Commit Graph

406 Commits

Author SHA1 Message Date
Eduardo Valentin 67d0b2a826 thermal: cpu_cooling: remove unused symbols
The list is not needed so far. Thus removing it.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25 00:34:44 +08:00
Eduardo Valentin 2d9bf71c12 thermal: cpu_cooling: remove not needed curl brackets
Just for style purposes, remove extra curl brackets.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25 00:34:43 +08:00
Eduardo Valentin 99871a714b thermal: cpu_cooling: use snprintf instead of sprintf
Limit the amount of bytes written to dev_name by
secure writing with snprintf.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25 00:34:43 +08:00
Eduardo Valentin 135266b4ea thermal: cpu_cooling: update kernel-doc comment for cpufreq_cooling_unregister
Update comments for this exported function.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25 00:34:42 +08:00
Eduardo Valentin 12cb08ba50 thermal: cpu_cooling: update kernel-doc for cpufreq_cooling_register
Add proper documentation for exported function cpufreq_cooling_register.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25 00:34:42 +08:00
Eduardo Valentin 56e05fdb6d thermal: cpu_cooling: update documentation for cpufreq_set_cur_state
Update documentation for cpufreq_set_cur_state callback.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25 00:34:42 +08:00
Eduardo Valentin 3672552dc0 thermal: cpu_cooling: update documentation for cpufreq_get_cur_state
Update documentation for cpufreq_get_cur_state callback.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25 00:34:41 +08:00
Eduardo Valentin 62c00421b3 thermal: cpu_cooling: update documentation for cpufreq_get_max_state
Update documentation for cpufreq_get_max_state callback.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25 00:34:41 +08:00
Eduardo Valentin f7188b3dde thermal: cpu_cooling: update Kconfig entry
There is no support for hotplug or any other means of reducing
temperature. So, this patch removes these references from Kconfig.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25 00:34:40 +08:00
Eduardo Valentin bab3055472 thermal: cpu_cooling: update documentation for cpufreq_thermal_notifier
Update kernel-doc comment and documentation for cpufreq_thermal_notifier.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25 00:34:40 +08:00
Eduardo Valentin 4b33deb547 thermal: cpu_cooling: update documentation for cpufreq_apply_cooling
Update kernel-doc comments for cpufreq_apply_cooling function.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25 00:34:39 +08:00
Eduardo Valentin 41518c41dd thermal: cpu_cooling: improve documentation for get_cpu_frequency
Fix kernel-doc warning on get_cpu_frequency and improve
documentation comments.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25 00:34:39 +08:00
Eduardo Valentin 44952d338a thermal: cpu_cooling: document cpufreq_get_cooling_level
Add documentation for cpufreq_get_cooling_level. As this
is an exported function, it has to be documented.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25 00:34:38 +08:00
Eduardo Valentin 2d6f28fedc thermal: cpu_cooling: add documentation for get_property
As this is one of the central functions of this file,
it deserves a proper documentation. This patch improves
the existing comment to format it as a kernel-doc style.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25 00:34:38 +08:00
Eduardo Valentin 82b9ee402f thermal: cpu_cooling: fix kernel doc for is_cpufreq_valid
Update documentation for is_cpufreq_valid function so
that kernel-doc does not complain about return value.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25 00:34:38 +08:00
Eduardo Valentin 4469b99743 thermal: cpu_cooling: remove compiler warning
level will be used only if GET_FREQ mode is requested.
There is no potential harm with current code. But for
cleaning the compilation log, this patch initializes
level to zero.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25 00:34:37 +08:00
Eduardo Valentin 243dbd9c60 thermal: cpu_cooling: use EXPORT_SYMBOL_GPL
Restrict the usage to GPL modules.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25 00:34:37 +08:00
Eduardo Valentin 3b3c074855 thermal: cpu_cooling: fix kernel_doc for cpufreq_cooling_device
Simple fixes for making kernel_doc happy about
struct cpufreq_cooling_device. Includes also a minor
spelling fix.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25 00:34:36 +08:00
Eduardo Valentin 25c52afe1c thermal: cpu_cooling: remove unused headers
Remove some unused header files.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25 00:33:58 +08:00
Zhang Rui a502be1873 Merge branch 'exynos-fix' of .git into next 2013-04-25 00:04:06 +08:00
Sachin Kamat b6cee53c19 Thermal: exynos: Add compatible string for exynos4412
Added compatible string for Exynos4412 SoC.

Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Cc: Amit Daniel Kachhap <amit.daniel@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24 23:37:34 +08:00
Sachin Kamat 2a16279c68 Thermal: exynos: Add clk_{un}prepare APIs
clk_{un}prepare APIs are required to migrate to common
clock framework. While at it convert to use devm_clk_get as
it removes some cleanup code.

Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Cc: Amit Daniel Kachhap <amit.daniel@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-24 23:37:19 +08:00
Zhang Rui 335553ce40 Merge branch 'eduardo-1' of .git into next 2013-04-24 21:43:00 +08:00
Dan Carpenter 4f89038f17 Thermal: cpufreq cooling: endian bug in cpufreq_get_max_state()
This code doesn't work on big endian systems because we're storing low
values in the high bits of the unsigned long.  It makes it a very high
value instead.

Signed-off-by: Dan Carpenter <dan.carpenter@oracle.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-17 23:43:31 +08:00
Eduardo Valentin 837b26bb2e thermal: expose thermal_zone_get_temp API
This patch exports the thermal_zone_get_temp API so that driver
writers can fetch temperature of thermal zones managed by other
drivers.

Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-15 09:39:02 +08:00
Eduardo Valentin 63c4d919cf thermal: introduce thermal_zone_get_zone_by_name helper function
This patch adds a helper function to get a reference of
a thermal zone, based on the zone type name.

It will perform a zone name lookup and return a reference
to a thermal zone device that matches the name requested.
In case the zone is not found or when several zones match
same name or if the required parameters are invalid, it will return
the corresponding error code (ERR_PTR).

Cc: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-15 09:34:28 +08:00
Zhang Rui d13cb03aef Merge branch 'thermal' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux into next
Conflicts:
	drivers/thermal/cpu_cooling.c
2013-04-15 09:26:58 +08:00
Zhang Rui bbf7fc88c7 Thermal: build cpu_cooling code into thermal_sys module
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
2013-04-14 23:28:49 +08:00
Zhang Rui 80a26a5c22 Thermal: build thermal governors into thermal_sys module
The thermal governors are part of the thermal framework,
rather than a seperate feature/module.
Because the generic thermal layer can not work without
thermal governors, and it must load the thermal governors
during its initialization.

Build them into one module in this patch.

This also fix a problem that the generic thermal layer does not
work when CONFIG_THERMAL=m and CONFIG_THERMAL_GOV_XXX=y.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
2013-04-14 23:28:43 +08:00
Zhang Rui 5fc024ab47 Thermal: rename thermal_sys.c to thermal_core.c
this is the preparation work to build all the thermal core framework
source file, like governors, cpu cooling, etc, into one module.

No functional change in this patch.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
2013-04-14 02:14:12 +08:00
Arnd Bergmann 841d481b3c Thermal: exynos: remove unnecessary header inclusions
In multiplatform configurations, we cannot include headers
provided by only the exynos platform. Fortunately a number
of drivers that include those headers do not actually need
them, so we can just remove the inclusions.

Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Cc: linux-pm@vger.kernel.org
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-12 07:24:19 +08:00
Andrew Bresticker e79fe642cc thermal: step_wise: set throttle target within thermal instance limits
When selecting a target cooling state in get_target_state(), make sure
that the state is at least as high as the minimum when the temperature
is rising and at least as low as the maximum when the temperature is
falling.  This is necessary because, in the THREAML_TREND_RAISING and
THERMAL_TREND_DROPPING cases, the current state may only be incremented
or decremented by one even if it is outside the bounds of the thermal
instance.  This might occur, for example, if the CPU is heating up
and hits a thermal trip point for the first time when it's frequency
is much higher than the range specified by the thermal instance
corresponding to the trip point.

Signed-off-by: Andrew Bresticker <abrestic@chromium.org>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-12 07:23:50 +08:00
Eduardo Valentin 8837295a73 thermal: add a warning for temperature emulation feature
Because this feature is for debuging purposes, it is highly
recommended to do not enable this on production systems.
This patch adds warnings for system integrators, so that
people are aware of this potential security issue.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-02 21:34:42 +08:00
Amit Daniel Kachhap bffd1f8ac8 thermal: exynos: Adapt to temperature emulation core thermal framework
This removes the driver specific sysfs support of the temperature
emulation and uses the newly added core thermal framework for thermal
emulation. An exynos platform specific handler is added to support this.

In this patch, the exynos senor(tmu) related code and exynos framework
related (thermal zone, cooling devices) code are intentionally kept separate.
So an emulated function pointer is passed from sensor to framework. This is
beneficial in adding more sensor support using the same framework code
which is an ongoing work. The goal is to finally split them totally. Even
the existing read_temperature also follows the same execution method.

Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-02 21:29:54 +08:00
Kuninori Morimoto 51d45d2594 thermal: rcar: add pm_runtime_xxx() support
Current rcar_thermal() didn't care about own power.
Without this patch, rcar_thermal doesn't work on APE6 board

Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-02 21:18:39 +08:00
Kuninori Morimoto 1dc20828e6 thermal: rcar: tidyup registration failure case
Current rcar_thermal driver didn't care about rcar_theraml_irq_disable()
when registration failure case on _probe(), and _remove().
And, it returns without unregistering thermal zone when
registration failure case on _probe().
This patch fixes these issue.

Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-02 21:15:04 +08:00
Ezequiel Garcia fa0d654c84 thermal: Add driver for Armada 370/XP SoC thermal management
This driver supports both Armada 370 and Armada XP SoC
thermal management controllers.

Armada 370 has a register to check a valid temperature, whereas
Armada XP does not. Each has a different initialization (i.e. calibration)
function. The temperature conversion formula is the same for both.

The controller present in each SoC have a very similar feature set,
so it corresponds to have one driver to support both of them.

Although this driver may present similarities to Dove and Kirkwood
thermal driver, the exact differences and coincidences are not fully
known. For this reason, support is given through a separate driver.

Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-02 21:04:09 +08:00
Ezequiel Garcia 2fd1db8819 thermal: dove: Fix thermal sensor formula
The currently formula has been taken from the 88AP510 SoC datasheet,
which is not exactly correct. The correct value for the temperature
in Celcius of the sensor present in this SoC is:

  Celsius = (322-reg)/1.3625

Signed-off-by: Lior Amsalem <alior@marvell.com>
Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com>
Acked-by: Andrew Lunn <andrew@lunn.ch>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-03-26 22:13:10 +08:00
Ezequiel Garcia 696b6075af thermal: kirkwood: Fix thermal sensor formula
The currently formula has been taken from the 88AP510 SoC datasheet,
which is not exactly correct. The correct value for the temperature
in Celcius of the sensor present in this SoC is:

  Celsius = (322-reg)/1.3625

Signed-off-by: Lior Amsalem <alior@marvell.com>
Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com>
Acked-by: Andrew Lunn <andrew@lunn.ch>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-03-26 22:12:20 +08:00
Ezequiel Garcia 02519d3397 thermal: kirkwood: Fix valid check for thermal register
The correct value is obtain by first shifting the register by the offset,
later applying the valid mask and finally invert the result.
This check was lacking an extra parenthesis to be strictly correct.

Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-03-26 22:09:14 +08:00
Axel Lin 4c7fa83aa5 thermal: db8500: Fix missing mutex_unlock() in probe error paths
Signed-off-by: Axel Lin <axel.lin@ingics.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-03-26 22:08:08 +08:00
Axel Lin f534e9bf80 thermal: db8500: Fix checking return value of thermal_zone_device_register
thermal_zone_device_register() returns ERR_PTR on error, thus use
IS_ERR rather than IS_ERR_OR_NULL to check return value.

Signed-off-by: Axel Lin <axel.lin@ingics.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-03-26 22:07:52 +08:00
Laurent Navet [Mali] bde0066309 drivers: thermal: cpu_cooling: fix checkpatch warning
- WARNING: Avoid CamelCase: <maskPtr>

Signed-off-by: Laurent Navet <laurent.navet@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-03-26 17:26:19 +08:00
Zhang Rui 57df810693 Thermal: exynos: fix cooling state translation
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Tested-by: Amit Daniel kachhap <amit.daniel@samsung.com>
2013-03-26 14:33:50 +08:00
Zhang Rui fc35b35cbe Thermal: cpufreq cooling: fix parsing per_cpu cpufreq_frequency_table
cpufreq cooling uses different frequencies as different cooling states.

But the per_cpu cpufreq_frequency_table may contain duplicate,
invalid entries, and it may be in either ascending or descending order.
And currently, code for parsing the per_cpu cpufreq_frequency_table
is used in several places and inconsistent.

Now introduce new code to
1. get the maximum cooling states
2. translate cooling state to cpu frequency
3. translate cpu frequency to cooling state
in one place,
with the correct logic of handling per_cpu cpufreq_frequency_table.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Tested-by: Amit Daniel kachhap <amit.daniel@samsung.com>
2013-03-26 14:33:43 +08:00
Devendra Naga 043e4652bf thermal: exynos_thermal: return a proper error code while thermal_zone_device_register fail.
we are returning EINVAL while the thermal_zone_device_register function fail.
instead we can use the return value from the thermal_zone_device_register by
using PTR_ERR.

Signed-off-by: Devendra Naga <devendra.aaru@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-03-11 23:09:29 +08:00
Devendra Naga fb84d9907f thermal: rcar_thermal: propagate return value of thermal_zone_device_register
thermal_zone_device_register returns a value contained in the pointer itself
use PTR_ERR to obtain the address and return it at the end.

Signed-off-by: Devendra Naga <devendra.aaru@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-03-11 23:09:24 +08:00
Sachin Kamat aa3b5d222d Thermal: kirkwood: Convert to devm_ioremap_resource()
Use the newly introduced devm_ioremap_resource() instead of
devm_request_and_ioremap() which provides more consistent error handling.

devm_ioremap_resource() provides its own error messages; so all explicit
error messages can be removed from the failure code paths.

Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Cc: Nobuhiro Iwamatsu <iwamatsu@nigauri.org>
Reviewed-by: Thierry Reding <thierry.reding@avionic-design.de>
Acked-by: Nobuhiro Iwamatsu <iwamatsu@nigauri.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-03-11 23:09:18 +08:00
Sachin Kamat 5095526faf Thermal: rcar: Convert to devm_ioremap_resource()
Use the newly introduced devm_ioremap_resource() instead of
devm_request_and_ioremap() which provides more consistent error handling.

devm_ioremap_resource() provides its own error messages; so all explicit
error messages can be removed from the failure code paths.

Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Cc: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Reviewed-by: Thierry Reding <thierry.reding@avionic-design.de>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-03-11 23:09:12 +08:00
Sachin Kamat 6bc51b6622 Thermal: dove: Convert to devm_ioremap_resource()
Use the newly introduced devm_ioremap_resource() instead of
devm_request_and_ioremap() which provides more consistent error handling.

devm_ioremap_resource() provides its own error messages; so all explicit
error messages can be removed from the failure code paths.

Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Cc: Andrew Lunn <andrew@lunn.ch>
Reviewed-by: Thierry Reding <thierry.reding@avionic-design.de>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-03-11 23:09:02 +08:00
Wei Yongjun f0e68fc3ca thermal: rcar: fix missing unlock on error in rcar_thermal_update_temp()
Add the missing unlock before return from function rcar_thermal_update_temp()
in the error handling case.

Signed-off-by: Wei Yongjun <yongjun_wei@trendmicro.com.cn>
Acked-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-03-11 23:08:33 +08:00
Linus Torvalds 19cc90f58d Fix mis-merge of intel_powerclamp.c resulting in compile error
The new intel_powerclamp thermal cooling device driver was merged in
commit 2af78448ff (Pull thermal management updates from Zhang Rui)
without any data conflicts.  But there was a more subtle conflict I
missed: the driver uses MAX_USER_RT_PRIO, but commit 8bd75c77b7
("sched/rt: Move rt specific bits into new header file") had moved that
define from <linux/sched.h> to <linux/sched/rt.h>.

Which caused this build failure:

  drivers/thermal/intel_powerclamp.c: In function ‘clamp_thread’:
  drivers/thermal/intel_powerclamp.c:360:21: error: ‘MAX_USER_RT_PRIO’ undeclared (first use in this function)
  drivers/thermal/intel_powerclamp.c:360:21: note: each undeclared identifier is reported only once for each function it appears in

And because I don't do a full "make allmodconfig" build after each pull,
I didn't notice until too late.  So now the fix is here, separately from
the merge commit.

Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
2013-02-28 20:23:09 -08:00
Linus Torvalds 2af78448ff Merge branch 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management updates from Zhang Rui:
 "Highlights:

   - introduction of Dove thermal sensor driver.

   - introduction of Kirkwood thermal sensor driver.

   - introduction of intel_powerclamp thermal cooling device driver.

   - add interrupt and DT support for rcar thermal driver.

   - add thermal emulation support which allows platform thermal driver
     to do software/hardware emulation for thermal issues."

* 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (36 commits)
  thermal: rcar: remove __devinitconst
  thermal: return an error on failure to register thermal class
  Thermal: rename thermal governor Kconfig option to avoid generic naming
  thermal: exynos: Use the new thermal trend type for quick cooling action.
  Thermal: exynos: Add support for temperature falling interrupt.
  Thermal: Dove: Add Themal sensor support for Dove.
  thermal: Add support for the thermal sensor on Kirkwood SoCs
  thermal: rcar: add Device Tree support
  thermal: rcar: remove machine_power_off() from rcar_thermal_notify()
  thermal: rcar: add interrupt support
  thermal: rcar: add read/write functions for common/priv data
  thermal: rcar: multi channel support
  thermal: rcar: use mutex lock instead of spin lock
  thermal: rcar: enable CPCTL to use hardware TSC deciding
  thermal: rcar: use parenthesis on macro
  Thermal: fix a build warning when CONFIG_THERMAL_EMULATION cleared
  Thermal: fix a wrong comment
  thermal: sysfs: Add a new sysfs node emul_temp for thermal emulation
  PM: intel_powerclamp: off by one in start_power_clamp()
  thermal: exynos: Miscellaneous fixes to support falling threshold interrupt
  ...
2013-02-28 19:48:26 -08:00
Tejun Heo 6deb69face thermal: convert to idr_alloc()
Convert to the much saner new idr interface.

Signed-off-by: Tejun Heo <tj@kernel.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
2013-02-27 19:10:19 -08:00
Arnd Bergmann f5b6d45f8c thermal: rcar: remove __devinitconst
commit 76cc18874 "thermal: rcar: add Device Tree support"
added device tree support for this driver, but also added
an instance of __devinitconst, which is no longer defined

Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Cc: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Cc: Zhang Rui <rui.zhang@intel.com>
2013-02-22 17:38:40 +08:00
Richard Guy Briggs da28d966f6 thermal: return an error on failure to register thermal class
The return code from the registration of the thermal class is used to
unallocate resources, but this failure isn't passed back to the caller of
thermal_init.  Return this failure back to the caller.

This bug was introduced in changeset 4cb18728 which overwrote the return code
when the variable was re-used to catch the return code of the registration of
the genetlink thermal socket family.

Signed-off-by: Richard Guy Briggs <rbriggs@redhat.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-22 17:38:40 +08:00
Zhang Rui 9d185d0417 Thermal: rename thermal governor Kconfig option to avoid generic naming
Currently, we have three Kconfig options for thermal governors, aka,
CONFIG_FAIR_SHARE, CONFIG_USER_SPACE and CONFIG_STEP_WISE.
But these names are too generic that may bring confusion to users.

Rename them to CONFIG_THERMAL_GOV_FAIR_SHARE,
CONFIG_THERMAL_GOV_USER_SPACE, CONFIG_THERMAL_GOV_STEP_WISE
to avoid the generic naming.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08 20:33:42 +08:00
Amit Daniel Kachhap ce760ed3f4 thermal: exynos: Use the new thermal trend type for quick cooling action.
This patch uses the quick thermal cooling trend type macros. This is needed
as exynos5 and other thermal sensors now supports only interrupt method for
thresold temperature check.

Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08 20:26:14 +08:00
Jonghwa Lee 4f0a684781 Thermal: exynos: Add support for temperature falling interrupt.
This patch introduces using temperature falling interrupt in exynos
thermal driver. Former patch, it only use polling way to check
whether if system themperature is fallen. However, exynos SOC also
provides temperature falling interrupt way to do same things by hw.
This feature is not supported in exynos4210.

Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08 20:26:07 +08:00
Andrew Lunn 74ffa64c23 Thermal: Dove: Add Themal sensor support for Dove.
The Marvell Dove SoC has a thermal sensor. Add a driver using the
thermal framework.

Signed-off-by: Andrew Lunn <andrew@lunn.ch>
Signed-off-by: Sebastian Hesselbarth <sebastian.hesselbarth@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08 20:26:02 +08:00
Nobuhiro Iwamatsu 7060aa3664 thermal: Add support for the thermal sensor on Kirkwood SoCs
This patch adds support for Kirkwood 88F6282 and 88F6283 thermal sensor.

Signed-off-by: Nobuhiro Iwamatsu <iwamatsu@nigauri.org>
Signed-off-by: Andrew Lunn <andrew@lunn.ch>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08 20:25:56 +08:00
Kuninori Morimoto 76cc188749 thermal: rcar: add Device Tree support
Support for loading the Renesas R-Car thermal module via devicetree.

Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08 20:25:36 +08:00
Kuninori Morimoto e6e053f4e4 thermal: rcar: remove machine_power_off() from rcar_thermal_notify()
Machine/System power-off is run in thermal frame work if
it become critical temperature.
This patch removed pointless machine_power_off()
from thermal_zone_device_ops :: .notify

Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-06 14:13:59 +08:00
Kuninori Morimoto e0a5172e9e thermal: rcar: add interrupt support
This patch adds interrupt support for R-Car thermal driver.

New generation R-Car thermal sensor interrupt controller was
different from old generation.
This patch supports new generation sensor only,
since the old generation interrupt controller had never been used before,
and will never be used in the future.

Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-06 14:13:59 +08:00
Kuninori Morimoto e9137a582f thermal: rcar: add read/write functions for common/priv data
R-Car thermal driver will use struct common in next
feature (interrupt support).
But the register address is different between struct priv and common.
This patch adds read/write functions for struct common,
and use macro technique to avoid wrong register access.

This is preparation patch for next feature (interrupt support),
therefore, there is no user to use this common read/write
function at this point.

Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-06 14:13:58 +08:00
Kuninori Morimoto 3676d1dd3d thermal: rcar: multi channel support
R-Car thermal sensor will be multi channel sensor in next generation.
But "IRQ controlling method" and "register mapping" are
different between old/new chip.

This patch adds multi sensor support.
Then, this driver assumes there is common register
if platform has IRQ resource.

The IRQ will be supported soon.

Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-06 14:13:58 +08:00
Kuninori Morimoto b2bbc6a2ac thermal: rcar: use mutex lock instead of spin lock
Current R-Car thermal driver is using spin lock for each
registers read/write, but it is pointless lock.
This lock is required while reading temperature,
but it needs long wait (= 300ms).
So, this patch used mutex lock while reading temperature,
instead of spin lock for each registers.

Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-06 14:13:57 +08:00
Kuninori Morimoto f8f53e1874 thermal: rcar: enable CPCTL to use hardware TSC deciding
If CPCTL was 1 on R-Car thermal, the thermal comparator offset
is automatically decided by hardware.
And this CPCTL is the conditions which validate interrupt.
This patch enabled CPCTL.

Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-06 14:13:57 +08:00
Kuninori Morimoto 9dde8f8608 thermal: rcar: use parenthesis on macro
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-06 14:13:57 +08:00
Zhang Rui 5e20b2e51d Thermal: fix a build warning when CONFIG_THERMAL_EMULATION cleared
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-06 14:13:56 +08:00
Zhang Rui 475f41c3ab Thermal: fix a wrong comment
"level" parameter of get_cpu_frequency equals cooling state
of cpu cooling device, and it starts from 0.

Fix the misleading comment.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-06 14:13:56 +08:00
Amit Daniel Kachhap e6e238c38b thermal: sysfs: Add a new sysfs node emul_temp for thermal emulation
This patch adds support to set the emulated temperature method in
thermal zone (sensor). After setting this feature thermal zone may
report this temperature and not the actual temperature. The emulation
implementation may be based on sensor capability through platform
specific handler or pure software emulation if no platform handler defined.

This is useful in debugging different temperature threshold and its
associated cooling action. Critical threshold's cannot be emulated.
Writing 0 on this node should disable emulation.

Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-06 13:45:42 +08:00
Dan Carpenter c8165dc0ea PM: intel_powerclamp: off by one in start_power_clamp()
This value has already been clamped correctly to 0 through 49 in
powerclamp_set_cur_state() so this patch doesn't actually change
anything.  But we should fix it anyway for consistency.

set_target_ratio is used as an offset into an array with
MAX_TARGET_RATIO (50) elements.

Signed-off-by: Dan Carpenter <dan.carpenter@oracle.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-06 13:45:39 +08:00
Amit Daniel Kachhap 3ad9524a15 thermal: exynos: Miscellaneous fixes to support falling threshold interrupt
Below fixes are done to support falling threshold interrupt,
* Falling interrupt status macro corrected according to exynos5 data sheet.
* The get trend function modified to calculate trip temperature correctly.
* The clearing of interrupt status in the isr is now done after handling
  the event that caused the interrupt.

Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-06 13:45:19 +08:00
Jacob Pan d6d71ee4a1 PM: Introduce Intel PowerClamp Driver
Intel PowerClamp driver performs synchronized idle injection across
all online CPUs. The goal is to maintain a given package level C-state
ratio.

Compared to other throttling methods already exist in the kernel,
such as ACPI PAD (taking CPUs offline) and clock modulation, this is often
more efficient in terms of performance per watt.

Please refer to Documentation/thermal/intel_powerclamp.txt for more details.

Signed-off-by: Arjan van de Ven <arjan@linux.intel.com>
Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-06 13:45:00 +08:00
Thierry Reding ca36b1ba8c thermal: Convert to devm_ioremap_resource()
Convert all uses of devm_request_and_ioremap() to the newly introduced
devm_ioremap_resource() which provides more consistent error handling.

devm_ioremap_resource() provides its own error messages so all explicit
error messages can be removed from the failure code paths.

Signed-off-by: Thierry Reding <thierry.reding@avionic-design.de>
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2013-01-25 12:21:47 -08:00
Eduardo Valentin 6b2aa51d69 thermal: check for invalid trip setup when registering thermal device
This patch adds an extra check in the data structure while registering
a thermal device. The check is to avoid registering zones with a number
of trips greater than zero, but with no .get_trip_temp nor .get_trip_type
callbacks. Receiving such data structure may end in wrong data access.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Reviewed-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-01-17 15:09:22 +08:00
Eduardo Valentin 923e0b1e8d thermal: cleanup: use dev_* helper functions
Change the logging messages to used dev_* helper functions.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Reviewed-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-01-16 10:47:18 +08:00
Eduardo Valentin ba38bb8c72 thermal: remove unnecessary include
No need for spinlocks in this file, then removing its header.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Reviewed-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-01-16 10:47:02 +08:00
Eduardo Valentin 8ab3e6a08a thermal: Use thermal zone device id in netlink messages
This patch changes the function thermal_generate_netlink_event
to receive a thermal zone device instead of a originator id.

This way, the messages will always be bound to a thermal zone.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Reviewed-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-01-16 10:46:46 +08:00
Sachin Kamat c076fc42a4 thermal: db8500: Use of_match_ptr() macro in db8500_cpufreq_cooling.c
This eliminates having an #ifdef returning NULL for the case
when OF is disabled.

Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Reviewed-by: Hongbo Zhang <hongbo.zhang@stericsson.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-01-04 15:40:03 +08:00
Sachin Kamat c313637641 thermal: db8500: Use of_match_ptr() macro in db8500_thermal.c
This eliminates having an #ifdef returning NULL for the case
when OF is disabled.

Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Reviewed-by: Hongbo Zhang <hongbo.zhang@stericsson.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-01-04 15:39:32 +08:00
Sachin Kamat caa5cbd5a1 thermal: exynos: Use of_match_ptr() macro
This eliminates having an #ifdef returning NULL for the case
when OF is disabled.

Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-01-04 15:38:55 +08:00
Julia Lawall 03b79bda8d drivers/thermal/spear_thermal.c: use devm_clk_get
devm_clk_get allocates a resource that is released when a driver detaches.
This patch uses devm_clk_get for data that is allocated in the probe
function of a platform device and is only released in the remove function.

Signed-off-by: Julia Lawall <Julia.Lawall@lip6.fr>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-01-04 15:38:25 +08:00
kuninori.morimoto.gx@renesas.com d2a73e225d thermal: rcar: add .get_trip_type/temp and .notify support
This patch adds .get_trip_type(), .get_trip_temp(), and .notify()
on rcar_thermal_zone_ops.
Driver will try platform power OFF if it reached to
critical temperature.

Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-01-04 15:37:45 +08:00
Jonghwa Lee bbf63be4f3 Thermal: exynos: Add sysfs node supporting exynos's emulation mode.
This patch supports exynos's emulation mode with newly created sysfs node.
Exynos 4x12 (4212, 4412) and 5 series provide emulation mode for thermal
management unit. Thermal emulation mode supports software debug for TMU's
operation. User can set temperature manually with software code and TMU
will read current temperature from user value not from sensor's value.
This patch includes also documentary placed under Documentation/thermal/.

Signed-off-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-01-04 15:22:37 +08:00
Zhang Rui b8bb6cb999 step_wise: Unify the code for both throttle and dethrottle
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-01-04 15:22:37 +08:00
Zhang Rui 3dbfff3dfe Introduce THERMAL_TREND_RAISE/DROP_FULL support for step_wise governor
step_wise governor should set the device cooling state to
upper/lower limit directly when THERMAL_TREND_RAISE/DROP_FULL.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-01-04 15:22:37 +08:00
Greg Kroah-Hartman 4eab7a9eb2 Drivers: thermal: remove __dev* attributes.
CONFIG_HOTPLUG is going away as an option.  As a result, the __dev*
markings need to be removed.

This change removes the use of __devinit, __devexit_p, __devinitdata,
and __devexit from these drivers.

Based on patches originally written by Bill Pemberton, but redone by me
in order to handle some of the coding style issues better, by hand.

Cc: Bill Pemberton <wfp5p@virginia.edu>
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
2013-01-03 15:57:02 -08:00
Linus Torvalds a2013a13e6 Merge branch 'for-linus' of git://git.kernel.org/pub/scm/linux/kernel/git/jikos/trivial
Pull trivial branch from Jiri Kosina:
 "Usual stuff -- comment/printk typo fixes, documentation updates, dead
  code elimination."

* 'for-linus' of git://git.kernel.org/pub/scm/linux/kernel/git/jikos/trivial: (39 commits)
  HOWTO: fix double words typo
  x86 mtrr: fix comment typo in mtrr_bp_init
  propagate name change to comments in kernel source
  doc: Update the name of profiling based on sysfs
  treewide: Fix typos in various drivers
  treewide: Fix typos in various Kconfig
  wireless: mwifiex: Fix typo in wireless/mwifiex driver
  messages: i2o: Fix typo in messages/i2o
  scripts/kernel-doc: check that non-void fcts describe their return value
  Kernel-doc: Convention: Use a "Return" section to describe return values
  radeon: Fix typo and copy/paste error in comments
  doc: Remove unnecessary declarations from Documentation/accounting/getdelays.c
  various: Fix spelling of "asynchronous" in comments.
  Fix misspellings of "whether" in comments.
  eisa: Fix spelling of "asynchronous".
  various: Fix spelling of "registered" in comments.
  doc: fix quite a few typos within Documentation
  target: iscsi: fix comment typos in target/iscsi drivers
  treewide: fix typo of "suport" in various comments and Kconfig
  treewide: fix typo of "suppport" in various comments
  ...
2012-12-13 12:00:02 -08:00
Zhang Rui 1f53ef17d3 Thermal: Fix DEFAULT_THERMAL_GOVERNOR
Fix DEFAULT_THERMAL_GOVERNOR to be consistant with the
default governor selected in kernel config file.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-12-12 15:34:48 +08:00
Zhang Rui d567c686ae Thermal: fix a NULL pointer dereference when generic thermal layer is built as a module
[   12.761956] BUG: unable to handle kernel NULL pointer dereference at 0000000000000018
[   12.762016] IP: [<ffffffffa0005277>] handle_thermal_trip+0x47/0x130 [thermal_sys]
[   12.762060] PGD 1fec74067 PUD 1fee5b067 PMD 0
[   12.762127] Oops: 0000 [#1] SMP
[   12.762177] Modules linked in: hid_generic crc32c_intel usbhid hid firewire_ohci(+) e1000e(+) firewire_core crc_itu_t xhci_hcd(+) thermal(+) fan thermal_sys hwmon
[   12.762423] CPU 1
[   12.762443] Pid: 187, comm: modprobe Tainted: G       A     3.7.0-thermal-module+ #25                  /DH77DF
[   12.762496] RIP: 0010:[<ffffffffa0005277>]  [<ffffffffa0005277>] handle_thermal_trip+0x47/0x130 [thermal_sys]
[   12.762682] RSP: 0018:ffff8801fe7ddc18  EFLAGS: 00010282
[   12.762704] RAX: 0000000000000000 RBX: ffff8801ff3e9c00 RCX: ffff8801fdc39800
[   12.762728] RDX: ffff8801fe7ddc24 RSI: 0000000000000001 RDI: ffff8801ff3e9c00
[   12.762764] RBP: ffff8801fe7ddc48 R08: 0000000004000000 R09: ffffffffa001f568
[   12.762797] R10: ffffffff81363083 R11: 0000000000000001 R12: 0000000000000001
[   12.762832] R13: 0000000000000000 R14: 0000000000000001 R15: ffff8801fde73e68
[   12.762866] FS:  00007f5548516700(0000) GS:ffff88021f240000(0000) knlGS:0000000000000000
[   12.762912] CS:  0010 DS: 0000 ES: 0000 CR0: 0000000080050033
[   12.762946] CR2: 0000000000000018 CR3: 00000001fefe2000 CR4: 00000000001407e0
[   12.762979] DR0: 0000000000000000 DR1: 0000000000000000 DR2: 0000000000000000
[   12.763014] DR3: 0000000000000000 DR6: 00000000ffff0ff0 DR7: 0000000000000400
[   12.763048] Process modprobe (pid: 187, threadinfo ffff8801fe7dc000, task ffff8801fe5bdb40)
[   12.763095] Stack:
[   12.763122]  0000000000019640 00000000fdc39800 ffff8801fe7ddc48 ffff8801ff3e9c00
[   12.763225]  0000000000000002 0000000000000000 ffff8801fe7ddc78 ffffffffa00053e7
[   12.763338]  ffff8801ff3e9c00 0000000000006c98 ffffffffa0007480 ffff8801ff3e9c00
[   12.763440] Call Trace:
[   12.763470]  [<ffffffffa00053e7>] thermal_zone_device_update+0x77/0xa0 [thermal_sys]
[   12.763515]  [<ffffffffa0006d38>] thermal_zone_device_register+0x788/0xa88 [thermal_sys]
[   12.763562]  [<ffffffffa001f394>] acpi_thermal_add+0x360/0x4c8 [thermal]
[   12.763598]  [<ffffffff8133902a>] acpi_device_probe+0x50/0x190
[   12.763632]  [<ffffffff811bd793>] ? sysfs_create_link+0x13/0x20
[   12.763666]  [<ffffffff813cc41b>] driver_probe_device+0x7b/0x240
[   12.763699]  [<ffffffff813cc68b>] __driver_attach+0xab/0xb0
[   12.763732]  [<ffffffff813cc5e0>] ? driver_probe_device+0x240/0x240
[   12.763766]  [<ffffffff813ca836>] bus_for_each_dev+0x56/0x90
[   12.763799]  [<ffffffff813cbf4e>] driver_attach+0x1e/0x20
[   12.763831]  [<ffffffff813cbac0>] bus_add_driver+0x190/0x290
[   12.763864]  [<ffffffffa0022000>] ? 0xffffffffa0021fff
[   12.763896]  [<ffffffff813ccbea>] driver_register+0x7a/0x160
[   12.763928]  [<ffffffffa0022000>] ? 0xffffffffa0021fff
[   12.763960]  [<ffffffff813399fb>] acpi_bus_register_driver+0x43/0x45
[   12.763995]  [<ffffffffa002203a>] acpi_thermal_init+0x3a/0x42 [thermal]
[   12.764029]  [<ffffffff8100207f>] do_one_initcall+0x3f/0x170
[   12.764063]  [<ffffffff810b1a5f>] sys_init_module+0x8f/0x200
[   12.764097]  [<ffffffff815ff259>] system_call_fastpath+0x16/0x1b
[   12.764129] Code: 48 8b 87 c8 02 00 00 41 89 f4 48 8d 55 dc ff 50 28 44 8b 6d dc 41 8d 45 fe 83 f8 01 76 5e 48 8b 83 d8 02 00 00 44 89 e6 48 89 df <ff> 50 18 4c 8d a3 10 03 00 00 4c 89 e7 e8 87 f1 5e e1 8b 83 bc
[   12.765164] RIP  [<ffffffffa0005277>] handle_thermal_trip+0x47/0x130 [thermal_sys]
[   12.765223]  RSP <ffff8801fe7ddc18>
[   12.765252] CR2: 0000000000000018
[   12.765284] ---[ end trace 7723294cdfb00d2a ]---

This is because thermal_zone_device_update() is invoked before
any thermal governors being registered.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-12-12 15:23:54 +08:00
Masanari Iida e41e85cc17 treewide: Fix typos in various Kconfig
Correct spelling typo within various Kconfig.

Signed-off-by: Masanari Iida <standby24x7@gmail.com>
Signed-off-by: Jiri Kosina <jkosina@suse.cz>
2012-12-03 11:03:56 +01:00
Kuninori Morimoto d12250ef8d thermal: rcar: add rcar_zone_to_priv() macro
This patch adds rcar_zone_to_priv()
which is a helper macro for gettign private data.

Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-26 11:03:55 +08:00
Kuninori Morimoto c499703e64 thermal: rcar: fixup the unit of temperature
The unit of temperature is Milli-Celsius.

Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-26 11:03:45 +08:00
Eduardo Valentin 4ba115b1e1 thermal: cpu cooling: allow module builds
As thermal drivers can be built as modules and also
the thermal framework itself, building cpu cooling
only as built-in can cause linking errors. For instance:
* Generic Thermal sysfs driver
*
Generic Thermal sysfs driver (THERMAL) [M/n/y/?] m
  generic cpu cooling support (CPU_THERMAL) [N/y/?] (NEW) y

with the following drive:
CONFIG_OMAP_BANDGAP=m

generates:
ERROR: "cpufreq_cooling_unregister" [drivers/staging/omap-thermal/omap-thermal.ko] undefined!
ERROR: "cpufreq_cooling_register" [drivers/staging/omap-thermal/omap-thermal.ko] undefined!

This patch changes cpu cooling driver to allow it
to be built as module.

Reported-by: Enric Balletbo i Serra <eballetbo@gmail.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Reviewed-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-22 15:59:52 +08:00
Eduardo Valentin 3778ff5c70 thermal: cpu cooling: use const parameter while registering
There are predefined cpu_masks that are const data structures.
This patch changes the cpu cooling register function so that
those const cpu_masks can be used, without compilation warnings.

include/linux/cpumask.h

 * The following particular system cpumasks and operations manage
 * possible, present, active and online cpus.
 *
 *     cpu_possible_mask- has bit 'cpu' set iff cpu is populatable
 *     cpu_present_mask - has bit 'cpu' set iff cpu is populated
 *     cpu_online_mask  - has bit 'cpu' set iff cpu available to scheduler
 *     cpu_active_mask  - has bit 'cpu' set iff cpu available to migration
 *

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-22 15:59:47 +08:00
hongbo.zhang aa1acb0451 Thermal: Add ST-Ericsson DB8500 thermal driver.
This driver is based on the thermal management framework in thermal_sys.c. A
thermal zone device is created with the trip points to which cooling devices
can be bound, the current cooling device is cpufreq, e.g. CPU frequency is
clipped down to cool the CPU, and other cooling devices can be added and bound
to the trip points dynamically.  The platform specific PRCMU interrupts are
used to active thermal update when trip points are reached.

Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com>
Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 20:50:34 +08:00
Zhang Rui 445110e9d0 drivers/thermal/Makefile refactor
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 20:41:47 +08:00
Zhang Rui ec54c74c8f Exynos: Add missing dependency
CPU_FREQ_TABLE depends on CPU_FREQ. Selecting CPU_FREQ_TABLE without checking
for dependencies gives the following compilation warnings:
warning: (ARCH_TEGRA_2x_SOC && ARCH_TEGRA_3x_SOC && UX500_SOC_DB8500 &&
CPU_THERMAL && EXYNOS_THERMAL) selects CPU_FREQ_TABLE which has unmet
direct dependencies (ARCH_HAS_CPUFREQ && CPU_FREQ)

Based-on-patch-by: Sachin Kamat <sachin.kamat@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 20:41:46 +08:00
Zhang Rui 72e1989782 Refactor drivers/thermal/Kconfig
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 20:41:30 +08:00
Sachin Kamat a0f846c23c thermal: cpu_cooling: Make 'notify_device' static
Silences the following sparse warning:

drivers/thermal/cpu_cooling.c:67:31: warning:
symbol 'notify_device' was not declared. Should it be static?

Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 16:48:40 +08:00
hongbo.zhang 160b7d8048 Thermal: Remove the cooling_cpufreq_list.
Problem of using this list is that the cpufreq_get_max_state callback will be
called when register cooling device by thermal_cooling_device_register, but
this list isn't ready at this moment. What's more, there is no need to maintain
such a list, we can get cpufreq_cooling_device instance by the private
thermal_cooling_device.devdata.

Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com>
Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com>
Reviewed-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-07 14:52:27 +08:00
hongbo.zhang 9c51b05a78 Thermal: fix bug of counting cpu frequencies.
In the while loop for counting cpu frequencies, if table[i].frequency equals
CPUFREQ_ENTRY_INVALID, index i won't be increased, so this leads to an endless
loop, what's more the index i cannot be referred as cpu frequencies number if
there is CPUFREQ_ENTRY_INVALID case.

Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com>
Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-07 14:49:43 +08:00
hongbo.zhang 6b6519df84 Thermal: add indent for code alignment.
The curly bracket should be aligned with corresponding if else statements.

Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com>
Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-07 14:49:25 +08:00
Kuninori Morimoto 4e8e2f644e thermal: rcar_thermal: remove explicitly used devm_kfree/iounap()
devm_kfree and devm_iounmap should not have to be explicitly used

Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-07 11:35:46 +08:00
Sachin Kamat e15cb14493 thermal: user_space: Add missing static storage class specifiers
Fixes the following sparse warnings:
drivers/thermal/user_space.c:38:5: warning:
symbol 'notify_user_space' was not declared. Should it be static?
drivers/thermal/user_space.c:46:25: warning:
symbol 'thermal_gov_user_space' was not declared. Should it be static?

Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:11 +08:00
Sachin Kamat 621769334b thermal: fair_share: Add missing static storage class specifiers
Fixes the following sparse warnings:
drivers/thermal/fair_share.c:80:5: warning:
symbol 'fair_share_throttle' was not declared. Should it be static?
drivers/thermal/fair_share.c:111:25: warning:
symbol 'thermal_gov_fair_share' was not declared. Should it be static?

Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:10 +08:00
Sachin Kamat b88a497701 thermal: step_wise: Add missing static storage class specifiers
Fixes the following sparse warnings:
drivers/thermal/step_wise.c:153:5: warning:
symbol 'step_wise_throttle' was not declared. Should it be static?
drivers/thermal/step_wise.c:172:25: warning:
symbol 'thermal_gov_step_wise' was not declared. Should it be static?

Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:10 +08:00
Hugh Dickins 791700cdfc Thermal: Fix oops and unlocking in thermal_sys.c
This patch fixes the following mutex and NULL pointer
problems in thermal_sys.c:

 * mutex_unlock fix in update_temperature function
 * mutex_unlock fix in bind_cdev function
 * Correct early return to continue in bind_cdev function
 * NULL check fix in bind_cdev function
 * NULL check fix in bind_tz function

Reported-by: Dan Carpenter <dan.carpenter@oracle.com>
Reported-by: Sedat Dilek <sedat.dilek@gmail.com>
Reported-by: Hugh Dickins <hughd@google.com>
Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Sedat Dilek <sedat.dilek@gmail.com>
Signed-off-by: Hugh Dickins <hughd@google.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:10 +08:00
Durgadoss R a56757af8e Thermal: Provide option to choose default thermal governor
This patch provides option to choose the default thermal
governor. If no option is provided, the step_wise
governor is selected by default.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:09 +08:00
Durgadoss R f2b4caafd4 Thermal: Add a notification API
This patch adds a notification API which the sensor drivers'
can use to notify the framework. The framework then takes
care of the throttling according to the configured policy.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:08 +08:00
Durgadoss R 0c01ebbfd3 Thermal: Remove throttling logic out of thermal_sys.c
This patch removes the throttling logic out of
thermal_sys.c; also refactors the code into smaller
functions so that are easy to read/maintain.
 * Seperates the handling of critical and non-critical trips
 * Re-arranges the set_polling and device_check methods, so
   that all related functions are arranged in one place.
 * Removes the 'do_update' and 'trip_update' method, as part
   of moving the throttling logic out of thermal_sys.c

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:08 +08:00
Durgadoss R 1cc807a234 Thermal: Add a thermal notifier for user space
This patch registers a governor which will let the
user land manage the platform thermals. Whenever a
trip happens, this governor just notifies the user
space using kobj_uevent().

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:08 +08:00
Durgadoss R e151a202a0 Thermal: Introduce a step_wise thermal governor
This patch adds a simple step_wise governor to the
generic thermal layer. This algorithm throttles the
cooling devices in a linear fashion. If the 'trend'
is heating, it throttles by one step. And if the
thermal trend is cooling it de-throttles by one step.

This actually moves the throttling logic from thermal_sys.c
and puts inside step_wise.c, without any change.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:07 +08:00
Durgadoss R 4ccc5743ae Thermal: Introduce fair_share thermal governor
This patch introduces a simple 'weight' based
governor named fair_share governor. Whenever the
thermal framework gets notified of the trip point
violation, this governor (if configured), throttles
the cooling devices associated with a thermal zone.

This mapping between a thermal zone and a cooling device
and the effectiveness of cooling are provided in the
platform layer.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:07 +08:00
Durgadoss R dc76548269 Thermal: Make thermal_cdev_update as a global function
This patch makes the thermal_cdev_update function as a
global one, so that other files can use it. This function
serves as a single arbitrator to set the state of a cooling
device.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:06 +08:00
Durgadoss R 7e8ee1e9d7 Thermal: Update binding logic based on platform data
This patch updates the binding logic in thermal_sys.c
It uses the platform layer data to bind a thermal zone
to a cdev for a particular trip point.

 * If we do not have platform data and do not have
   .bind defined, do not bind.
 * If we do not have platform data but .bind is
   defined, then use tz->ops->bind.
 * If we have platform data, use it to create binding.

The same logic sequence is followed for unbind also.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:06 +08:00
Durgadoss R 5a2c090b33 Thermal: Add a policy sysfs attribute
This patch adds a policy sysfs attribute to a thermal zone.
This attribute denotes the throttling governor used for the
zone. This is a RW attribute.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:05 +08:00
Durgadoss R a4a15485fb Thermal: Add thermal governor registration APIs
This patch creates a structure to hold platform
thermal governor information, and provides APIs
for individual thermal governors to register/unregister
with the Thermal framework.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:05 +08:00
Durgadoss R 50125a9b27 Thermal: Pass zone parameters as argument to tzd_register
This patch adds the thermal zone parameter as an argument to
the tzd_register() function call; and updates other drivers
using this function.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 13:59:57 +08:00
Durgadoss R 9b4298a088 Thermal: Add get trend, get instance API's to thermal_sys
This patch adds the following API's to thermal_sys.c, that
can be used by other Thermal drivers.
 * get_tz_trend: obtain the trend of the given thermal zone
 * get_thermal_instance: obtain the instance corresponding
   to the given tz, cdev and the trip point.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 13:56:32 +08:00
Durgadoss R 71350db43b Thermal: Move thermal_instance to thermal_core.h
This patch creates a thermal_core.h file which can contain
all defines used by the core thermal framework files. For
now, move the thermal_instance structure to thermal_core.h
This structure is used by files under drivers/thermal/.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 13:56:32 +08:00
Jonghwan Choi 3ae53b1e13 exynos4_tmu_driver_ids should be exynos_tmu_driver_ids.
Signed-off-by: Jonghwan Choi <jhbird.choi@samsung.com>
Reviewed-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-03 09:52:55 +08:00
Devendra Naga 608f62b996 thermal: solve compilation errors in rcar_thermal
following were the errors reported

drivers/thermal/rcar_thermal.c: In function ‘rcar_thermal_probe’:
drivers/thermal/rcar_thermal.c:214:10: warning: passing argument 3 of ‘thermal_zone_device_register’ makes integer from pointer without a cast [enabled by default]
include/linux/thermal.h:166:29: note: expected ‘int’ but argument is of type ‘struct rcar_thermal_priv *’
drivers/thermal/rcar_thermal.c:214:10: error: too few arguments to function ‘thermal_zone_device_register’
include/linux/thermal.h:166:29: note: declared here
make[1]: *** [drivers/thermal/rcar_thermal.o] Error 1
make: *** [drivers/thermal/rcar_thermal.o] Error 2

with gcc version 4.6.3 (Ubuntu/Linaro 4.6.3-1ubuntu5)

Signed-off-by: Devendra Naga <develkernel412222@gmail.com>
Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-03 09:52:48 +08:00
David Rientjes dd8e8c4a2c thermal, cpufreq: Fix build when CPU_FREQ_TABLE isn't configured
Commit 0236141837 ("thermal: add generic cpufreq cooling
implementation") requires cpufreq_frequency_get_table(), but that
function is only defined for CONFIG_CPU_FREQ_TABLE resulting in the
following build error:

  drivers/built-in.o: In function `cpufreq_get_max_state':
  drivers/thermal/cpu_cooling.c:259: undefined reference to `cpufreq_frequency_get_table'
  drivers/built-in.o: In function `get_cpu_frequency':
  drivers/thermal/cpu_cooling.c:129: undefined reference to `cpufreq_frequency_get_table'

Fix it by selecting CONFIG_CPU_FREQ_TABLE for such a configuration.

It turns out CONFIG_EXYNOS_THERMAL also needs CONFIG_CPU_FREQ_TABLE, so
select it there as well.

Signed-off-by: David Rientjes <rientjes@google.com>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
2012-10-15 14:00:07 -07:00
Len Brown 29b19e2504 Merge branch 'release' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux into thermal
Conflicts:
	drivers/staging/omap-thermal/omap-thermal-common.
		OMAP supplied dummy TC1 and TC2,
		at the same time that the thermal tree removed them
		from thermal_zone_device_register()

	drivers/thermal/cpu_cooling.c b/drivers/thermal/cpu_cooling.c
		propogate the upstream MAX_IDR_LEVEL re-name
			to prevent a build failure

	Previously-fixed-by: Stephen Rothwell <sfr@canb.auug.org.au>

Signed-off-by: Len Brown <len.brown@intel.com>
2012-10-09 01:35:52 -04:00
Fengguang Wu 125c4c706b idr: rename MAX_LEVEL to MAX_IDR_LEVEL
To avoid name conflicts:

  drivers/video/riva/fbdev.c:281:9: sparse: preprocessor token MAX_LEVEL redefined

While at it, also make the other names more consistent and add
parentheses.

[akpm@linux-foundation.org: repair fallout]
[sfr@canb.auug.org.au: IB/mlx4: fix for MAX_ID_MASK to MAX_IDR_MASK name change]
Signed-off-by: Fengguang Wu <fengguang.wu@intel.com>
Cc: Bernd Petrovitsch <bernd@petrovitsch.priv.at>
Cc: walter harms <wharms@bfs.de>
Cc: Glauber Costa <glommer@parallels.com>
Signed-off-by: Stephen Rothwell <sfr@canb.auug.org.au>
Cc: Roland Dreier <roland@purestorage.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
2012-10-06 03:04:56 +09:00
Sachin Kamat c072fed95c thermal: Exynos: Fix NULL pointer dereference in exynos_unregister_thermal()
exynos_unregister_thermal() is functional only when 'th_zone' is not
NULL (ensured by the NULL checks). However, in the event it is NULL, it
gets dereferenced in the for loop. This patch fixes this issue.

Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
2012-09-28 08:23:21 +08:00
Jonghwa Lee a4b6fec977 Thermal: Fix bug on cpu_cooling, cooling device's id conflict problem.
This patch fixes small bug on cpu_cooling. CPU cooling device has own
id generated with idr mathod. However in the previous version, it swapped
to all same id at last stage of probing as 0. This makes id's collision and
also occures error when it releases that id.

Signed-off-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
2012-09-27 14:11:22 +08:00
Amit Daniel Kachhap 79e093c3fe thermal: exynos: Use devm_* functions
devm_* functions are used to replace kzalloc, request_mem_region, ioremap
and request_irq functions in probe call. With the usage of devm_* functions
explicit freeing and unmapping is not required.

Signed-off-by: Sachin Kamat <sachin.kamat@linaro.org>
Signed-off-by: Sachin Kamat <sachin.kamat@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:38 +08:00
Amit Daniel Kachhap 17be868e04 ARM: exynos: add thermal sensor driver platform data support
Add necessary default platform data support needed for TMU driver.  The
supplied dt/non-dt values are tested for origen exynos4210 and smdk exynos5250
platforms and only compile tested for exynos4412.

Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: jonghwa lee <jonghwa3.lee@samsung.com>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:38 +08:00
Amit Daniel Kachhap 7e0b55e606 thermal: exynos: register the tmu sensor with the kernel thermal layer
This code added creates a link between temperature sensors, linux thermal
framework and cooling devices for samsung exynos platform.  This layer
monitors the temperature from the sensor and informs the generic thermal
layer to take the necessary cooling action.

[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:38 +08:00
Amit Daniel Kachhap f22d9c03cc thermal: exynos5: add exynos5250 thermal sensor driver support
Insert exynos5 TMU sensor changes into the thermal driver.  Some exynos4
changes are made generic for exynos series.

[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: SangWook Ju <sw.ju@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:38 +08:00
Amit Daniel Kachhap c48cbba6fe hwmon: exynos4: move thermal sensor driver to driver/thermal directory
This movement is needed because the hwmon entries and corresponding sysfs
interface is a duplicate of utilities already provided by
driver/thermal/thermal_sys.c.  The goal is to place it in thermal folder
and add necessary functions to use the in-kernel thermal interfaces.

Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:38 +08:00
Amit Daniel Kachhap 0236141837 thermal: add generic cpufreq cooling implementation
This patchset introduces a new generic cooling device based on cpufreq
that can be used on non-ACPI platforms.  As a proof of concept, we have
drivers for the following platforms using this mechanism now:

 * Samsung Exynos (Exynos4 and Exynos5) in the current patchset.
 * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal)

There is a small change in cpufreq cooling registration APIs, so a minor
change is needed for Freescale platforms.

Brief Description:

1) The generic cooling devices code is placed inside driver/thermal/*
   as placing inside acpi folder will need un-necessary enabling of acpi
   code.  This code is architecture independent.

2) This patchset adds generic cpu cooling low level implementation
   through frequency clipping.  In future, other cpu related cooling
   devices may be added here.  An ACPI version of this already exists
   (drivers/acpi/processor_thermal.c) .But this will be useful for
   platforms like ARM using the generic thermal interface along with the
   generic cpu cooling devices.  The cooling device registration API's
   return cooling device pointers which can be easily binded with the
   thermal zone trip points.  The important APIs exposed are,

   a) struct thermal_cooling_device *cpufreq_cooling_register(
        struct cpumask *clip_cpus)
   b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)

3) Samsung exynos platform thermal implementation is done using the
   generic cpu cooling APIs and the new trip type.  The temperature sensor
   driver present in the hwmon folder(registered as hwmon driver) is moved
   to thermal folder and registered as a thermal driver.

A simple data/control flow diagrams is shown below,

Core Linux thermal <----->  Exynos thermal interface <----- Temperature Sensor
          |                             |
         \|/                            |
  Cpufreq cooling device <---------------

TODO:
*Will send the DT enablement patches later after the driver is merged.

This patch:

Add support for generic cpu thermal cooling low level implementations
using frequency scaling up/down based on the registration parameters.
Different cpu related cooling devices can be registered by the user and
the binding of these cooling devices to the corresponding trip points can
be easily done as the registration APIs return the cooling device pointer.
The user of these APIs are responsible for passing clipping frequency .
The drivers can also register to recieve notification about any cooling
action called.

[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Cc: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:38 +08:00
Guenter Roeck 204dd1d39c thermal: Fix potential NULL pointer accesses
The type parameter in thermal_zone_device_register and
thermal_cooling_device_register can be NULL, indicating that no sysfs attribute
for the type should be created. Only call strlen() and strcpy() on type if it is
not NULL.

This patch addresses Coverity #102180 and #102182: Dereference before null check

Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:38 +08:00
Kuninori Morimoto 1e426ffddf thermal: add Renesas R-Car thermal sensor support
This patch add basic Renesas R-Car thermal sensor support.
It was tested on R-Car H1 Marzen board.

Signed-off-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Cc: Len Brown <len.brown@intel.com>
Cc: Joe Perches <joe@perches.com>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: Magnus Damm <magnus.damm@gmail.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:37 +08:00
Guenter Roeck 79a49168b5 thermal: fix potential out-of-bounds memory access
temp_crit.name and temp_input.name have a length of 16 bytes.  Using
THERMAL_NAME_LENGTH (20) as length parameter for snprintf() may result in
out-of-bounds memory accesses.  Replace it with sizeof().

Addresses Coverity #115679

Signed-off-by: Guenter Roeck <linux@roeck-us.net>
Cc: Len Brown <lenb@kernel.org>
Cc: "Brown, Len" <len.brown@intel.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:37 +08:00
Zhang Rui f4a821ce6e Thermal: Introduce locking for cdev.thermal_instances list.
we need to go over all the thermal_instance list of a cooling device
to decide which cooling state to put the cooling device to.

But at this time, as a cooling device may be referenced in multiple
thermal zones, we need to lock the list first in case
another thermal zone is updating this cooling device.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24 14:44:37 +08:00
Zhang Rui 908b9fb792 Thermal: Unify the code for both active and passive cooling
Remove thermal_zone_device_passive(). And use
thermal_zone_trip_update() and thermal_zone_do_update()
for both active and passive cooling.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24 14:44:37 +08:00
Zhang Rui ce119f8325 Thermal: Introduce simple arbitrator for setting device cooling state
This fixes the problem that a cooling device may be referenced by
by multiple trip points in multiple thermal zones.

With this patch, we have two stages for updating a thermal zone,
1. check if a thermal_instance needs to be updated or not
2. update the cooling device, based on the target cooling state
   of all its instances.

Note that, currently, the cooling device is set to the deepest
cooling state required.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24 14:44:37 +08:00
Zhang Rui b5e4ae620b Thermal: List thermal_instance in thermal_cooling_device.
List thermal_instance in thermal_cooling_device so that
cooling device can know the cooling state requirement
of all the thermal instances.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24 14:44:37 +08:00
Zhang Rui cddf31b3b2 Thermal: Rename thermal_instance.node to thermal_instance.tz_node.
thermal_instance should be referenced by both thermal zone devices
and thermal cooling devices.

Rename thermal_instance.node to thermal_instance.tz_node in this patch
and thermal_instanace.cdev_node will be introduced in next patch.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24 14:44:37 +08:00
Zhang Rui 2d374139d5 Thermal: Rename thermal_zone_device.cooling_devices
Rename thermal_zone_device.cooling_devices
to thermal_zone_device.thermal_instances

thermal_zone_device.cooling_devices is not accurate
as this is a list for thermal instances, rather than cooling devices.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24 14:44:37 +08:00
Zhang Rui b81b6ba3d9 Thermal: rename structure thermal_cooling_device_instance to thermal_instance
This struct is used to describe the behavior for a thermal
cooling device on a certain trip point for a certain thremal zone.

thermal_cooling_device_instance is not accurate, as a cooling device
can be used for more than one trip point in one thermal zone device.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24 14:44:37 +08:00
Zhang Rui 4ae46befb4 Thermal: Introduce thermal_zone_trip_update()
This function is used to update the cooling state of
all the cooling devices that are bound to an active trip point.

This will be used for passive cooling as well, in the future patches.
as both active and passive cooling can share the same algorithm,
which is

1. if the temperature is higher than a trip point,
   a. if the trend is THERMAL_TREND_RAISING, use higher cooling
      state for this trip point
   b. if the trend is THERMAL_TREND_DROPPING, use lower cooling
      state for this trip point

2. if the temperature is lower than a trip point, use lower
   cooling state for this trip point.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24 14:44:37 +08:00
Zhang Rui 1b7ddb840c Thermal: Remove tc1/tc2 in generic thermal layer.
Remove tc1/tc2 in generic thermal layer.
.get_trend() callback starts to take effect from this patch.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>
2012-09-24 14:44:36 +08:00
Zhang Rui 601f3d4242 Thermal: Introduce .get_trend() callback.
According to ACPI spec, tc1 and tc2 are used by OSPM
to anticipate the temperature trends.
We introduced the same concept to the generic thermal layer
for passive cooling, but now it seems that these values
are hard to be used on other platforms.

So We introduce .get_trend() as a more general solution.

For the platform thermal drivers that have their own way to
anticipate the temperature trends, they should provide
their own .get_trend() callback.
Or else, we will calculate the temperature trends by simply
comparing the current temperature and the cached previous
temperature reading.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>
2012-09-24 14:44:36 +08:00
Zhang Rui 9d99842f99 Thermal: set upper and lower limits
set upper and lower limits when binding
a thermal cooling device to a thermal zone device.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24 14:44:36 +08:00
Zhang Rui 74051ba505 Thermal: Introduce cooling states range support
As the active cooling devices can have multiple cooling states,
we may want only several cooling states for a certain trip point,
and other cooling states for other active trip points.

To do this, we should be able to describe the cooling device
behavior for a certain trip point, rather than for the entire thermal zone.
And when updating thermal zone, we need to check the upper and lower limit
to make sure the cooling device is set to the proper cooling state.

Note that this patch will not bring any different behavior as
upper limit is set to max_state and lower limit is set to 0
in this patch, for now.

Next patch will set these to real values.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Eduardo Valentin <eduardo.valentin@ti.com>
2012-09-24 14:44:36 +08:00
Zhang Rui e3f25e6e58 Thermal: Introduce multiple cooling states support
This is because general active cooling devices, like fans,
may have multiple speeds, which can be mapped to different cooling states.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Reviewed-by: Rafael J. Wysocki <rjw@sisk.pl>
Reviewed-by: Valentin, Eduardo <eduardo.valentin@ti.com>
2012-09-24 14:44:36 +08:00
Tejun Heo 41f63c5359 workqueue: use mod_delayed_work() instead of cancel + queue
Convert delayed_work users doing cancel_delayed_work() followed by
queue_delayed_work() to mod_delayed_work().

Most conversions are straight-forward.  Ones worth mentioning are,

* drivers/edac/edac_mc.c: edac_mc_workq_setup() converted to always
  use mod_delayed_work() and cancel loop in
  edac_mc_reset_delay_period() is dropped.

* drivers/platform/x86/thinkpad_acpi.c: No need to remember whether
  watchdog is active or not.  @fan_watchdog_active and related code
  dropped.

* drivers/power/charger-manager.c: Seemingly a lot of
  delayed_work_pending() abuse going on here.
  [delayed_]work_pending() are unsynchronized and racy when used like
  this.  I converted one instance in fullbatt_handler().  Please
  conver the rest so that it invokes workqueue APIs for the intended
  target state rather than trying to game work item pending state
  transitions.  e.g. if timer should be modified - call
  mod_delayed_work(), canceled - call cancel_delayed_work[_sync]().

* drivers/thermal/thermal_sys.c: thermal_zone_device_set_polling()
  simplified.  Note that round_jiffies() calls in this function are
  meaningless.  round_jiffies() work on absolute jiffies not delta
  delay used by delayed_work.

v2: Tomi pointed out that __cancel_delayed_work() users can't be
    safely converted to mod_delayed_work().  They could be calling it
    from irq context and if that happens while delayed_work_timer_fn()
    is running, it could deadlock.  __cancel_delayed_work() users are
    dropped.

Signed-off-by: Tejun Heo <tj@kernel.org>
Acked-by: Henrique de Moraes Holschuh <hmh@hmh.eng.br>
Acked-by: Dmitry Torokhov <dmitry.torokhov@gmail.com>
Acked-by: Anton Vorontsov <cbouatmailru@gmail.com>
Acked-by: David Howells <dhowells@redhat.com>
Cc: Tomi Valkeinen <tomi.valkeinen@ti.com>
Cc: Jens Axboe <axboe@kernel.dk>
Cc: Jiri Kosina <jkosina@suse.cz>
Cc: Doug Thompson <dougthompson@xmission.com>
Cc: David Airlie <airlied@linux.ie>
Cc: Roland Dreier <roland@kernel.org>
Cc: "John W. Linville" <linville@tuxdriver.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Len Brown <len.brown@intel.com>
Cc: "J. Bruce Fields" <bfields@fieldses.org>
Cc: Johannes Berg <johannes@sipsolutions.net>
2012-08-13 16:27:37 -07:00
Linus Torvalds 4b24ff7110 The tag contains just a few battery-related changes for v3.6. It's is
all pretty straightforward, except one thing.
 
 One of our patches added thermal support for power supply class, but
 thermal/ subsystem changed under our feet. We (well, Stephen, that is)
 caught the issue and it was decided[1] that I'd just delay the battery
 pull request, and then will fix it up by merging upstream back into
 battery tree at the specific commit.
 
 That's not all though: another[2] small fixup for thermal subsystem was
 needed to get rid of a warning in power supply subsystem (the warning
 was not drivers/power's "fault", the thermal registration function just
 needed a proper const annotation, which is also done by a small commit
 on top of the merge.
 
 So, to sum this up:
 - The 'master' branch of the battery tree was in the -next tree for
   weeks, was never rebased, altered etc. It should be all OK;
 - Although, for-v3.6 tag contains the 'master' branch + merge + the
   warning fix.
 
 [1] http://lkml.org/lkml/2012/6/19/23
 [2] http://lkml.org/lkml/2012/6/18/28
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Merge tag 'for-v3.6' of git://git.infradead.org/battery-2.6

Pull battery updates from Anton Vorontsov:
 "The tag contains just a few battery-related changes for v3.6.  It's is
  all pretty straightforward, except one thing.

  One of our patches added thermal support for power supply class, but
  thermal/ subsystem changed under our feet.  We (well, Stephen, that
  is) caught the issue and it was decided[1] that I'd just delay the
  battery pull request, and then will fix it up by merging upstream back
  into battery tree at the specific commit.

  That's not all though: another[2] small fixup for thermal subsystem
  was needed to get rid of a warning in power supply subsystem (the
  warning was not drivers/power's "fault", the thermal registration
  function just needed a proper const annotation, which is also done by
  a small commit on top of the merge.

  So, to sum this up:
   - The 'master' branch of the battery tree was in the -next tree for
     weeks, was never rebased, altered etc.  It should be all OK;
   - Although, for-v3.6 tag contains the 'master' branch + merge + the
     warning fix.

  [1] http://lkml.org/lkml/2012/6/19/23
  [2] http://lkml.org/lkml/2012/6/18/28"

* tag 'for-v3.6' of git://git.infradead.org/battery-2.6: (23 commits)
  thermal: Constify 'type' argument for the registration routine
  olpc-battery: update CHARGE_FULL_DESIGN property for BYD LiFe batteries
  olpc-battery: Add VOLTAGE_MAX_DESIGN property
  charger-manager: Fix build break related to EXTCON
  lp8727_charger: Move header file into platform_data directory
  power_supply: Add min/max alert properties for CAPACITY, TEMP, TEMP_AMBIENT
  bq27x00_battery: Add support for BQ27425 chip
  charger-manager: Set current limit of regulator for over current protection
  charger-manager: Use EXTCON Subsystem to detect charger cables for charging
  test_power: Add VOLTAGE_NOW and BATTERY_TEMP properties
  test_power: Add support for USB AC source
  gpio-charger: Use cansleep version of gpio_set_value
  bq27x00_battery: Add support for power average and health properties
  sbs-battery: Don't trigger false supply_changed event
  twl4030_charger: Allow charger to control the regulator that feeds it
  twl4030_charger: Add backup-battery charging
  twl4030_charger: Fix some typos
  max17042_battery: Support CHARGE_COUNTER power supply attribute
  smb347-charger: Add constant charge and current properties
  power_supply: Add constant charge_current and charge_voltage properties
  ...
2012-07-31 18:08:25 -07:00
Anton Vorontsov 4b1bf5871f thermal: Constify 'type' argument for the registration routine
thermal_zone_device_register() does not modify 'type' argument, so it is
safe to declare it as const. Otherwise, if we pass a const string, we are
getting the ugly warning:

CC drivers/power/power_supply_core.o
drivers/power/power_supply_core.c: In function 'psy_register_thermal':
drivers/power/power_supply_core.c:204:6: warning: passing argument 1 of 'thermal_zone_device_register' discards 'const' qualifier from pointer target type [enabled by default]
include/linux/thermal.h:140:29: note: expected 'char *' but argument is of type 'const char *'

Signed-off-by: Anton Vorontsov <anton.vorontsov@linaro.org>
Acked-by: Jean Delvare <khali@linux-fr.org>
2012-07-31 05:45:37 -07:00
Len Brown ec033d0a02 Merge branches 'acpi_pad', 'acpica', 'apei-bugzilla-43282', 'battery', 'cpuidle-coupled', 'cpuidle-tweaks', 'intel_idle-ivb', 'ost', 'red-hat-bz-772730', 'thermal', 'thermal-spear' and 'turbostat-v2' into release 2012-07-26 00:03:58 -04:00
Durgadoss R 27365a6c7d Thermal: Add Hysteresis attributes
The Linux Thermal Framework does not support hysteresis
attributes. Most thermal sensors, today, have a
hysteresis value associated with trip points.

This patch adds hysteresis attributes on a per-trip-point
basis, to the Thermal Framework. These attributes are
optionally writable.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
2012-07-24 23:19:26 -04:00
Durgadoss R c56f5c0342 Thermal: Make Thermal trip points writeable
Some of the thermal drivers using the Generic Thermal Framework
require (all/some) trip points to be writeable. This patch makes
the trip point temperatures writeable on a per-trip point basis,
and modifies the required function call in thermal.c. This patch
also updates the Documentation to reflect the new change.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
2012-07-24 23:17:20 -04:00
Viresh Kumar b9c7aff481 drivers/thermal/spear_thermal.c: add Device Tree probing capability
SPEAr platforms now support DT and so must convert all drivers to support
DT.  This patch adds DT probing support for SPEAr thermal sensor driver
and updates its documentation too.

Also, as SPEAr is the only user of this driver and is only available with
DT, make this an only DT driver.  So, platform_data is completely removed
and passed via DT now.

Signed-off-by: Viresh Kumar <viresh.kumar@st.com>
Cc: Dan Carpenter <dan.carpenter@oracle.com>
Reviewed-by: Vincenzo Frascino <vincenzo.frascino@st.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2012-06-02 01:49:38 -04:00
Amit Daniel Kachhap f1f0e2ac59 thermal: Fix for setting the thermal zone mode to enable/disable
Basically without this patch changing the mode of thermal zone
is not possible as wrong string size is passed to strncmp.

Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Jean Delvare <khali@linux-fr.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-22 01:10:18 -04:00
Dan Carpenter 03ee62f0b9 thermal: spear13xx: checking for NULL instead of IS_ERR()
thermal_zone_device_register() never returns NULL, on error it returns and
ERR_PTR().

Signed-off-by: Dan Carpenter <dan.carpenter@oracle.com>
Reviewed-by: Viresh Kumar <viresh.kumar@st.com>
Reviewed-by: Vincenzo Frascino <vincenzo.frascino@st.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-22 01:07:22 -04:00
Viresh Kumar de716e32e6 thermal/spear_thermal: replace readl/writel with lighter _relaxed variants
readl/writel versions for ARM contain memory barrier instruction for
synchronizing DMA buffers.  These are not required at least on this
module.  So use lighter _relaxed variants.

Signed-off-by: Viresh Kumar <viresh.kumar@st.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-22 01:06:43 -04:00
Vincenzo Frascino 6a92c36688 thermal: add support for thermal sensor present on SPEAr13xx machines
ST's SPEAr13xx machines are based on CortexA9 ARM processors.  These
machines contain a thermal sensor for junction temperature monitoring.

This patch adds support for this thermal sensor in existing thermal
framework.

[akpm@linux-foundation.org: little code cleanup]
[akpm@linux-foundation.org: print the pointer correctly]
[viresh.kumar@st.com: thermal/spear_thermal: add compilation dependency on PLAT_SPEAR]
Signed-off-by: Vincenzo Frascino <vincenzo.frascino@st.com>
Signed-off-by: Viresh Kumar <viresh.kumar@st.com>
Signed-off-by: Viresh Kumar <viresh.kumar@st.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-22 01:05:32 -04:00
Joe Perches c5a01dd52d thermal_sys: convert printks to pr_<level>
Use the current logging style.

Remove PREFIX, add pr_fmt, convert the printks.  All dmesg output now
prefixed with "thermal_sys: ".

Signed-off-by: Joe Perches <joe@perches.com>
Cc: Jesper Juhl <jj@chaosbits.net>
Cc: Len Brown <lenb@kernel.org>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-22 01:04:40 -04:00
Joe Perches caca8b8035 thermal_sys: kernel style cleanups
Just a few tidies to make it more like most kernel sources.

A couple of long lines still remain.

Signed-off-by: Joe Perches <joe@perches.com>
Reviewed-by: Jesper Juhl <jj@chaosbits.net>
Cc: Len Brown <lenb@kernel.org>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-22 01:03:09 -04:00
Joe Perches ec79768560 thermal_sys: remove obfuscating used-once macros
These don't add any value as they are used only once and the surrounding
code uses similar variable.

Signed-off-by: Joe Perches <joe@perches.com>
Cc: Jesper Juhl <jj@chaosbits.net>
Cc: Len Brown <lenb@kernel.org>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-22 01:02:31 -04:00
Joe Perches 886ee54635 thermal_sys: remove unnecessary line continuations
Line continations are not necessary in function calls or statements.
Remove them.

Signed-off-by: Joe Perches <joe@perches.com>
Reviewed-by: Jesper Juhl <jj@chaosbits.net>
Cc: Len Brown <lenb@kernel.org>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-22 01:01:46 -04:00
Fabio Estevam b11de07ce5 drivers/thermal/thermal_sys.c: fix build warning
With CONFIG_NET=n:

drivers/thermal/thermal_sys.c:63: warning: 'thermal_event_seqnum' defined but not used

Move 'thermal_event_seqnum' definition inside the '#ifdef CONFIG_NET'

[akpm@linux-foundation.org: make thermal_event_seqnum local to generate_netlink_event()]
Signed-off-by: Fabio Estevam <fabio.estevam@freescale.com>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Cc: Jean Delvare <khali@linux-fr.org>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2012-03-22 01:01:27 -04:00
Jean Delvare 2d58d7ea91 thermal: Rename generate_netlink_event
It doesn't seem right for the thermal subsystem to export a symbol
named generate_netlink_event. This function is thermal-specific and
its name should reflect that fact. Rename it to
thermal_generate_netlink_event.

Signed-off-by: Jean Delvare <khali@linux-fr.org>
Acked-by: Rafael J. Wysocki <rjw@sisk.pl>
Acked-by: R.Durgadoss <durgadoss.r@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
2012-01-23 03:15:25 -05:00
Rafael J. Wysocki 51e20d0e3a thermal: Prevent polling from happening during system suspend
The thermal driver should use a freezable workqueue to schedule
polling to prevent thermal_zone_device_update() from being run
during system suspend, when the devices it relies on may be inactive.
Make it use the system freezable workqueue for this purpose.

Signed-off-by: Rafael J. Wysocki <rjw@sisk.pl>
Signed-off-by: Len Brown <len.brown@intel.com>
2011-11-06 20:38:49 -05:00
Jean Delvare 31f5396ad3 thermal: make THERMAL_HWMON implementation fully internal
THERMAL_HWMON is implemented inside the thermal_sys driver and has no
effect on drivers implementing thermal zones, so they shouldn't see
anything related to it in <linux/thermal.h>.  Making the THERMAL_HWMON
implementation fully internal has two advantages beyond the cleaner
design:

* This avoids rebuilding all thermal drivers if the THERMAL_HWMON
  implementation changes, or if CONFIG_THERMAL_HWMON gets enabled or
  disabled.

* This avoids breaking the thermal kABI in these cases too, which should
  make distributions happy.

The only drawback I can see is slightly higher memory fragmentation, as
the number of kzalloc() calls will increase by one per thermal zone.  But
I doubt it will be a problem in practice, as I've never seen a system with
more than two thermal zones.

Signed-off-by: Jean Delvare <khali@linux-fr.org>
Cc: Rene Herman <rene.herman@gmail.com>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2011-08-02 14:51:57 -04:00
Jean Delvare 0d97d7a494 thermal: split hwmon lookup to a separate function
We'll soon need to reuse it.

Signed-off-by: Jean Delvare <khali@linux-fr.org>
Cc: Rene Herman <rene.herman@gmail.com>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2011-08-02 14:51:41 -04:00
Jean Delvare ab92402af0 thermal: hide CONFIG_THERMAL_HWMON
It's about time to revert 16d7523973 ("thermal: Create
CONFIG_THERMAL_HWMON=n").  Anybody running a kernel >= 2.6.40 would also
be running a recent enough version of lm-sensors.

Actually having CONFIG_THERMAL_HWMON is pretty convenient so instead of
dropping it, we keep it but hide it.

Signed-off-by: Jean Delvare <khali@linux-fr.org>
Cc: Rene Herman <rene.herman@gmail.com>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2011-08-02 14:51:25 -04:00
Durgadoss R b299eb5cde ACPI:Fix goto flows in thermal-sys
This patch fixes two minor bugs in thermal_sys:
(a) The flow of goto's in thermal_hwmon_add_sysfs.
(b) Remove the temp*_crit only if there is a get_crit_temp defined, in
    thermal_remove_hwmon_sysfs.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
2011-03-23 01:43:44 -04:00
Rafael J. Wysocki af06216a8e ACPI: Fix build for CONFIG_NET unset
Several ACPI drivers fail to build if CONFIG_NET is unset, because
they refer to things depending on CONFIG_THERMAL that in turn depends
on CONFIG_NET.  However, CONFIG_THERMAL doesn't really need to depend
on CONFIG_NET, because the only part of it requiring CONFIG_NET is
the netlink interface in thermal_sys.c.

Put the netlink interface in thermal_sys.c under #ifdef CONFIG_NET
and remove the dependency of CONFIG_THERMAL on CONFIG_NET from
drivers/thermal/Kconfig.

Signed-off-by: Rafael J. Wysocki <rjw@sisk.pl>
Acked-by: Randy Dunlap <randy.dunlap@oracle.com>
Cc: Ingo Molnar <mingo@elte.hu>
Cc: Len Brown <lenb@kernel.org>
Cc: Stephen Rothwell <sfr@canb.auug.org.au>
Cc: Luming Yu <luming.yu@intel.com>
Cc: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
2011-02-28 18:00:31 -08:00
Len Brown 156d821270 Merge branch 'misc' into release 2011-01-12 05:14:15 -05:00
R.Durgadoss 4cb1872870 thermal: Add event notification to thermal framework
This patch adds event notification support to the generic
thermal sysfs framework in the kernel. The notification is in the
form of a netlink event.

Signed-off-by: R.Durgadoss <durgadoss.r@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
2011-01-12 00:08:35 -05:00
Alan Cox 5b275ce270 thermal: make ops constant
And while touching that function definition do something about the disaster
of formatting there.

Signed-off-by: Alan Cox <alan@linux.intel.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
2010-11-30 18:56:23 -05:00
Sergey Senozhatsky 975f8c5653 drivers/thermal/thermal_sys.c: fix 'key f70f4b50 not in .data' in thermal_sys
Initialize sysfs attributes before device_create_file call.

Addresses https://bugzilla.kernel.org/show_bug.cgi?id=15548

Signed-off-by: Wolfram Sang <w.sang@pengutronix.de>
Signed-off-by: Sergey Senozhatsky <sergey.senozhatsky@gmail.com>
Cc: "Eric W. Biederman" <ebiederm@xmission.com>
Cc: Greg KH <gregkh@suse.de>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Len Brown <len.brown@intel.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
2010-04-07 08:38:03 -07:00
Tejun Heo 5a0e3ad6af include cleanup: Update gfp.h and slab.h includes to prepare for breaking implicit slab.h inclusion from percpu.h
percpu.h is included by sched.h and module.h and thus ends up being
included when building most .c files.  percpu.h includes slab.h which
in turn includes gfp.h making everything defined by the two files
universally available and complicating inclusion dependencies.

percpu.h -> slab.h dependency is about to be removed.  Prepare for
this change by updating users of gfp and slab facilities include those
headers directly instead of assuming availability.  As this conversion
needs to touch large number of source files, the following script is
used as the basis of conversion.

  http://userweb.kernel.org/~tj/misc/slabh-sweep.py

The script does the followings.

* Scan files for gfp and slab usages and update includes such that
  only the necessary includes are there.  ie. if only gfp is used,
  gfp.h, if slab is used, slab.h.

* When the script inserts a new include, it looks at the include
  blocks and try to put the new include such that its order conforms
  to its surrounding.  It's put in the include block which contains
  core kernel includes, in the same order that the rest are ordered -
  alphabetical, Christmas tree, rev-Xmas-tree or at the end if there
  doesn't seem to be any matching order.

* If the script can't find a place to put a new include (mostly
  because the file doesn't have fitting include block), it prints out
  an error message indicating which .h file needs to be added to the
  file.

The conversion was done in the following steps.

1. The initial automatic conversion of all .c files updated slightly
   over 4000 files, deleting around 700 includes and adding ~480 gfp.h
   and ~3000 slab.h inclusions.  The script emitted errors for ~400
   files.

2. Each error was manually checked.  Some didn't need the inclusion,
   some needed manual addition while adding it to implementation .h or
   embedding .c file was more appropriate for others.  This step added
   inclusions to around 150 files.

3. The script was run again and the output was compared to the edits
   from #2 to make sure no file was left behind.

4. Several build tests were done and a couple of problems were fixed.
   e.g. lib/decompress_*.c used malloc/free() wrappers around slab
   APIs requiring slab.h to be added manually.

5. The script was run on all .h files but without automatically
   editing them as sprinkling gfp.h and slab.h inclusions around .h
   files could easily lead to inclusion dependency hell.  Most gfp.h
   inclusion directives were ignored as stuff from gfp.h was usually
   wildly available and often used in preprocessor macros.  Each
   slab.h inclusion directive was examined and added manually as
   necessary.

6. percpu.h was updated not to include slab.h.

7. Build test were done on the following configurations and failures
   were fixed.  CONFIG_GCOV_KERNEL was turned off for all tests (as my
   distributed build env didn't work with gcov compiles) and a few
   more options had to be turned off depending on archs to make things
   build (like ipr on powerpc/64 which failed due to missing writeq).

   * x86 and x86_64 UP and SMP allmodconfig and a custom test config.
   * powerpc and powerpc64 SMP allmodconfig
   * sparc and sparc64 SMP allmodconfig
   * ia64 SMP allmodconfig
   * s390 SMP allmodconfig
   * alpha SMP allmodconfig
   * um on x86_64 SMP allmodconfig

8. percpu.h modifications were reverted so that it could be applied as
   a separate patch and serve as bisection point.

Given the fact that I had only a couple of failures from tests on step
6, I'm fairly confident about the coverage of this conversion patch.
If there is a breakage, it's likely to be something in one of the arch
headers which should be easily discoverable easily on most builds of
the specific arch.

Signed-off-by: Tejun Heo <tj@kernel.org>
Guess-its-ok-by: Christoph Lameter <cl@linux-foundation.org>
Cc: Ingo Molnar <mingo@redhat.com>
Cc: Lee Schermerhorn <Lee.Schermerhorn@hp.com>
2010-03-30 22:02:32 +09:00
Len Brown aa96ce0af8 Merge branch 'misc-2.6.33' into release 2009-12-16 14:22:32 -05:00
Roel Kluin edb9491852 thermal: Fix test of unsigned in thermal_cooling_device_cur_state_store()
state is unsigned long so the test did not work.

Signed-off-by: Roel Kluin <roel.kluin@gmail.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
2009-12-16 00:07:21 -05:00
Frans Pop 3767cb54ac thermal: disable polling if passive_delay and polling_delay are both unset
Otherwise polling will continue for the thermal zone even when
it is no longer needed, for example because forced passive cooling
was disabled.

Signed-off-by: Frans Pop <elendil@planet.nl>
Acked-by: Matthew Garrett <mjg@redhat.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2009-11-05 18:19:01 -05:00
Frans Pop e4143b0324 thermal: Only set passive_delay for forced_passive cooling
Setting polling_delay is useless as passive_delay has priority,
so the value shown in proc isn't the actual polling delay. It
also gives the impression to the user that he can change the
polling interval through proc, while in fact he can't.

Also, unset passive_delay when the forced passive trip point is
unbound to allow polling to be disabled.

Signed-off-by: Frans Pop <elendil@planet.nl>
Acked-by: Matthew Garrett <mjg@redhat.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2009-11-05 18:18:36 -05:00
Frans Pop 3d8e3ad879 thermal: add sanity check for the passive attribute
Values below 1000 milli-celsius don't make sense and can cause the
system to go into a thermal heart attack: the actual temperature
will always be lower and thus the system will be throttled down to
its lowest setting.

An additional problem is that values below 1000 will show as 0 in
/proc/acpi/thermal/TZx/trip_points:passive.

cat passive
0
echo -n 90 >passive
bash: echo: write error: Invalid argument
echo -n 90000 >passive
cat passive
90000

Signed-off-by: Frans Pop <elendil@planet.nl>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2009-11-05 18:18:10 -05:00
Amit Kucheria 625120a42b acpi: thermal: Add EOL to the trip_point_N_type strings
Make the trip_point_N_type sysfs files return a string ending in EOL for
consistency with other sysfs files.

Signed-off-by: Amit Kucheria <amit.kucheria@canonical.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2009-11-05 17:33:24 -05:00
Jan Beulich df43176c93 thermal: add missing Kconfig dependency
Otherwise THERMAL_HWMON can be selected when HWMON=n and THERMAL=n, which
fails to build.

Signed-off-by: Jan Beulich <jbeulich@novell.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Matthew Garrett <mjg@redhat.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2009-09-19 01:41:49 -04:00
Michael Brunner 0d288162f2 thermal_sys: check get_temp return value
The return value of the get_temp function is not checked when doing a
thermal zone update.  This may lead to a critical shutdown if get_temp
fails and the content of the temp variable is incorrectly set higher than
the critical trip point.

This has been observed on a system with incorrect ACPI implementation
where the corresponding methods were not serialized and therefore
sometimes triggered ACPI errors (AE_ALREADY_EXISTS).  The following
critical shutdowns indicated a temperature of 2097 C, which was obviously
wrong.

The patch adds a return value check that jumps over all trip point
evaluations printing a warning if get_temp fails.  The trip points are
evaluated again on the next polling interval with successful get_temp
execution.

Signed-off-by: Michael Brunner <mibru@gmx.de>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Cc: Len Brown <lenb@kernel.org>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
2009-08-26 20:06:52 -07:00
Greg Kroah-Hartman 0e968a3b6d thermal: remove driver_data direct access of struct device
In the near future, the driver core is going to not allow direct access
to the driver_data pointer in struct device.  Instead, the functions
dev_get_drvdata() and dev_set_drvdata() should be used.  These functions
have been around since the beginning, so are backwards compatible with
all older kernel versions.


Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>
2009-06-15 21:30:27 -07:00
Vladimir Zajac 29321357ac thermal: fix off-by-1 error in trip point trigger condition
This patch fixes a regression caused by commit
b1569e99c7
"ACPI: move thermal trip handling to generic thermal layer"
which accidentally changed trip point trigger condition to
  temp > trip_temp

This patch changes the trigger condition back to
  temp >= trip_temp

Signed-off-by: Vladimir Zajac <eightgraph@gmail.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Matthew Garrett <mjg@redhat.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2009-05-14 13:40:53 -04:00
Matthew Garrett 03a971a289 thermal: support forcing support for passive cooling
Due to poor thermal design or Linux driving hardware outside its thermal
envelope, some systems will reach critical temperature and shut down
under high load. This patch adds support for forcing a polling-based
passive trip point if the firmware doesn't provide one. The assumption
is made that the processor is the most practical means to reduce the
dynamic heat generation, so hitting the passive thermal limit will cause
the CPU to be throttled until the temperature stabalises around the
defined value.

UI is provided via a "passive" sysfs entry in the thermal zone
directory. It accepts a decimal value in millidegrees celsius, or "0" to
disable the functionality. Default behaviour is for this functionality
to be disabled.

Signed-off-by: Matthew Garrett <mjg@redhat.com>
Signed-off-by: Len Brown <len.brown@intel.com>
2009-03-27 16:58:22 -04:00
Matthew Garrett b1569e99c7 ACPI: move thermal trip handling to generic thermal layer
The ACPI code currently carries its own thermal trip handling, meaning that
any other thermal implementation will need to reimplement it. Move the code
to the generic thermal layer.

Signed-off-by: Matthew Garrett <mjg@redhat.com>
Signed-off-by: Len Brown <len.brown@intel.com>
2009-02-20 18:41:56 -05:00
Matthew Garrett 6503e5df08 thermal: use integers rather than strings for thermal values
The thermal API currently uses strings to pass values to userspace. This
makes it difficult to use from within the kernel. Change the interface
to use integers and fix up the consumers.

Signed-off-by: Matthew Garrett <mjg@redhat.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Thomas Renninger <trenn@suse.de>
Signed-off-by: Len Brown <len.brown@intel.com>
2009-02-20 10:52:37 -05:00
Kay Sievers 354655ea97 thermal: struct device - replace bus_id with dev_name(), dev_set_name()
Signed-off-by: Kay Sievers <kay.sievers@vrfy.org>
Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>
2009-01-06 10:44:37 -08:00
Rene Herman 16d7523973 thermal: Create CONFIG_THERMAL_HWMON=n
A bug in libsensors <= 2.10.6 is exposed
when this new hwmon I/F is enabled.
Create CONFIG_THERMAL_HWMON=n
until some time after libsensors 2.10.7 ships
so those users can run the latest kernel.

libsensors 3.x is already fixed -- those users
can use CONFIG_THERMAL_HWMON=y now.

Signed-off-by: Rene Herman <rene.herman@gmail.com>
Acked-by: Mark M. Hoffman <mhoffman@lightlink.com>
Signed-off-by: Len Brown <len.brown@intel.com>
2008-06-25 19:25:42 -04:00
Len Brown ff16cab69b thermal: re-name thermal.c to thermal_sys.c
thermal_sys was already the name of the resulting module,
and it is built from  this one source file.

Signed-off-by: Len Brown <len.brown@intel.com>
2008-04-29 03:12:17 -04:00
Zhang Rui e68b16abd9 thermal: add hwmon sysfs I/F
Add hwmon sys I/F for generic thermal driver.

Note: we have one hwmon class device for EACH TYPE of the thermal zone device.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Jean Delvare <khali@linux-fr.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2008-04-29 02:48:01 -04:00
Zhang Rui 63c4ec905d thermal: add the support for building the generic thermal as a module
Build the generic thermal driver as module "thermal_sys".

Make ACPI thermal, video, processor and fan SELECT the generic
thermal driver, as these drivers rely on it to build the sysfs I/F.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Jean Delvare <khali@linux-fr.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2008-04-29 02:44:00 -04:00
Krzysztof Helt 5f1a3f2ac4 acpi thermal trip points increased to 12
The THERMAL_MAX_TRIPS value is set to 10.  It is too few for the Compaq AP550
machine which has 12 trip points.

Signed-off-by: Krzysztof Helt <krzysztof.h1@wp.pl>
Cc: Len Brown <lenb@kernel.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: "Rafael J. Wysocki" <rjw@sisk.pl>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
2008-04-15 19:35:41 -07:00
Len Brown ece54e2ff4 thermal: delete "default y"
The generic thermal I/F gets selected by ACPI_THERMAL --
its only current customer.
it doesn't need to clutter other configs by default.

Signed-off-by: Len Brown <len.brown@intel.com>
2008-03-18 01:22:10 -04:00
Len Brown 91f57fa121 Revert "thermal: fix generic thermal I/F for hwmon"
This reverts commit 3152fb9f11.

This broke libsensors.

Acked-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Jean Delvare <khali@linux-fr.org>
Signed-off-by: Len Brown <len.brown@intel.com>
2008-03-18 01:14:37 -04:00
Zhang, Rui 3152fb9f11 thermal: fix generic thermal I/F for hwmon
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
2008-03-13 01:49:01 -04:00
Thomas Sujith 3e6fda5c11 thermal: use ERR_PTR for returning error
Need to return using ERR_PTR instead of NULL
in case of errors.

Signed-off-by: Thomas Sujith <sujith.thomas@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
2008-02-15 18:21:30 -05:00
Thomas Sujith c751670902 thermal: validate input parameters
Added sanity check to make sure that thermal zone
and cooling device exists.

Signed-off-by: Thomas Sujith <sujith.thomas@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
2008-02-15 18:21:30 -05:00
Len Brown 543a956140 ACPI: thermal: syntax, spelling, kernel-doc
Reviewed-by: Randy Dunlap <randy.dunlap@oracle.com>
Signed-off-by: Len Brown <len.brown@intel.com>
2008-02-07 23:48:04 -05:00
Zhang Rui 203d3d4aa4 the generic thermal sysfs driver
The Generic Thermal sysfs driver for thermal management.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Thomas Sujith <sujith.thomas@intel.com>
Signed-off-by: Len Brown <len.brown@intel.com>
2008-02-01 23:12:19 -05:00