Commit Graph

5 Commits

Author SHA1 Message Date
Felipe Balbi f7ec94370f usb: musb: pass platform_ops via platform_data
... then we don't need to export any symbols
from glue layer to musb_core.

Signed-off-by: Felipe Balbi <balbi@ti.com>
2010-12-10 10:21:23 +02:00
Felipe Balbi e6480faa10 usb: musb: da8xx: give it a context structure
that structure currently only holds a device
pointer to our own platform_device and musb's
platform_device, but soon it will hold pointers
to our clock structures and glue-specific bits
and pieces.

Signed-off-by: Felipe Balbi <balbi@ti.com>
2010-12-10 10:21:21 +02:00
Felipe Balbi 8ceae51ed5 usb: musb: split da8xx to its own platform_driver
Just adding its own platform_driver, not really
using it yet.

When all HW glue layers are converted, more patches
will come to split power management code from musb_core
and move it completely to HW glue layer.

Signed-off-by: Felipe Balbi <balbi@ti.com>
2010-12-10 10:21:16 +02:00
Felipe Balbi 743411b3f3 usb: musb: make all glue layer export struct musb_platform_ops
preparing to a big refactor on musb code. We need
to be able to compile in all glue layers (or at
least all ARM-based ones) together and have a
working binary.

While preparing for that, we move every glue
layer to export only one symbol, which is
a struct musb_platform_ops, and make all
other functions static.

Later patches will come to allow for compiling
all glue layers together and have a working
binary.

Signed-off-by: Felipe Balbi <balbi@ti.com>
2010-12-07 09:19:39 +02:00
Sergei Shtylyov 3ee076dea6 usb: musb: introduce DA8xx/OMAP-L1x glue layer
Texas Instruments DA8xx/OMAP-L1x glue layer for the
MUSBMHRDC driver.

Signed-off-by: Sergei Shtylyov <sshtylyov@ru.mvista.com>
Signed-off-by: Yadviga Grigorieva <yadviga@ru.mvista.com>
Signed-off-by: Felipe Balbi <balbi@ti.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>
2010-10-22 10:21:52 -07:00