Commit Graph

7 Commits

Author SHA1 Message Date
Viresh Kumar ac89c400eb cpu_cooling: Remove static-power related documentation
commit 84fe2cab48 ("cpu_cooling: Drop static-power related stuff")
removed support for static-power in kernel, but it missed reflecting the
same in documentation. Remove the static power related documentation
bits as well.

Reported-by: Javi Merino <javi.merino@kernel.org>
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2018-01-03 13:11:48 +01:00
Viresh Kumar 3ebb62ffc4 cpu_cooling: Keep only one of_cpufreq*cooling_register() helper
of_cpufreq_cooling_register() isn't used by anyone and so can be
removed, but then we would be left with two routines:
cpufreq_cooling_register() and of_cpufreq_power_cooling_register() that
would look odd.

Remove current implementation of of_cpufreq_cooling_register() and
rename of_cpufreq_power_cooling_register() as
of_cpufreq_cooling_register(). This simplifies lots of stuff.

Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2017-12-07 22:52:01 +01:00
Viresh Kumar ba0966da20 cpu_cooling: Remove unused cpufreq_power_cooling_register()
It isn't used by anyone, drop it.

Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2017-12-07 22:52:01 +01:00
Viresh Kumar f5f263fed6 cpu_cooling: Make of_cpufreq_power_cooling_register() parse DT
All the callers of of_cpufreq_power_cooling_register() have almost
identical code and it makes more sense to move that code into the helper
as its all about reading DT properties.

This got rid of lot of redundant code.

Acked-by: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2017-12-07 22:52:01 +01:00
Javi Merino c36cf07176 thermal: cpu_cooling: implement the power cooling device API
Add a basic power model to the cpu cooling device to implement the
power cooling device API.  The power model uses the current frequency,
current load and OPPs for the power calculations.  The cpus must have
registered their OPPs using the OPP library.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Kapileshwar Singh <kapileshwar.singh@arm.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:52 -07:00
Javi Merino 9477e18dd5 Documentation: thermal: document of_cpufreq_cooling_register()
Commit 39d99cff76 ("thermal: cpu_cooling: introduce
of_cpufreq_cooling_register") taught the cpu cooling device to register
devices that were linked to the device tree but didn't update the
cpu-cooling-api documentation.  Fix it.

Cc: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Cc: Jonathan Corbet <corbet@lwn.net>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-01-06 14:39:17 -04:00
Amit Daniel Kachhap 0236141837 thermal: add generic cpufreq cooling implementation
This patchset introduces a new generic cooling device based on cpufreq
that can be used on non-ACPI platforms.  As a proof of concept, we have
drivers for the following platforms using this mechanism now:

 * Samsung Exynos (Exynos4 and Exynos5) in the current patchset.
 * Freescale i.MX (git://git.linaro.org/people/amitdanielk/linux.git imx6q_thermal)

There is a small change in cpufreq cooling registration APIs, so a minor
change is needed for Freescale platforms.

Brief Description:

1) The generic cooling devices code is placed inside driver/thermal/*
   as placing inside acpi folder will need un-necessary enabling of acpi
   code.  This code is architecture independent.

2) This patchset adds generic cpu cooling low level implementation
   through frequency clipping.  In future, other cpu related cooling
   devices may be added here.  An ACPI version of this already exists
   (drivers/acpi/processor_thermal.c) .But this will be useful for
   platforms like ARM using the generic thermal interface along with the
   generic cpu cooling devices.  The cooling device registration API's
   return cooling device pointers which can be easily binded with the
   thermal zone trip points.  The important APIs exposed are,

   a) struct thermal_cooling_device *cpufreq_cooling_register(
        struct cpumask *clip_cpus)
   b) void cpufreq_cooling_unregister(struct thermal_cooling_device *cdev)

3) Samsung exynos platform thermal implementation is done using the
   generic cpu cooling APIs and the new trip type.  The temperature sensor
   driver present in the hwmon folder(registered as hwmon driver) is moved
   to thermal folder and registered as a thermal driver.

A simple data/control flow diagrams is shown below,

Core Linux thermal <----->  Exynos thermal interface <----- Temperature Sensor
          |                             |
         \|/                            |
  Cpufreq cooling device <---------------

TODO:
*Will send the DT enablement patches later after the driver is merged.

This patch:

Add support for generic cpu thermal cooling low level implementations
using frequency scaling up/down based on the registration parameters.
Different cpu related cooling devices can be registered by the user and
the binding of these cooling devices to the corresponding trip points can
be easily done as the registration APIs return the cooling device pointer.
The user of these APIs are responsible for passing clipping frequency .
The drivers can also register to recieve notification about any cooling
action called.

[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Cc: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:38 +08:00