Commit Graph

21 Commits

Author SHA1 Message Date
Markus Elfring 9ca9be2b09 ti-soc-thermal: Delete an unnecessary check before the function call "cpufreq_cooling_unregister"
The cpufreq_cooling_unregister() function tests whether its argument is NULL
and then returns immediately. Thus the test around the call is not needed.

This issue was detected by using the Coccinelle software.

Signed-off-by: Markus Elfring <elfring@users.sourceforge.net>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-02-24 14:26:56 -04:00
Grygorii Strashko 3992b62da7 thermal: ti-soc-thermal: bandgap: Fix build warning if !CONFIG_PM_SLEEP
Fix following build warning if CONFIG_PM_SLEEP is not set:

drivers/thermal/ti-soc-thermal/ti-bandgap.c:1478:12: warning: 'ti_bandgap_suspend' defined but not used [-Wunused-function]
 static int ti_bandgap_suspend(struct device *dev)
            ^
drivers/thermal/ti-soc-thermal/ti-bandgap.c:1492:12: warning: 'ti_bandgap_resume' defined but not used [-Wunused-function]
 static int ti_bandgap_resume(struct device *dev)
            ^
Acked-by: Nishanth Menon <nm@ti.com>
Signed-off-by: Grygorii Strashko <Grygorii.Strashko@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-02-24 14:06:05 -04:00
Zhang Rui 32c9edc4e3 Merge branch 'fixes' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into thermal-soc 2014-12-21 22:49:12 +08:00
Eduardo Valentin cffafc3247 thermal: ti-soc-thermal: Do not print error message in the EPROBE_DEFER case
Avoid printing the error message in the EPROBE_DEFER case
where registering cpu cooling at ti-soc-thermal thermal driver.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-12-12 10:08:31 -04:00
Eduardo Valentin 0f1be51c35 thermal: cpu_cooling: check for the readiness of cpufreq layer
In this patch, the cpu_cooling code checks for the usability of cpufreq
layer before proceeding with the CPU cooling device registration. The
main reason is: CPU cooling device is not usable if cpufreq cannot
switch frequencies.

Similar checks are spread in thermal drivers. Thus, the advantage now
is to have the check in a single place: cpu cooling device registration.
For this reason, this patch also updates the existing drivers that
depend on CPU cooling to simply propagate the error code of the cpu
cooling registration call. Therefore, in case cpufreq is not ready, the
thermal drivers will still return -EPROBE_DEFER, in an attempt to try
again when cpufreq layer gets ready.

Cc: devicetree@vger.kernel.org
Cc: Grant Likely <grant.likely@linaro.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: linux-samsung-soc@vger.kernel.org
Cc: Naveen Krishna Chatradhi <ch.naveen@samsung.com>
Cc: Rob Herring <robh+dt@kernel.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-12-08 12:08:53 -04:00
Eduardo Valentin 2251aef64a thermal: of: improve of-thermal sensor registration API
Different drivers request API extensions in of-thermal. For this reason,
additional callbacks are required to fit the new drivers needs.

The current API implementation expects the registering sensor driver
to provide a get_temp and get_trend callbacks as function parameters.
As the amount of callbacks is growing, this patch changes the existing
implementation to use a .ops field to hold all the of thermal callbacks
to sensor drivers.

This patch also changes the existing of-thermal users to fit the new
API design. No functional change is introduced in this patch.

Cc: Alexandre Courbot <gnurou@gmail.com>
Cc: devicetree@vger.kernel.org
Cc: Grant Likely <grant.likely@linaro.org>
Cc: Guenter Roeck <linux@roeck-us.net>
Cc: Jean Delvare <jdelvare@suse.de>
Cc: linux-kernel@vger.kernel.org
Cc: linux-pm@vger.kernel.org
Cc: linux-tegra@vger.kernel.org
Cc: lm-sensors@lm-sensors.org
Cc: Rob Herring <robh+dt@kernel.org>
Cc: Stephen Warren <swarren@wwwdotorg.org>
Cc: Thierry Reding <thierry.reding@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Acked-by: Guenter Roeck <linux@roeck-us.net>
Tested-by: Mikko Perttunen <mikko.perttunen@kapsi.fi>
Reviewed-by: Mikko Perttunen <mikko.perttunen@kapsi.fi>
Reviewed-by: Alexandre Courbot <acourbot@nvidia.com>
Reviewed-by: Lukasz Majewski <l.majewski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-11-20 10:44:54 -04:00
Rickard Strandqvist fbe2ddcdcc thermal: ti-soc-thermal: ti-bandgap.c: Cleaning up wrong address is checked
Wrong address is checked after memory allocation.

Signed-off-by: Rickard Strandqvist <rickard_strandqvist@spectrumdigital.se>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-07-01 09:52:35 +08:00
Paul Walmsley c68789e534 thermal: ti-soc-thermal: clk_round_rate() can return a zero upon error
Treat both negative and zero return values from clk_round_rate() as
errors.  This is needed since subsequent patches will convert
clk_round_rate()'s return value to be an unsigned type, rather than a
signed type, since some clock sources can generate rates higher than
(2^31)-1 Hz.

Eventually, when calling clk_round_rate(), only a return value of zero
will be considered a error.  All other values will be considered valid
rates.  The comparison against values less than 0 is kept to preserve
the correct behavior in the meantime.

This patch also gets rid of a comparison between unsigned and signed
values; a side-benefit.

Signed-off-by: Paul Walmsley <pwalmsley@nvidia.com>
Cc: Eduardo Valentin <eduardo.valentin@ti.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-05-06 14:35:19 -04:00
Jingoo Han 5204f8c0a7 thermal: ti-soc-thermal: Use SIMPLE_DEV_PM_OPS macro
Use SIMPLE_DEV_PM_OPS macro in order to make the code simpler.

Signed-off-by: Jingoo Han <jg1.han@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-04-08 09:01:38 +08:00
Eduardo Valentin 26d9cc65fa thermal: ti-soc-thermal: use thermal DT infrastructure
This patch improves the ti-soc-thermal driver by adding the
support to build the thermal zones based on DT nodes.

The driver will have two options now to build the thermal
zones. The first option is the zones originally coded
in this driver. So, the driver behavior will be same
if there is no DT node describing the zones. The second
option, when it is found a DT node with thermal data,
will used the common infrastructure to build the thermal
zone and bind its cooling devices.

In case the driver loads thermal data using the legacy
mode, this driver still adds to the system
a cpufreq cooling device. Loading the thermal data from
DT, the driver assumes someone else will add the cpufreq
cooling device, like the cpufreq driver.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-12-04 09:34:25 -04:00
Eduardo Valentin df8f134764 drivers: thermal: allow ti-soc-thermal run without pcb zone
This patch changes the behavior of TI SoC thermal driver
when there is a PCB thermal zone.

Instead of reporting an error code when reading from
PCB temperature sensor fails, this patch will make
the driver attempt to compose the hotspot extrapolation
based on bandgap readings only.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-10-15 10:10:43 -04:00
Ranganath Krishnan e838ff8119 thermal: ti-soc-thermal: Ensure to compute thermal trend
Workaround to compute thermal trend even when update interval
is not set. This patch will ensure to compute the thermal trend
when bandgap counter delay is not set.

Signed-off-by: Ranganath Krishnan <ranganath@ti.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-29 09:36:18 -04:00
Ranganath Krishnan 10ccff1b57 thermal: ti-soc-thermal: Set the bandgap mask counter delay value
Set the bandgap mask counter_delay with the polling_delay value on
registering the thermal zone. This patch will ensure to get the
correct update interval for computing the thermal trend.

Signed-off-by: Ranganath Krishnan <ranganath@ti.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-29 09:36:16 -04:00
Ranganath Krishnan 547f72ab7d thermal: ti-soc-thermal: Initialize counter_delay field for TI DRA752 sensors
Initialize MPU, GPU, CORE, DSPEVE and IVA thermal sensors of DRA752 bandgap
with the counter delay mask.

Signed-off-by: Ranganath Krishnan <ranganath@ti.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-29 09:36:13 -04:00
Eduardo Valentin 57d1617137 thermal: ti-soc-thermal: use standard GPIO DT bindings
This change updates the ti-soc-thermal driver to use
standard GPIO DT bindings to read the GPIO number associated
to thermal shutdown IRQ, in case the device features it.

Previously, the code was using a specific DT bindings.
As now OMAP supports the standard way to model GPIOs,
there is no point in having a ti specific binding.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Grant Likely <grant.likely@linaro.org>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: devicetree-discuss@lists.ozlabs.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-07-08 10:11:59 -04:00
Eduardo Valentin 25870e6234 thermal: ti-soc-thermal: add dra752 chip to device table
Add support to TI dra752 chips by adapting the driver
device table.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-06-13 10:16:07 +08:00
Eduardo Valentin 8926fa4f9b thermal: ti-soc-thermal: add thermal data for DRA752 chips
This patch adds the thermal data for TI DRA752 chips.
In this change it includes (autogen):
. Register offset definitions
. Bitfields and masks for all registers
. Conversion table

Also, the thermal limits, thresholds and extrapolation
rules are included. The extrapolation rule is simply
add +2C as margin.

All 5 sensors, MPU, GPU, CORE, DSPEVE and IVA, are defined
and exposed. Only MPU has cooling device.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-06-13 10:15:52 +08:00
Eduardo Valentin 0c12b5ac82 thermal: ti-soc-thermal: remove usage of IS_ERR_OR_NULL
This patch changes the driver to avoid the usage of IS_ERR_OR_NULL()
macro. This macro can lead to dangerous results, like returning
success (0) during a failure scenario (NULL pointer handling).

For this reason this patch is changing the driver after
revisiting the code. These are the cases:
i. For cases in which IS_ERR_OR_NULL() is used for checking
return values of functions that returns either PTR_ERR()
or a valid pointer, it has been translated to IS_ERR() check only.
ii. For cases that a NULL check is still needed, it has been
translated to if (!ptr || IS_ERR(ptr)).

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-06-13 10:14:00 +08:00
Eduardo Valentin ba0049eacc thermal: ti-soc-thermal: freeze FSM while computing trend
In order to read the history buffer, it is required to
freeze BG FSM. This patch adds the missing piece of code
to freeze the FSM and also a contention area to avoid
other parts of the code to access the DTEMPs.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-06-13 10:13:52 +08:00
Eduardo Valentin 359836e1de thermal: ti-soc-thermal: remove external heat while extrapolating hotspot
For boards that provide a PCB sensor close to SoC junction
temperature, it is possible to remove the cumulative heat
reported by the SoC temperature sensor.

This patch changes the extrapolation computation to consider
an external sensor in the extrapolation equations.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-06-13 10:12:22 +08:00
Eduardo Valentin eb982001db thermal: introduce TI SoC thermal driver
This patch moves the ti-soc-thermal driver out of
the staging tree to the thermal tree.

Cc: Grant Likely <grant.likely@linaro.org>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: Rob Landley <rob@landley.net>
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <eduardo.valentin@ti.com>
Cc: J Keerthy <j-keerthy@ti.com>
Cc: Radhesh Fadnis <radhesh.fadnis@ti.com>
Cc: Cyril Roelandt <tipecaml@gmail.com>
Cc: devicetree-discuss@lists.ozlabs.org
Cc: linux-doc@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: devel@driverdev.osuosl.org
Cc: linux-pm@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-05-28 10:40:37 +08:00