-off-by: Vineet Gupta <vgupta@synopsys.com>
Acked-by: Arnd Bergmann <arnd@arndb.de>
2013-02-15 23:15:59 +05:30
Vineet Gupta 999159a538 ARC: [DeviceTree] Basic support
This is minimal infrastructure needed for devicetree work.
It uses an a sample "skeleton" devicetree - embedded in kernel image -
to print the board, manufacturer by parsing the top-level "compatible"
string.

As of now we don't need any additional "board" specific "machine_desc".

TODO: support interpreting the command line as boot-loader passed dtb

Signed-off-by: Vineet Gupta <vgupta@synopsys.com>
Cc: Arnd Bergmann <arnd@arndb.de>
Cc: Grant Likely <grant.likely@secretlab.ca>
Cc: devicetree-discuss@lists.ozlabs.org
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: James Hogan <james.hogan@imgtec.com>
Reviewed-by: Rob Herring <rob.herring@calxeda.com>
Reviewed-by: James Hogan <james.hogan@imgtec.com>
2013-02-15 23:15:55 +05:30
Vineet Gupta cfdbc2e16e ARC: Build system: Makefiles, Kconfig, Linker script
Arnd in his review pointed out that arch Kconfig organisation has several
deficiencies:

* Build time entries for things which can be runtime extracted from DT
  (e.g. SDRAM size, core clk frequency..)
* Not multi-platform-image-build friendly (choice .. endchoice constructs)
* cpu variants support (750/770) is exclusive.

The first 2 have been fixed in subsequent patches.
Due to the nature of the 750 and 770, it is not possible to build for
both together, w/o special runtime glue code which would hurt
performance.

Signed-off-by: Vineet Gupta <vgupta@synopsys.com>
Cc: Arnd Bergmann <arnd@arndb.de>
Cc: Sam Ravnborg <sam@ravnborg.org>
Acked-by: Sam Ravnborg <sam@ravnborg.org>
2013-02-11 20:00:25 +05:30