It appears that the DA8xx/OMAP-L1x glue layer went into the kernel uncompilable:
commit 1960e693ac (davinci: da8xx/omapl1: add
support for the second sysconfig module) has renamed DA8XX_SYSCFG_* macros to
DA8XX_SYSCFG0_* and it's been committed before the glue layer...
Signed-off-by: Sergei Shtylyov <sshtylyov@ru.mvista.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>
Texas Instruments DA8xx/OMAP-L1x OHCI glue layer.
This OHCI implementation is not without quirks: there's only one physical port
despite the root hub reporting two; the port's power control and over-current
status bits are not connected to any pins, however, at least on the DA830 EVM
board, those signals are connected via GPIO, thus the provision was made for
overriding the OHCI port power and over-current bits at the board level...
Signed-off-by: Mikhail Cherkashin <mcherkashin@ru.mvista.com>
Signed-off-by: Sergei Shtylyov <sshtylyov@ru.mvista.com>
Signed-off-by: Greg Kroah-Hartman <gregkh@suse.de>
Sergei Shtylyov