Commit Graph

91 Commits

Author SHA1 Message Date
Zhang Rui 111b23cf89 Merge branches 'release' and 'thermal-soc' of .git into next 2015-06-11 12:52:14 +08:00
kongxinwei 9a5238a9c6 thermal: hisilicon: add new hisilicon thermal sensor driver
This patch adds the support for hisilicon thermal sensor, within
hisilicon SoC. there will register sensors for thermal framework
and use device tree to bind cooling device.

Signed-off-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-06-03 15:58:52 -07:00
Javi Merino db6cb88b8f thermal: remove stale THERMAL_POWER_ACTOR select
A previous version of this patch had a config for THERMAL_POWER_ACTOR
but it was dropped.  Remove the select as it is not doing anything.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Reported-by: Valentin Rothberg <valentinrothberg@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:53 -07:00
Punit Agrawal 35e946447f thermal: core: Add Kconfig option to enable writable trips
Add a Kconfig option to allow system integrators to control whether
userspace tools can change trip temperatures. This option overrides
the thermal zone setup in the driver code and must be enabled for
platform specified writable trips to come into effect.

The original behaviour of requiring root privileges to change trip
temperatures remains unchanged.

Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:53 -07:00
Javi Merino 6b775e870c thermal: introduce the Power Allocator governor
The power allocator governor is a thermal governor that controls system
and device power allocation to control temperature.  Conceptually, the
implementation divides the sustainable power of a thermal zone among
all the heat sources in that zone.

This governor relies on "power actors", entities that represent heat
sources.  They can report current and maximum power consumption and
can set a given maximum power consumption, usually via a cooling
device.

The governor uses a Proportional Integral Derivative (PID) controller
driven by the temperature of the thermal zone.  The output of the
controller is a power budget that is then allocated to each power
actor that can have bearing on the temperature we are trying to
control.  It decides how much power to give each cooling device based
on the performance they are requesting.  The PID controller ensures
that the total power budget does not exceed the control temperature.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:52 -07:00
Ivan T. Ivanov c610afaa21 thermal: Add QPNP PMIC temperature alarm driver
Add support for the temperature alarm peripheral found inside
Qualcomm plug-and-play (QPNP) PMIC chips. The temperature alarm
peripheral outputs a pulse on an interrupt line whenever the
thermal over temperature stage value changes.

Register a thermal sensor. The temperature reported by this thermal
sensor device should reflect the actual PMIC die temperature if an
ADC is present on the given PMIC. If no ADC is present, then the
reported temperature should be estimated from the over temperature
stage value.

Cc: David Collins <collinsd@codeaurora.org>
Signed-off-by: Ivan T. Ivanov <iivanov@mm-sol.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:51 -07:00
Ong, Boon Leong 8c18769396 thermal: intel Quark SoC X1000 DTS thermal driver
In Intel Quark SoC X1000, there is one on-die digital temperature sensor(DTS).
The DTS offers both hot & critical trip points.

However, in current distribution of UEFI BIOS for Quark platform, only
critical trip point is configured to be 105 degree Celsius (based on Quark
SW ver1.0.1 and hot trip point is not used due to lack of IRQ.

There is no active cooling device for Quark SoC, so Quark SoC thermal
management logic expects Linux distro to orderly power-off when temperature
of the DTS exceeds the configured critical trip point.

Kernel param "polling_delay" in milliseconds is used to control the frequency
the DTS temperature is read by thermal framework. It defaults to 2-second.
To change it, use kernel boot param "intel_quark_dts_thermal.polling_delay=X".

User interacts with Quark SoC DTS thermal driver through sysfs via:
/sys/class/thermal/thermal_zone0/

For example:
 - to read DTS temperature
   $ cat temp
 - to read critical trip point
   $ cat trip_point_0_temp
 - to read trip point type
   $ cat trip_point_0_type
 - to emulate temperature raise to test orderly shutdown by Linux distro
   $ echo 105 > emul_temp

Tested-by: Bryan O'Donoghue <pure.logic@nexus-software.ie>
Signed-off-by: Ong Boon Leong <boon.leong.ong@intel.com>
Reviewed-by: Bryan O'Donoghue <pure.logic@nexus-software.ie>
Reviewed-by: Kweh, Hock Leong <hock.leong.kweh@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2015-05-01 11:20:43 +08:00
Srinivas Pandruvada 4d0dd6c157 Thermal/int340x/processor_thermal: Enable auxiliary DTS for Braswell
Support two auxiliary DTS present on Braswell platform using side band
IOSF interface. This supports two read write trips, which can be used
to get notification on trip violation.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
2015-05-01 11:20:42 +08:00
Srinivas Pandruvada 3a2419f865 Thermal: Intel SoC: DTS thermal use common APIs
There is no change in functionality but using the common IOSF core APIs.
This driver is now just responsible for enumeration and call relevant
API to create thermal zone and register critical trip.
Also cpuid 0x4c is now handled in the int340x processor thermal driver
with the same functionality.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
2015-05-01 11:20:42 +08:00
Srinivas Pandruvada ee073604db Thermal: Intel SoC: DTS thermal IOSF core
This is becoming a common feature for Intel SoCs to expose the additional
digital temperature sensors (DTSs) using side band interface (IOSF). This
change remove common IOSF DTS handler function from the existing driver
intel_soc_dts_thermal.c and creates a stand alone module, which can
be selected from the SoC specific drivers. In this way there is less
code duplication.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
2015-05-01 11:20:42 +08:00
Caesar Wang cbac8f6394 thermal: rockchip: add driver for thermal
Thermal is TS-ADC Controller module supports
user-defined mode and automatic mode.

User-defined mode refers,TSADC all the control signals entirely by
software writing to register for direct control.

Automaic mode refers to the module automatically poll TSADC output,
and the results were checked.If you find that the temperature High
in a period of time,an interrupt is generated to the processor
down-measures taken;If the temperature over a period of time High,
the resulting TSHUT gave CRU module,let it reset the entire chip,
or via GPIO give PMIC.

Signed-off-by: zhaoyifeng <zyf@rock-chips.com>
Signed-off-by: Caesar Wang <caesar.wang@rock-chips.com>
Reviewed-by: Dmitry Torokhov <dmitry.torokhov@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-11-24 14:35:07 -04:00
Mikko Perttunen 66fb848051 thermal: Add Tegra SOCTHERM thermal management driver
This adds support for the Tegra SOCTHERM thermal sensing and management
system found in the Tegra124 system-on-chip. This initial driver supports
temperature polling for four thermal zones.

Signed-off-by: Mikko Perttunen <mperttunen@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-11-20 10:43:17 -04:00
Eduardo Valentin f9df89d897 thermal: introduce clock cooling device
This patch introduces a new thermal cooling device based on common clock
framework. The original motivation to write this cooling device is to be
able to cool down thermal zones using clocks that feed co-processors, such
as GPUs, DSPs, Image Processing Co-processors, etc. But it is written
in a way that it can be used on top of any clock.

The implementation is pretty straight forward. The code creates
a thermal cooling device based on a pair of a struct device and a clock name.
The struct device is assumed to be usable by the OPP layer. The OPP layer
is used as source of the list of possible frequencies. The (cpufreq) frequency
table is then used as a map from frequencies to cooling states. Cooling
states are indexes to the frequency table.

The logic sits on top of common clock framework, specifically on clock
pre notifications. Any PRE_RATE_CHANGE is hijacked, and the transition is
only allowed when the new rate is within the thermal limit (cooling state -> freq).

When a thermal cooling device state transition is requested, the clock
is also checked to verify if the current clock rate is within the new
thermal limit.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Mike Turquette <mturquette@linaro.org>
Cc: Nishanth Menon <nm@ti.com>
Cc: Pavel Machek <pavel@ucw.cz>
Cc: "Rafael J. Wysocki" <rjw@sisk.pl>
Cc: Len Brown <len.brown@intel.com>
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: linux-pm@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-11-20 10:43:16 -04:00
Linus Torvalds 8264fce6de Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management updates from Zhang Rui:
 "Sorry that I missed the merge window as there is a bug found in the
  last minute, and I have to fix it and wait for the code to be tested
  in linux-next tree for a few days.  Now the buggy patch has been
  dropped entirely from my next branch.  Thus I hope those changes can
  still be merged in 3.18-rc2 as most of them are platform thermal
  driver changes.

  Specifics:

   - introduce ACPI INT340X thermal drivers.

     Newer laptops and tablets may have thermal sensors and other
     devices with thermal control capabilities that are exposed for the
     OS to use via the ACPI INT340x device objects.  Several drivers are
     introduced to expose the temperature information and cooling
     ability from these objects to user-space via the normal thermal
     framework.

     From: Lu Aaron, Lan Tianyu, Jacob Pan and Zhang Rui.

   - introduce a new thermal governor, which just uses a hysteresis to
     switch abruptly on/off a cooling device.  This governor can be used
     to control certain fan devices that can not be throttled but just
     switched on or off.  From: Peter Feuerer.

   - introduce support for some new thermal interrupt functions on
     i.MX6SX, in IMX thermal driver.  From: Anson, Huang.

   - introduce tracing support on thermal framework.  From: Punit
     Agrawal.

   - small fixes in OF thermal and thermal step_wise governor"

* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (25 commits)
  Thermal: int340x thermal: select ACPI fan driver
  Thermal: int3400_thermal: use acpi_thermal_rel parsing APIs
  Thermal: int340x_thermal: expose acpi thermal relationship tables
  Thermal: introduce int3403 thermal driver
  Thermal: introduce INT3402 thermal driver
  Thermal: move the KELVIN_TO_MILLICELSIUS macro to thermal.h
  ACPI / Fan: support INT3404 thermal device
  ACPI / Fan: add ACPI 4.0 style fan support
  ACPI / fan: convert to platform driver
  ACPI / fan: use acpi_device_xxx_power instead of acpi_bus equivelant
  ACPI / fan: remove no need check for device pointer
  ACPI / fan: remove unused macro
  Thermal: int3400 thermal: register to thermal framework
  Thermal: int3400 thermal: add capability to detect supporting UUIDs
  Thermal: introduce int3400 thermal driver
  ACPI: add ACPI_TYPE_LOCAL_REFERENCE support to acpi_extract_package()
  ACPI: make acpi_create_platform_device() an external API
  thermal: step_wise: fix: Prevent from binary overflow when trend is dropping
  ACPI: introduce ACPI int340x thermal scan handler
  thermal: Added Bang-bang thermal governor
  ...
2014-10-24 11:21:43 -07:00
Zhang Rui 6ceaf58abe Merge branch 'int340x-thermal' of .git into next 2014-10-17 14:30:58 +08:00
Zhang Rui d8054749c6 Thermal: int340x thermal: select ACPI fan driver
we share the same driver for both ACPI predefined Fan device
and INT3404 Fan device, thus we should select the ACPI Fan
driver when int340x thermal drivers are enabeld.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-10-17 14:30:41 +08:00
Jacob Pan 52b1c69d7e Thermal: int340x_thermal: expose acpi thermal relationship tables
ACPI 4.0 introduced two thermal relationship tables via _ART
(active cooling) and  _TRT (passive cooling) objects. These
tables contain many to many relationships among thermal sensors
and cooling devices.

This patch parses _ART and _TRT and makes the result available to
the userspace via an misc device interface. At the same time,
kernel drivers can also request parsing results from internal
kernel APIs.

The results include source and target devices, influence, and
sampling rate in case of _TRT. For _ART, the result shows source
device, target device, and weight percentage.

Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-10-11 09:35:48 +08:00
Lan Tianyu 4384b8fe16 Thermal: introduce int3403 thermal driver
ACPI INT3403 device object can be used to retrieve temperature date
from temperature sensors present in the system, and to expose
device' performance control.

The previous INT3403 thermal driver supports temperature reporting only,
thus remove it and introduce this new & enhanced one.

Signed-off-by: Lan Tianyu <tianyu.lan@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-10-11 09:35:36 +08:00
Zhang Rui 0ab15365ff Thermal: int3400 thermal: register to thermal framework
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-10-10 13:57:10 +08:00
Zhang Rui 816cab931f Thermal: introduce int3400 thermal driver
Introduce int3400 thermal driver. And make INT3400 driver
enumerate the other int340x thermal components shown in _ART/_TRT.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-10-10 13:57:09 +08:00
Zhang Rui 3230bbfce8 ACPI: introduce ACPI int340x thermal scan handler
Newer laptops and tablets that use ACPI may have thermal sensors and
other devices with thermal control capabilities outside the core CPU/SOC,
for thermal safety reasons.
They are exposed for the OS to use via
1) INT3400 ACPI device object as the master.
2) INT3401 ~ INT340B ACPI device objects as the slaves.

This patch introduces a scan handler to enumerate the INT3400
ACPI device object to platform bus, and prevent its slaves
from being enumerated before the controller driver being probed.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-09-11 23:35:15 +08:00
Andrew Lunn 575be653f8 thermal: Remove ARCH_KIRKWOOD dependency
mach-kirkwood has been removed, now that kirkwood lives in mach-mvebu.
Depend on MACH_KIRKWOOD, which will be set when kirkwood is built as
part of ARCH_MVEBU.

Signed-off-by: Andrew Lunn <andrew@lunn.ch>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Acked-by: Eduardo Valentin <edubezval@gmail.com>
Link: https://lkml.kernel.org/r/1409417172-6846-4-git-send-email-andrew@lunn.ch
Signed-off-by: Jason Cooper <jason@lakedaemon.net>
2014-09-09 14:39:21 +00:00
Peter Feuerer e4dbf98f7f thermal: Added Bang-bang thermal governor
The bang-bang thermal governor uses a hysteresis to switch abruptly on
or off a cooling device.  It is intended to control fans, which can
not be throttled but just switched on or off.
Bang-bang cannot be set as default governor as it is intended for
special devices only.  For those special devices the driver needs to
explicitely request it.

Cc: Andrew Morton <akpm@linux-foundation.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Andreas Mohr <andi@lisas.de>
Cc: Borislav Petkov <bp@suse.de>
Cc: Javi Merino <javi.merino@arm.com>
Cc: linux-pm@vger.kernel.org
Signed-off-by: Peter Feuerer <peter@piie.net>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-08-27 15:45:58 +08:00
Zhang Rui 47d104ba58 Merge branches 'exynos-fix', 'for-rc', 'int3403-fix', 'misc', 'rcar-thermal' and 'sti-thermal' of .git into next 2014-07-22 10:13:00 +08:00
Riku Voipio b3dee3905c thermal: allow building dove_thermal with mvebu
DT-enabled Dove has moved from ARCH_DOVE in mach-dove to MACH_DOVE
in mach-mvebu. As non-DT ARCH_DOVE will stay to rot for a while, add a new
DT-only MACH_DOVE to thermal Kconfig.

This was originally supposed to go in via "ARM: dove: prepare new Dove DT Kconfig"
patch from Sebastian Hesselbarth for 3.15, but slipped through the cracks.

I've tested on CuBox that without this patch you can't compile
dove_thermal into a mach-mvebu based kernel, and with this patch I can
build the driver and it works as expected run-time.

v2: non-ascii char creeped in somehow

Signed-off-by: Riku Voipio <riku.voipio@linaro.org>
Cc: Sebastian Hesselbarth <sebastian.hesselbarth@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Acked-by: Sebastian Hesselbarth <sebastian.hesselbarth@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-07-15 22:25:11 +08:00
Lee Jones 60aef7ce45 thermal: sti: Introduce ST Thermal core code
This core is shared by both ST's 'memory mapped' and
'system configuration register' based Thermal controllers.

Signed-off-by: Ajit Pal Singh <ajitpal.singh@st.com>
Signed-off-by: Lee Jones <lee.jones@linaro.org>
Acked-by: Pavel Machek <pavel@ucw.cz>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-07-15 22:01:22 +08:00
Zhang Rui 63745aa72e Merge branches 'armada-375-380-soc-support', 'eduardo-thermal-soc-fixes', 'intel-soc-dts-thermal' and 'thermal-soc-fixes' of .git into next 2014-05-15 17:18:02 +08:00
Zhang Rui 9550b8d1dc Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into thermal-soc-fixes 2014-05-15 16:41:34 +08:00
Srinivas Pandruvada bc40b5e320 thermal: Intel SoC DTS thermal
In the Intel SoCs like Bay Trail, there are 2 additional digital temperature
sensors(DTS), in addition to the standard DTSs in the core. Also they support
4 programmable thresholds, out of which two can be used by OSPM. These
thresholds can be used by OSPM thermal control. Out of these two thresholds,
one is used by driver and one user mode can change via thermal sysfs to get
notifications on threshold violations.

The driver defines one critical trip points, which is set to TJ MAX - offset.
The offset can be changed via module parameter (default 5C). Also it uses
one of the thresholds to get notification for this temperature violation.
This is very important for orderly shutdown as the many of these devices don't
have ACPI thermal zone, and expects that there is some other thermal control
mechanism present in OSPM. When a Linux distro is used without additional
specialized thermal control program, BIOS can do force shutdown when thermals
are not under control. When temperature reaches critical, the Linux thermal
core will initiate an orderly shutdown.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-05-15 16:37:24 +08:00
Bartlomiej Zolnierkiewicz 4de458174a thermal: offer Samsung thermal support only when ARCH_EXYNOS is defined
Menu for Samsung thermal support is visible on all Samsung
platforms while thermal drivers are currently available only
for EXYNOS SoCs. Fix it by replacing PLAT_SAMSUNG dependency
with ARCH_EXYNOS one.

Signed-off-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Signed-off-by: Kyungmin Park <kyungmin.park@samsung.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-05-06 14:51:32 -04:00
Linus Torvalds cbda94e039 ARM: SoC: driver changes
These changes are mostly for ARM specific device drivers that either
 don't have an upstream maintainer, or that had the maintainer ask
 us to pick up the changes to avoid conflicts. A large chunk of this
 are clock drivers (bcm281xx, exynos, versatile, shmobile), aside from
 that, reset controllers for STi as well as a large rework of the
 Marvell Orion/EBU watchdog driver are notable.
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Merge tag 'drivers-3.15' of git://git.kernel.org/pub/scm/linux/kernel/git/arm/arm-soc

Pull ARM SoC driver changes from Arnd Bergmann:
 "These changes are mostly for ARM specific device drivers that either
  don't have an upstream maintainer, or that had the maintainer ask us
  to pick up the changes to avoid conflicts.

  A large chunk of this are clock drivers (bcm281xx, exynos, versatile,
  shmobile), aside from that, reset controllers for STi as well as a
  large rework of the Marvell Orion/EBU watchdog driver are notable"

* tag 'drivers-3.15' of git://git.kernel.org/pub/scm/linux/kernel/git/arm/arm-soc: (99 commits)
  Revert "dts: socfpga: Add DTS entry for adding the stmmac glue layer for stmmac."
  Revert "net: stmmac: Add SOCFPGA glue driver"
  ARM: shmobile: r8a7791: Fix SCIFA3-5 clocks
  ARM: STi: Add reset controller support to mach-sti Kconfig
  drivers: reset: stih416: add softreset controller
  drivers: reset: stih415: add softreset controller
  drivers: reset: Reset controller driver for STiH416
  drivers: reset: Reset controller driver for STiH415
  drivers: reset: STi SoC system configuration reset controller support
  dts: socfpga: Add sysmgr node so the gmac can use to reference
  dts: socfpga: Add support for SD/MMC on the SOCFPGA platform
  reset: Add optional resets and stubs
  ARM: shmobile: r7s72100: fix bus clock calculation
  Power: Reset: Generalize qnap-poweroff to work on Synology devices.
  dts: socfpga: Update clock entry to support multiple parents
  ARM: socfpga: Update socfpga_defconfig
  dts: socfpga: Add DTS entry for adding the stmmac glue layer for stmmac.
  net: stmmac: Add SOCFPGA glue driver
  watchdog: orion_wdt: Use %pa to print 'phys_addr_t'
  drivers: cci: Export CCI PMU revision
  ...
2014-04-05 15:37:40 -07:00
Richard Weinberger d1c8b0410b thermal,rcar_thermal: Add dependency on HAS_IOMEM
Commit beeb5a1e (thermal: rcar-thermal: Enable driver compilation with COMPILE_TEST)
broke build on archs wihout io memory.

On archs like S390 or um this driver cannot build nor work.
Make it depend on HAS_IOMEM to bypass build failures.

drivers/thermal/rcar_thermal.c:404: undefined reference to `devm_ioremap_resource'
drivers/thermal/rcar_thermal.c:426: undefined reference to `devm_ioremap_resource'

Signed-off-by: Richard Weinberger <richard@nod.at>
Acked-by: Laurent Pinchart <laurent.pinchart@ideasonboard.com>
Acked-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-03-03 23:15:02 +08:00
Zhang Rui 37d6a82bd9 Thermal: update INT3404 thermal driver help text
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-03-03 23:12:49 +08:00
Andrew Lunn ff1f0018cf drivers: Enable building of Kirkwood drivers for mach-mvebu
With the move of kirkwood into mach-mvebu, drivers Kconfig need
tweeking to allow the kirkwood specific drivers to be built.

Signed-off-by: Andrew Lunn <andrew@lunn.ch>
Acked-by: Arnd Bergmann <arnd@arndb.de>
Acked-by: Mark Brown <broonie@linaro.org>
Acked-by: Kishon Vijay Abraham I <kishon@ti.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Tested-by: Jason Gunthorpe <jgunthorpe@obsidianresearch.com>
Cc: Viresh Kumar <viresh.kumar@linaro.org>
Cc: Rafael J. Wysocki <rjw@rjwysocki.net>
Cc: Richard Purdie <rpurdie@rpsys.net>
Cc: Bryan Wu <cooloney@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Jason Cooper <jason@lakedaemon.net>
2014-02-24 17:28:31 +00:00
Zhang Rui 201531c277 Merge branches 'misc', 'soc', 'soc-eduardo' and 'int3404-thermal' of .git into next 2014-01-02 14:22:28 +08:00
Laurent Pinchart beeb5a1e0e thermal: rcar-thermal: Enable driver compilation with COMPILE_TEST
This helps increasing build testing coverage.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <eduardo.valentin@ti.com>
Cc: linux-pm@vger.kernel.org
Signed-off-by: Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com>
Acked-by: Simon Horman <horms@verge.net.au>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-01-02 10:54:56 +08:00
Srinivas Pandruvada 925c36bb09 Thermal: ACPI INT3403 thermal driver
The ACPI INT3403 device objects present on some systems can be used to retrieve
temperature data from thermal sensors. Add a driver registering each INT3403
device object as a thermal zone device and exposing its _TMP, PATx and GTSH
method via the standard thermal control interface under /sys/class/thermal/.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-01-02 09:42:12 +08:00
Eduardo Valentin 39d99cff76 thermal: cpu_cooling: introduce of_cpufreq_cooling_register
This patch introduces an API to register cpufreq cooling device
based on device tree node.

The registration via device tree node differs from normal
registration due to the fact that it is needed to fill
the device_node structure in order to be able to match
the cooling devices with trip points.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-12-04 09:33:34 -04:00
Eduardo Valentin 4e5e4705bf thermal: introduce device tree parser
This patch introduces a device tree bindings for
describing the hardware thermal behavior and limits.
Also a parser to read and interpret the data and feed
it in the thermal framework is presented.

This patch introduces a thermal data parser for device
tree. The parsed data is used to build thermal zones
and thermal binding parameters. The output data
can then be used to deploy thermal policies.

This patch adds also documentation regarding this
API and how to define tree nodes to use
this infrastructure.

Note that, in order to be able to have control
on the sensor registration on the DT thermal zone,
it was required to allow changing the thermal zone
.get_temp callback. For this reason, this patch
also removes the 'const' modifier from the .ops
field of thermal zone devices.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: Mark Rutland <mark.rutland@arm.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-12-04 09:31:34 -04:00
Linus Torvalds 549608eadb Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management updates from Zhang Rui:
 "This time we only have a few changes as there are no soc thermal
  changes from Eduardo.  The only big change is the introduction of
  TMON, a tool to help visualize, tune, and test the thermal subsystem.
  The rest is mostly cleanups and fixes all over.

  Specifics:

   - introduce TMON, a tool base on thermal sysfs I/F.  It can be used
     to visualize, tune and test the thermal subsystem.

   - fix a zone/cooling device binding problem, when both thermal zone
     bind parameters and .bind() callback are available"

* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux:
  tools/thermal: Introduce tmon, a tool for thermal subsystem
  thermal: Fix binding problem when there is thermal zone params
  thermal: cpu_cooling: fix return value check in cpufreq_cooling_register()
  Thermal: Check for validity before doing kfree
  thermal/intel_powerclamp: Add newer CPU models
  Thermal: Tidy up error handling in powerclamp_init
  thermal: Kconfig: cosmetic fixes
  ACPI/thermal : Remove zone disabled warning
  typo in drivers/thermal/Kconfig: lpatform instead of platform
2013-11-14 14:42:31 +09:00
Viresh Kumar 3bc28ab6da cpufreq: remove CONFIG_CPU_FREQ_TABLE
CONFIG_CPU_FREQ_TABLE will be always enabled when cpufreq framework is used, as
cpufreq core depends on it. So, we don't need this CONFIG option anymore as it
is not configurable. Remove CONFIG_CPU_FREQ_TABLE and update its users.

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2013-10-16 00:50:33 +02:00
Luka Perkov a822794886 thermal: Kconfig: cosmetic fixes
Fix typo, finish sentence and add missing dots.

Signed-off-by: Luka Perkov <luka@openwrt.org>
CC: Randy Dunlap <rdunlap@infradead.org>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-10-09 11:51:43 +08:00
Regid Ichira ece238fe0a typo in drivers/thermal/Kconfig: lpatform instead of platform
Applied to the HEAD of linux.git,
                       VERSION = 3 PATCHLEVEL = 11 SUBLEVEL = 0
Signed-off-by: Regid Ichira <regid23@nt1.in>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-09-25 21:29:00 +08:00
Eduardo Valentin 0dd88793aa thermal: hwmon: move hwmon support to single file
In order to improve code organization, this patch
moves the hwmon sysfs support to a file named
thermal_hwmon. This helps to add extra support
for hwmon without scrambling the code.

In order to do this move, the hwmon list head is now
using its own locking. Before, the list used
the global thermal locking. Also, some minor changes
in the code were required, as recommended by checkpatch.pl.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-09-03 09:09:12 -04:00
Zhang Rui 036e8a13b8 Merge branches 'exynos', 'imx' and 'fixes' of .git into next 2013-08-15 15:25:27 +08:00
Amit Daniel Kachhap c68213780e thermal: exynos: Moving exynos thermal files into samsung directory
This movement of files is done for easy maintenance and adding more
new sensor's support for exynos platform easily . This will also help in
bifurcating exynos common, sensor driver and sensor data related parts.

Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13 09:51:59 -04:00
Shawn Guo ca3de46b50 thermal: add imx thermal driver support
This is based on the initial imx thermal work done by
Rob Lee <rob.lee@linaro.org> (Not sure if the email address is still
valid).  Since he is no longer interested in the work and I have
rewritten a significant amount of the code, I just took the authorship
over from him.

It adds the imx thermal support using Temperature Monitor (TEMPMON)
block found on some Freescale i.MX SoCs.  The driver uses syscon regmap
interface to access TEMPMON control registers and calibration data, and
supports cpufreq as the cooling device.

Signed-off-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13 09:45:34 -04:00
Zhang Rui 9d1968fdab Merge branch 'cpu-package-thermal' of .git into next 2013-06-18 07:26:49 +08:00
Randy Dunlap b3ba020652 thermal: fix x86_pkg_temp_thermal.c build and Kconfig
Fix build error in x86_pkg_temp_thermal.c.  It requires that
X86_MCE & X86_THERMAL_VECTOR be enabled, so depend on the latter symbol,
since it depends on X86_MCE (indirectly).

Also, X86_PKG_TEMP_THERMAL is already inside an "if THERMAL" block,
so remove that duplicated dependency.

ERROR: "platform_thermal_package_rate_control" [drivers/thermal/x86_pkg_temp_thermal.ko] undefined!
ERROR: "platform_thermal_package_notify" [drivers/thermal/x86_pkg_temp_thermal.ko] undefined!

Signed-off-by: Randy Dunlap <rdunlap@infradead.org>
Acked-by: Borislav Petkov <bp@suse.de>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-06-18 07:26:24 +08:00
Zhang Rui f157f5964b Merge branch 'cpu-package-thermal' of .git into next
Conflicts:
	drivers/thermal/Kconfig
	drivers/thermal/Makefile
2013-06-18 06:31:26 +08:00