Commit Graph

48 Commits

Author SHA1 Message Date
Sascha Hauer a92db1c808 thermal: Add Mediatek thermal controller support
This adds support for the Mediatek thermal controller found on MT8173
and likely other SoCs.
The controller is a bit special. It does not have its own ADC, instead
it controls the on-SoC AUXADC via AHB bus accesses. For this reason
we need the physical address of the AUXADC. Also it controls a mux
using AHB bus accesses, so we need the APMIXEDSYS physical address aswell.

Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-02-18 07:20:36 -08:00
Ørjan Eide a76caf55e5 thermal: Add devfreq cooling
Add a generic thermal cooling device for devfreq, that is similar to
cpu_cooling.

The device must use devfreq.  In order to use the power extension of the
cooling device, it must have registered its OPPs using the OPP library.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Ørjan Eide <orjan.eide@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-10-30 10:21:01 -07:00
Tushar Dave d0a12625d2 thermal: Add Intel PCH thermal driver
This change adds a thermal driver for Wildcat Point platform controller
hub. This driver register PCH thermal sensor as a thermal zone and
associate critical and hot trips if present.

Signed-off-by: Tushar Dave <tushar.n.dave@intel.com>
Reviewed-by: Pandruvada, Srinivas <srinivas.pandruvada@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2015-08-04 10:06:08 +08:00
Zhang Rui 111b23cf89 Merge branches 'release' and 'thermal-soc' of .git into next 2015-06-11 12:52:14 +08:00
kongxinwei 9a5238a9c6 thermal: hisilicon: add new hisilicon thermal sensor driver
This patch adds the support for hisilicon thermal sensor, within
hisilicon SoC. there will register sensors for thermal framework
and use device tree to bind cooling device.

Signed-off-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-06-03 15:58:52 -07:00
Javi Merino 6b775e870c thermal: introduce the Power Allocator governor
The power allocator governor is a thermal governor that controls system
and device power allocation to control temperature.  Conceptually, the
implementation divides the sustainable power of a thermal zone among
all the heat sources in that zone.

This governor relies on "power actors", entities that represent heat
sources.  They can report current and maximum power consumption and
can set a given maximum power consumption, usually via a cooling
device.

The governor uses a Proportional Integral Derivative (PID) controller
driven by the temperature of the thermal zone.  The output of the
controller is a power budget that is then allocated to each power
actor that can have bearing on the temperature we are trying to
control.  It decides how much power to give each cooling device based
on the performance they are requesting.  The PID controller ensures
that the total power budget does not exceed the control temperature.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:52 -07:00
Ivan T. Ivanov c610afaa21 thermal: Add QPNP PMIC temperature alarm driver
Add support for the temperature alarm peripheral found inside
Qualcomm plug-and-play (QPNP) PMIC chips. The temperature alarm
peripheral outputs a pulse on an interrupt line whenever the
thermal over temperature stage value changes.

Register a thermal sensor. The temperature reported by this thermal
sensor device should reflect the actual PMIC die temperature if an
ADC is present on the given PMIC. If no ADC is present, then the
reported temperature should be estimated from the over temperature
stage value.

Cc: David Collins <collinsd@codeaurora.org>
Signed-off-by: Ivan T. Ivanov <iivanov@mm-sol.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:51 -07:00
Ong, Boon Leong 8c18769396 thermal: intel Quark SoC X1000 DTS thermal driver
In Intel Quark SoC X1000, there is one on-die digital temperature sensor(DTS).
The DTS offers both hot & critical trip points.

However, in current distribution of UEFI BIOS for Quark platform, only
critical trip point is configured to be 105 degree Celsius (based on Quark
SW ver1.0.1 and hot trip point is not used due to lack of IRQ.

There is no active cooling device for Quark SoC, so Quark SoC thermal
management logic expects Linux distro to orderly power-off when temperature
of the DTS exceeds the configured critical trip point.

Kernel param "polling_delay" in milliseconds is used to control the frequency
the DTS temperature is read by thermal framework. It defaults to 2-second.
To change it, use kernel boot param "intel_quark_dts_thermal.polling_delay=X".

User interacts with Quark SoC DTS thermal driver through sysfs via:
/sys/class/thermal/thermal_zone0/

For example:
 - to read DTS temperature
   $ cat temp
 - to read critical trip point
   $ cat trip_point_0_temp
 - to read trip point type
   $ cat trip_point_0_type
 - to emulate temperature raise to test orderly shutdown by Linux distro
   $ echo 105 > emul_temp

Tested-by: Bryan O'Donoghue <pure.logic@nexus-software.ie>
Signed-off-by: Ong Boon Leong <boon.leong.ong@intel.com>
Reviewed-by: Bryan O'Donoghue <pure.logic@nexus-software.ie>
Reviewed-by: Kweh, Hock Leong <hock.leong.kweh@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2015-05-01 11:20:43 +08:00
Srinivas Pandruvada ee073604db Thermal: Intel SoC: DTS thermal IOSF core
This is becoming a common feature for Intel SoCs to expose the additional
digital temperature sensors (DTSs) using side band interface (IOSF). This
change remove common IOSF DTS handler function from the existing driver
intel_soc_dts_thermal.c and creates a stand alone module, which can
be selected from the SoC specific drivers. In this way there is less
code duplication.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
2015-05-01 11:20:42 +08:00
Caesar Wang cbac8f6394 thermal: rockchip: add driver for thermal
Thermal is TS-ADC Controller module supports
user-defined mode and automatic mode.

User-defined mode refers,TSADC all the control signals entirely by
software writing to register for direct control.

Automaic mode refers to the module automatically poll TSADC output,
and the results were checked.If you find that the temperature High
in a period of time,an interrupt is generated to the processor
down-measures taken;If the temperature over a period of time High,
the resulting TSHUT gave CRU module,let it reset the entire chip,
or via GPIO give PMIC.

Signed-off-by: zhaoyifeng <zyf@rock-chips.com>
Signed-off-by: Caesar Wang <caesar.wang@rock-chips.com>
Reviewed-by: Dmitry Torokhov <dmitry.torokhov@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-11-24 14:35:07 -04:00
Mikko Perttunen 66fb848051 thermal: Add Tegra SOCTHERM thermal management driver
This adds support for the Tegra SOCTHERM thermal sensing and management
system found in the Tegra124 system-on-chip. This initial driver supports
temperature polling for four thermal zones.

Signed-off-by: Mikko Perttunen <mperttunen@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-11-20 10:43:17 -04:00
Eduardo Valentin f9df89d897 thermal: introduce clock cooling device
This patch introduces a new thermal cooling device based on common clock
framework. The original motivation to write this cooling device is to be
able to cool down thermal zones using clocks that feed co-processors, such
as GPUs, DSPs, Image Processing Co-processors, etc. But it is written
in a way that it can be used on top of any clock.

The implementation is pretty straight forward. The code creates
a thermal cooling device based on a pair of a struct device and a clock name.
The struct device is assumed to be usable by the OPP layer. The OPP layer
is used as source of the list of possible frequencies. The (cpufreq) frequency
table is then used as a map from frequencies to cooling states. Cooling
states are indexes to the frequency table.

The logic sits on top of common clock framework, specifically on clock
pre notifications. Any PRE_RATE_CHANGE is hijacked, and the transition is
only allowed when the new rate is within the thermal limit (cooling state -> freq).

When a thermal cooling device state transition is requested, the clock
is also checked to verify if the current clock rate is within the new
thermal limit.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Mike Turquette <mturquette@linaro.org>
Cc: Nishanth Menon <nm@ti.com>
Cc: Pavel Machek <pavel@ucw.cz>
Cc: "Rafael J. Wysocki" <rjw@sisk.pl>
Cc: Len Brown <len.brown@intel.com>
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: linux-pm@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-11-20 10:43:16 -04:00
Zhang Rui 6ceaf58abe Merge branch 'int340x-thermal' of .git into next 2014-10-17 14:30:58 +08:00
Lan Tianyu 4384b8fe16 Thermal: introduce int3403 thermal driver
ACPI INT3403 device object can be used to retrieve temperature date
from temperature sensors present in the system, and to expose
device' performance control.

The previous INT3403 thermal driver supports temperature reporting only,
thus remove it and introduce this new & enhanced one.

Signed-off-by: Lan Tianyu <tianyu.lan@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-10-11 09:35:36 +08:00
Zhang Rui 816cab931f Thermal: introduce int3400 thermal driver
Introduce int3400 thermal driver. And make INT3400 driver
enumerate the other int340x thermal components shown in _ART/_TRT.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-10-10 13:57:09 +08:00
Peter Feuerer e4dbf98f7f thermal: Added Bang-bang thermal governor
The bang-bang thermal governor uses a hysteresis to switch abruptly on
or off a cooling device.  It is intended to control fans, which can
not be throttled but just switched on or off.
Bang-bang cannot be set as default governor as it is intended for
special devices only.  For those special devices the driver needs to
explicitely request it.

Cc: Andrew Morton <akpm@linux-foundation.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Andreas Mohr <andi@lisas.de>
Cc: Borislav Petkov <bp@suse.de>
Cc: Javi Merino <javi.merino@arm.com>
Cc: linux-pm@vger.kernel.org
Signed-off-by: Peter Feuerer <peter@piie.net>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-08-27 15:45:58 +08:00
Lee Jones 60aef7ce45 thermal: sti: Introduce ST Thermal core code
This core is shared by both ST's 'memory mapped' and
'system configuration register' based Thermal controllers.

Signed-off-by: Ajit Pal Singh <ajitpal.singh@st.com>
Signed-off-by: Lee Jones <lee.jones@linaro.org>
Acked-by: Pavel Machek <pavel@ucw.cz>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-07-15 22:01:22 +08:00
Srinivas Pandruvada bc40b5e320 thermal: Intel SoC DTS thermal
In the Intel SoCs like Bay Trail, there are 2 additional digital temperature
sensors(DTS), in addition to the standard DTSs in the core. Also they support
4 programmable thresholds, out of which two can be used by OSPM. These
thresholds can be used by OSPM thermal control. Out of these two thresholds,
one is used by driver and one user mode can change via thermal sysfs to get
notifications on threshold violations.

The driver defines one critical trip points, which is set to TJ MAX - offset.
The offset can be changed via module parameter (default 5C). Also it uses
one of the thresholds to get notification for this temperature violation.
This is very important for orderly shutdown as the many of these devices don't
have ACPI thermal zone, and expects that there is some other thermal control
mechanism present in OSPM. When a Linux distro is used without additional
specialized thermal control program, BIOS can do force shutdown when thermals
are not under control. When temperature reaches critical, the Linux thermal
core will initiate an orderly shutdown.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-05-15 16:37:24 +08:00
Zhang Rui 201531c277 Merge branches 'misc', 'soc', 'soc-eduardo' and 'int3404-thermal' of .git into next 2014-01-02 14:22:28 +08:00
Srinivas Pandruvada 925c36bb09 Thermal: ACPI INT3403 thermal driver
The ACPI INT3403 device objects present on some systems can be used to retrieve
temperature data from thermal sensors. Add a driver registering each INT3403
device object as a thermal zone device and exposing its _TMP, PATx and GTSH
method via the standard thermal control interface under /sys/class/thermal/.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-01-02 09:42:12 +08:00
Eduardo Valentin 4e5e4705bf thermal: introduce device tree parser
This patch introduces a device tree bindings for
describing the hardware thermal behavior and limits.
Also a parser to read and interpret the data and feed
it in the thermal framework is presented.

This patch introduces a thermal data parser for device
tree. The parsed data is used to build thermal zones
and thermal binding parameters. The output data
can then be used to deploy thermal policies.

This patch adds also documentation regarding this
API and how to define tree nodes to use
this infrastructure.

Note that, in order to be able to have control
on the sensor registration on the DT thermal zone,
it was required to allow changing the thermal zone
.get_temp callback. For this reason, this patch
also removes the 'const' modifier from the .ops
field of thermal zone devices.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: Mark Rutland <mark.rutland@arm.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-12-04 09:31:34 -04:00
Eduardo Valentin 0dd88793aa thermal: hwmon: move hwmon support to single file
In order to improve code organization, this patch
moves the hwmon sysfs support to a file named
thermal_hwmon. This helps to add extra support
for hwmon without scrambling the code.

In order to do this move, the hwmon list head is now
using its own locking. Before, the list used
the global thermal locking. Also, some minor changes
in the code were required, as recommended by checkpatch.pl.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-09-03 09:09:12 -04:00
Zhang Rui 036e8a13b8 Merge branches 'exynos', 'imx' and 'fixes' of .git into next 2013-08-15 15:25:27 +08:00
Amit Daniel Kachhap c68213780e thermal: exynos: Moving exynos thermal files into samsung directory
This movement of files is done for easy maintenance and adding more
new sensor's support for exynos platform easily . This will also help in
bifurcating exynos common, sensor driver and sensor data related parts.

Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13 09:51:59 -04:00
Shawn Guo ca3de46b50 thermal: add imx thermal driver support
This is based on the initial imx thermal work done by
Rob Lee <rob.lee@linaro.org> (Not sure if the email address is still
valid).  Since he is no longer interested in the work and I have
rewritten a significant amount of the code, I just took the authorship
over from him.

It adds the imx thermal support using Temperature Monitor (TEMPMON)
block found on some Freescale i.MX SoCs.  The driver uses syscon regmap
interface to access TEMPMON control registers and calibration data, and
supports cpufreq as the cooling device.

Signed-off-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13 09:45:34 -04:00
Zhang Rui f157f5964b Merge branch 'cpu-package-thermal' of .git into next
Conflicts:
	drivers/thermal/Kconfig
	drivers/thermal/Makefile
2013-06-18 06:31:26 +08:00
Srinivas Pandruvada f1a18a1056 Thermal: CPU Package temperature thermal
This driver register CPU digital temperature sensor as a thermal
zone at package level.
Each package will show up as one zone with at max two trip points.
These trip points can be both read and updated. Once a non zero
value is set in the trip point, if the package package temperature
goes above or below this setting, a thermal notification is
generated.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-06-18 06:27:47 +08:00
Eduardo Valentin eb982001db thermal: introduce TI SoC thermal driver
This patch moves the ti-soc-thermal driver out of
the staging tree to the thermal tree.

Cc: Grant Likely <grant.likely@linaro.org>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: Rob Landley <rob@landley.net>
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <eduardo.valentin@ti.com>
Cc: J Keerthy <j-keerthy@ti.com>
Cc: Radhesh Fadnis <radhesh.fadnis@ti.com>
Cc: Cyril Roelandt <tipecaml@gmail.com>
Cc: devicetree-discuss@lists.ozlabs.org
Cc: linux-doc@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: devel@driverdev.osuosl.org
Cc: linux-pm@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-05-28 10:40:37 +08:00
Zhang Rui bbf7fc88c7 Thermal: build cpu_cooling code into thermal_sys module
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
2013-04-14 23:28:49 +08:00
Zhang Rui 80a26a5c22 Thermal: build thermal governors into thermal_sys module
The thermal governors are part of the thermal framework,
rather than a seperate feature/module.
Because the generic thermal layer can not work without
thermal governors, and it must load the thermal governors
during its initialization.

Build them into one module in this patch.

This also fix a problem that the generic thermal layer does not
work when CONFIG_THERMAL=m and CONFIG_THERMAL_GOV_XXX=y.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
2013-04-14 23:28:43 +08:00
Zhang Rui 5fc024ab47 Thermal: rename thermal_sys.c to thermal_core.c
this is the preparation work to build all the thermal core framework
source file, like governors, cpu cooling, etc, into one module.

No functional change in this patch.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
2013-04-14 02:14:12 +08:00
Ezequiel Garcia fa0d654c84 thermal: Add driver for Armada 370/XP SoC thermal management
This driver supports both Armada 370 and Armada XP SoC
thermal management controllers.

Armada 370 has a register to check a valid temperature, whereas
Armada XP does not. Each has a different initialization (i.e. calibration)
function. The temperature conversion formula is the same for both.

The controller present in each SoC have a very similar feature set,
so it corresponds to have one driver to support both of them.

Although this driver may present similarities to Dove and Kirkwood
thermal driver, the exact differences and coincidences are not fully
known. For this reason, support is given through a separate driver.

Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-02 21:04:09 +08:00
Zhang Rui 9d185d0417 Thermal: rename thermal governor Kconfig option to avoid generic naming
Currently, we have three Kconfig options for thermal governors, aka,
CONFIG_FAIR_SHARE, CONFIG_USER_SPACE and CONFIG_STEP_WISE.
But these names are too generic that may bring confusion to users.

Rename them to CONFIG_THERMAL_GOV_FAIR_SHARE,
CONFIG_THERMAL_GOV_USER_SPACE, CONFIG_THERMAL_GOV_STEP_WISE
to avoid the generic naming.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08 20:33:42 +08:00
Andrew Lunn 74ffa64c23 Thermal: Dove: Add Themal sensor support for Dove.
The Marvell Dove SoC has a thermal sensor. Add a driver using the
thermal framework.

Signed-off-by: Andrew Lunn <andrew@lunn.ch>
Signed-off-by: Sebastian Hesselbarth <sebastian.hesselbarth@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08 20:26:02 +08:00
Nobuhiro Iwamatsu 7060aa3664 thermal: Add support for the thermal sensor on Kirkwood SoCs
This patch adds support for Kirkwood 88F6282 and 88F6283 thermal sensor.

Signed-off-by: Nobuhiro Iwamatsu <iwamatsu@nigauri.org>
Signed-off-by: Andrew Lunn <andrew@lunn.ch>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08 20:25:56 +08:00
Jacob Pan d6d71ee4a1 PM: Introduce Intel PowerClamp Driver
Intel PowerClamp driver performs synchronized idle injection across
all online CPUs. The goal is to maintain a given package level C-state
ratio.

Compared to other throttling methods already exist in the kernel,
such as ACPI PAD (taking CPUs offline) and clock modulation, this is often
more efficient in terms of performance per watt.

Please refer to Documentation/thermal/intel_powerclamp.txt for more details.

Signed-off-by: Arjan van de Ven <arjan@linux.intel.com>
Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-06 13:45:00 +08:00
hongbo.zhang aa1acb0451 Thermal: Add ST-Ericsson DB8500 thermal driver.
This driver is based on the thermal management framework in thermal_sys.c. A
thermal zone device is created with the trip points to which cooling devices
can be bound, the current cooling device is cpufreq, e.g. CPU frequency is
clipped down to cool the CPU, and other cooling devices can be added and bound
to the trip points dynamically.  The platform specific PRCMU interrupts are
used to active thermal update when trip points are reached.

Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com>
Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 20:50:34 +08:00
Zhang Rui 445110e9d0 drivers/thermal/Makefile refactor
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 20:41:47 +08:00
Durgadoss R 1cc807a234 Thermal: Add a thermal notifier for user space
This patch registers a governor which will let the
user land manage the platform thermals. Whenever a
trip happens, this governor just notifies the user
space using kobj_uevent().

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:08 +08:00
Durgadoss R e151a202a0 Thermal: Introduce a step_wise thermal governor
This patch adds a simple step_wise governor to the
generic thermal layer. This algorithm throttles the
cooling devices in a linear fashion. If the 'trend'
is heating, it throttles by one step. And if the
thermal trend is cooling it de-throttles by one step.

This actually moves the throttling logic from thermal_sys.c
and puts inside step_wise.c, without any change.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:07 +08:00
Durgadoss R 4ccc5743ae Thermal: Introduce fair_share thermal governor
This patch introduces a simple 'weight' based
governor named fair_share governor. Whenever the
thermal framework gets notified of the trip point
violation, this governor (if configured), throttles
the cooling devices associated with a thermal zone.

This mapping between a thermal zone and a cooling device
and the effectiveness of cooling are provided in the
platform layer.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:07 +08:00
Amit Daniel Kachhap c48cbba6fe hwmon: exynos4: move thermal sensor driver to driver/thermal directory
This movement is needed because the hwmon entries and corresponding sysfs
interface is a duplicate of utilities already provided by
driver/thermal/thermal_sys.c.  The goal is to place it in thermal folder
and add necessary functions to use the in-kernel thermal interfaces.

Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:38 +08:00
Amit Daniel Kachhap 0236141837 thermal: add generic cpufreq cooling implementation
This patchset introduces a new generic cooling device based on cpufreq
that can be used on non-ACPI platforms.  As a proof of concept, we have
drivers for the following platforms using this mechanism now:

 * Samsung Exynos (Exynos4 and Exynos5) in the current patchset.
 * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal)

There is a small change in cpufreq cooling registration APIs, so a minor
change is needed for Freescale platforms.

Brief Description:

1) The generic cooling devices code is placed inside driver/thermal/*
   as placing inside acpi folder will need un-necessary enabling of acpi
   code.  This code is architecture independent.

2) This patchset adds generic cpu cooling low level implementation
   through frequency clipping.  In future, other cpu related cooling
   devices may be added here.  An ACPI version of this already exists
   (drivers/acpi/processor_thermal.c) .But this will be useful for
   platforms like ARM using the generic thermal interface along with the
   generic cpu cooling devices.  The cooling device registration API's
   return cooling device pointers which can be easily binded with the
   thermal zone trip points.  The important APIs exposed are,

   a) struct thermal_cooling_device *cpufreq_cooling_register(
        struct cpumask *clip_cpus)
   b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)

3) Samsung exynos platform thermal implementation is done using the
   generic cpu cooling APIs and the new trip type.  The temperature sensor
   driver present in the hwmon folder(registered as hwmon driver) is moved
   to thermal folder and registered as a thermal driver.

A simple data/control flow diagrams is shown below,

Core Linux thermal <----->  Exynos thermal interface <----- Temperature Sensor
          |                             |
         \|/                            |
  Cpufreq cooling device <---------------

TODO:
*Will send the DT enablement patches later after the driver is merged.

This patch:

Add support for generic cpu thermal cooling low level implementations
using frequency scaling up/down based on the registration parameters.
Different cpu related cooling devices can be registered by the user and
the binding of these cooling devices to the corresponding trip points can
be easily done as the registration APIs return the cooling device pointer.
The user of these APIs are responsible for passing clipping frequency .
The drivers can also register to recieve notification about any cooling
action called.

[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Cc: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:38 +08:00
Kuninori Morimoto 1e426ffddf thermal: add Renesas R-Car thermal sensor support
This patch add basic Renesas R-Car thermal sensor support.
It was tested on R-Car H1 Marzen board.

Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Cc: Len Brown <len.brown@intel.com>
Cc: Joe Perches <joe@perches.com>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: Magnus Damm <magnus.damm@gmail.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:37 +08:00
Vincenzo Frascino 6a92c36688 thermal: add support for thermal sensor present on SPEAr13xx machines
ST's SPEAr13xx machines are based on CortexA9 ARM processors.  These
machines contain a thermal sensor for junction temperature monitoring.

This patch adds support for this thermal sensor in existing thermal
framework.

[akpm@linux-foundation.org: little code cleanup]
[akpm@linux-foundation.org: print the pointer correctly]
[viresh.kumar@st.com: thermal/spear_thermal: add compilation dependency on PLAT_SPEAR]
Signed-off-by: Vincenzo Frascino <vincenzo.frascino@st.com>
Signed-off-by: Viresh Kumar <viresh.kumar@st.com>
Signed-off-by: Viresh Kumar <viresh.kumar@st.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-22 01:05:32 -04:00
Len Brown ff16cab69b thermal: re-name thermal.c to thermal_sys.c
thermal_sys was already the name of the resulting module,
and it is built from  this one source file.

Signed-off-by: Len Brown <len.brown@intel.com>
2008-04-29 03:12:17 -04:00
Zhang Rui 63c4ec905d thermal: add the support for building the generic thermal as a module
Build the generic thermal driver as module "thermal_sys".

Make ACPI thermal, video, processor and fan SELECT the generic
thermal driver, as these drivers rely on it to build the sysfs I/F.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Jean Delvare <khali@linux-fr.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2008-04-29 02:44:00 -04:00
Zhang Rui 203d3d4aa4 the generic thermal sysfs driver
The Generic Thermal sysfs driver for thermal management.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Thomas Sujith <sujith.thomas@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
2008-02-01 23:12:19 -05:00