Commit Graph

65 Commits

Author SHA1 Message Date
Zhang Rui 63745aa72e Merge branches 'armada-375-380-soc-support', 'eduardo-thermal-soc-fixes', 'intel-soc-dts-thermal' and 'thermal-soc-fixes' of .git into next 2014-05-15 17:18:02 +08:00
Zhang Rui 9550b8d1dc Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into thermal-soc-fixes 2014-05-15 16:41:34 +08:00
Srinivas Pandruvada bc40b5e320 thermal: Intel SoC DTS thermal
In the Intel SoCs like Bay Trail, there are 2 additional digital temperature
sensors(DTS), in addition to the standard DTSs in the core. Also they support
4 programmable thresholds, out of which two can be used by OSPM. These
thresholds can be used by OSPM thermal control. Out of these two thresholds,
one is used by driver and one user mode can change via thermal sysfs to get
notifications on threshold violations.

The driver defines one critical trip points, which is set to TJ MAX - offset.
The offset can be changed via module parameter (default 5C). Also it uses
one of the thresholds to get notification for this temperature violation.
This is very important for orderly shutdown as the many of these devices don't
have ACPI thermal zone, and expects that there is some other thermal control
mechanism present in OSPM. When a Linux distro is used without additional
specialized thermal control program, BIOS can do force shutdown when thermals
are not under control. When temperature reaches critical, the Linux thermal
core will initiate an orderly shutdown.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-05-15 16:37:24 +08:00
Bartlomiej Zolnierkiewicz 4de458174a thermal: offer Samsung thermal support only when ARCH_EXYNOS is defined
Menu for Samsung thermal support is visible on all Samsung
platforms while thermal drivers are currently available only
for EXYNOS SoCs. Fix it by replacing PLAT_SAMSUNG dependency
with ARCH_EXYNOS one.

Signed-off-by: Bartlomiej Zolnierkiewicz <b.zolnierkie@samsung.com>
Signed-off-by: Kyungmin Park <kyungmin.park@samsung.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-05-06 14:51:32 -04:00
Linus Torvalds cbda94e039 ARM: SoC: driver changes
These changes are mostly for ARM specific device drivers that either
 don't have an upstream maintainer, or that had the maintainer ask
 us to pick up the changes to avoid conflicts. A large chunk of this
 are clock drivers (bcm281xx, exynos, versatile, shmobile), aside from
 that, reset controllers for STi as well as a large rework of the
 Marvell Orion/EBU watchdog driver are notable.
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Merge tag 'drivers-3.15' of git://git.kernel.org/pub/scm/linux/kernel/git/arm/arm-soc

Pull ARM SoC driver changes from Arnd Bergmann:
 "These changes are mostly for ARM specific device drivers that either
  don't have an upstream maintainer, or that had the maintainer ask us
  to pick up the changes to avoid conflicts.

  A large chunk of this are clock drivers (bcm281xx, exynos, versatile,
  shmobile), aside from that, reset controllers for STi as well as a
  large rework of the Marvell Orion/EBU watchdog driver are notable"

* tag 'drivers-3.15' of git://git.kernel.org/pub/scm/linux/kernel/git/arm/arm-soc: (99 commits)
  Revert "dts: socfpga: Add DTS entry for adding the stmmac glue layer for stmmac."
  Revert "net: stmmac: Add SOCFPGA glue driver"
  ARM: shmobile: r8a7791: Fix SCIFA3-5 clocks
  ARM: STi: Add reset controller support to mach-sti Kconfig
  drivers: reset: stih416: add softreset controller
  drivers: reset: stih415: add softreset controller
  drivers: reset: Reset controller driver for STiH416
  drivers: reset: Reset controller driver for STiH415
  drivers: reset: STi SoC system configuration reset controller support
  dts: socfpga: Add sysmgr node so the gmac can use to reference
  dts: socfpga: Add support for SD/MMC on the SOCFPGA platform
  reset: Add optional resets and stubs
  ARM: shmobile: r7s72100: fix bus clock calculation
  Power: Reset: Generalize qnap-poweroff to work on Synology devices.
  dts: socfpga: Update clock entry to support multiple parents
  ARM: socfpga: Update socfpga_defconfig
  dts: socfpga: Add DTS entry for adding the stmmac glue layer for stmmac.
  net: stmmac: Add SOCFPGA glue driver
  watchdog: orion_wdt: Use %pa to print 'phys_addr_t'
  drivers: cci: Export CCI PMU revision
  ...
2014-04-05 15:37:40 -07:00
Richard Weinberger d1c8b0410b thermal,rcar_thermal: Add dependency on HAS_IOMEM
Commit beeb5a1e (thermal: rcar-thermal: Enable driver compilation with COMPILE_TEST)
broke build on archs wihout io memory.

On archs like S390 or um this driver cannot build nor work.
Make it depend on HAS_IOMEM to bypass build failures.

drivers/thermal/rcar_thermal.c:404: undefined reference to `devm_ioremap_resource'
drivers/thermal/rcar_thermal.c:426: undefined reference to `devm_ioremap_resource'

Signed-off-by: Richard Weinberger <richard@nod.at>
Acked-by: Laurent Pinchart <laurent.pinchart@ideasonboard.com>
Acked-by: Kuninori Morimoto <kuninori.morimoto.gx@renesas.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-03-03 23:15:02 +08:00
Zhang Rui 37d6a82bd9 Thermal: update INT3404 thermal driver help text
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-03-03 23:12:49 +08:00
Andrew Lunn ff1f0018cf drivers: Enable building of Kirkwood drivers for mach-mvebu
With the move of kirkwood into mach-mvebu, drivers Kconfig need
tweeking to allow the kirkwood specific drivers to be built.

Signed-off-by: Andrew Lunn <andrew@lunn.ch>
Acked-by: Arnd Bergmann <arnd@arndb.de>
Acked-by: Mark Brown <broonie@linaro.org>
Acked-by: Kishon Vijay Abraham I <kishon@ti.com>
Acked-by: Daniel Lezcano <daniel.lezcano@linaro.org>
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Tested-by: Jason Gunthorpe <jgunthorpe@obsidianresearch.com>
Cc: Viresh Kumar <viresh.kumar@linaro.org>
Cc: Rafael J. Wysocki <rjw@rjwysocki.net>
Cc: Richard Purdie <rpurdie@rpsys.net>
Cc: Bryan Wu <cooloney@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Jason Cooper <jason@lakedaemon.net>
2014-02-24 17:28:31 +00:00
Zhang Rui 201531c277 Merge branches 'misc', 'soc', 'soc-eduardo' and 'int3404-thermal' of .git into next 2014-01-02 14:22:28 +08:00
Laurent Pinchart beeb5a1e0e thermal: rcar-thermal: Enable driver compilation with COMPILE_TEST
This helps increasing build testing coverage.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <eduardo.valentin@ti.com>
Cc: linux-pm@vger.kernel.org
Signed-off-by: Laurent Pinchart <laurent.pinchart+renesas@ideasonboard.com>
Acked-by: Simon Horman <horms@verge.net.au>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-01-02 10:54:56 +08:00
Srinivas Pandruvada 925c36bb09 Thermal: ACPI INT3403 thermal driver
The ACPI INT3403 device objects present on some systems can be used to retrieve
temperature data from thermal sensors. Add a driver registering each INT3403
device object as a thermal zone device and exposing its _TMP, PATx and GTSH
method via the standard thermal control interface under /sys/class/thermal/.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-01-02 09:42:12 +08:00
Eduardo Valentin 39d99cff76 thermal: cpu_cooling: introduce of_cpufreq_cooling_register
This patch introduces an API to register cpufreq cooling device
based on device tree node.

The registration via device tree node differs from normal
registration due to the fact that it is needed to fill
the device_node structure in order to be able to match
the cooling devices with trip points.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-12-04 09:33:34 -04:00
Eduardo Valentin 4e5e4705bf thermal: introduce device tree parser
This patch introduces a device tree bindings for
describing the hardware thermal behavior and limits.
Also a parser to read and interpret the data and feed
it in the thermal framework is presented.

This patch introduces a thermal data parser for device
tree. The parsed data is used to build thermal zones
and thermal binding parameters. The output data
can then be used to deploy thermal policies.

This patch adds also documentation regarding this
API and how to define tree nodes to use
this infrastructure.

Note that, in order to be able to have control
on the sensor registration on the DT thermal zone,
it was required to allow changing the thermal zone
.get_temp callback. For this reason, this patch
also removes the 'const' modifier from the .ops
field of thermal zone devices.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: Mark Rutland <mark.rutland@arm.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-12-04 09:31:34 -04:00
Linus Torvalds 549608eadb Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management updates from Zhang Rui:
 "This time we only have a few changes as there are no soc thermal
  changes from Eduardo.  The only big change is the introduction of
  TMON, a tool to help visualize, tune, and test the thermal subsystem.
  The rest is mostly cleanups and fixes all over.

  Specifics:

   - introduce TMON, a tool base on thermal sysfs I/F.  It can be used
     to visualize, tune and test the thermal subsystem.

   - fix a zone/cooling device binding problem, when both thermal zone
     bind parameters and .bind() callback are available"

* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux:
  tools/thermal: Introduce tmon, a tool for thermal subsystem
  thermal: Fix binding problem when there is thermal zone params
  thermal: cpu_cooling: fix return value check in cpufreq_cooling_register()
  Thermal: Check for validity before doing kfree
  thermal/intel_powerclamp: Add newer CPU models
  Thermal: Tidy up error handling in powerclamp_init
  thermal: Kconfig: cosmetic fixes
  ACPI/thermal : Remove zone disabled warning
  typo in drivers/thermal/Kconfig: lpatform instead of platform
2013-11-14 14:42:31 +09:00
Viresh Kumar 3bc28ab6da cpufreq: remove CONFIG_CPU_FREQ_TABLE
CONFIG_CPU_FREQ_TABLE will be always enabled when cpufreq framework is used, as
cpufreq core depends on it. So, we don't need this CONFIG option anymore as it
is not configurable. Remove CONFIG_CPU_FREQ_TABLE and update its users.

Signed-off-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2013-10-16 00:50:33 +02:00
Luka Perkov a822794886 thermal: Kconfig: cosmetic fixes
Fix typo, finish sentence and add missing dots.

Signed-off-by: Luka Perkov <luka@openwrt.org>
CC: Randy Dunlap <rdunlap@infradead.org>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-10-09 11:51:43 +08:00
Regid Ichira ece238fe0a typo in drivers/thermal/Kconfig: lpatform instead of platform
Applied to the HEAD of linux.git,
                       VERSION = 3 PATCHLEVEL = 11 SUBLEVEL = 0
Signed-off-by: Regid Ichira <regid23@nt1.in>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-09-25 21:29:00 +08:00
Eduardo Valentin 0dd88793aa thermal: hwmon: move hwmon support to single file
In order to improve code organization, this patch
moves the hwmon sysfs support to a file named
thermal_hwmon. This helps to add extra support
for hwmon without scrambling the code.

In order to do this move, the hwmon list head is now
using its own locking. Before, the list used
the global thermal locking. Also, some minor changes
in the code were required, as recommended by checkpatch.pl.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-09-03 09:09:12 -04:00
Zhang Rui 036e8a13b8 Merge branches 'exynos', 'imx' and 'fixes' of .git into next 2013-08-15 15:25:27 +08:00
Amit Daniel Kachhap c68213780e thermal: exynos: Moving exynos thermal files into samsung directory
This movement of files is done for easy maintenance and adding more
new sensor's support for exynos platform easily . This will also help in
bifurcating exynos common, sensor driver and sensor data related parts.

Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Acked-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13 09:51:59 -04:00
Shawn Guo ca3de46b50 thermal: add imx thermal driver support
This is based on the initial imx thermal work done by
Rob Lee <rob.lee@linaro.org> (Not sure if the email address is still
valid).  Since he is no longer interested in the work and I have
rewritten a significant amount of the code, I just took the authorship
over from him.

It adds the imx thermal support using Temperature Monitor (TEMPMON)
block found on some Freescale i.MX SoCs.  The driver uses syscon regmap
interface to access TEMPMON control registers and calibration data, and
supports cpufreq as the cooling device.

Signed-off-by: Shawn Guo <shawn.guo@linaro.org>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
2013-08-13 09:45:34 -04:00
Zhang Rui 9d1968fdab Merge branch 'cpu-package-thermal' of .git into next 2013-06-18 07:26:49 +08:00
Randy Dunlap b3ba020652 thermal: fix x86_pkg_temp_thermal.c build and Kconfig
Fix build error in x86_pkg_temp_thermal.c.  It requires that
X86_MCE & X86_THERMAL_VECTOR be enabled, so depend on the latter symbol,
since it depends on X86_MCE (indirectly).

Also, X86_PKG_TEMP_THERMAL is already inside an "if THERMAL" block,
so remove that duplicated dependency.

ERROR: "platform_thermal_package_rate_control" [drivers/thermal/x86_pkg_temp_thermal.ko] undefined!
ERROR: "platform_thermal_package_notify" [drivers/thermal/x86_pkg_temp_thermal.ko] undefined!

Signed-off-by: Randy Dunlap <rdunlap@infradead.org>
Acked-by: Borislav Petkov <bp@suse.de>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-06-18 07:26:24 +08:00
Zhang Rui f157f5964b Merge branch 'cpu-package-thermal' of .git into next
Conflicts:
	drivers/thermal/Kconfig
	drivers/thermal/Makefile
2013-06-18 06:31:26 +08:00
Srinivas Pandruvada f1a18a1056 Thermal: CPU Package temperature thermal
This driver register CPU digital temperature sensor as a thermal
zone at package level.
Each package will show up as one zone with at max two trip points.
These trip points can be both read and updated. Once a non zero
value is set in the trip point, if the package package temperature
goes above or below this setting, a thermal notification is
generated.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-06-18 06:27:47 +08:00
Eduardo Valentin eb982001db thermal: introduce TI SoC thermal driver
This patch moves the ti-soc-thermal driver out of
the staging tree to the thermal tree.

Cc: Grant Likely <grant.likely@linaro.org>
Cc: Rob Herring <rob.herring@calxeda.com>
Cc: Rob Landley <rob@landley.net>
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <eduardo.valentin@ti.com>
Cc: J Keerthy <j-keerthy@ti.com>
Cc: Radhesh Fadnis <radhesh.fadnis@ti.com>
Cc: Cyril Roelandt <tipecaml@gmail.com>
Cc: devicetree-discuss@lists.ozlabs.org
Cc: linux-doc@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: devel@driverdev.osuosl.org
Cc: linux-pm@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-05-28 10:40:37 +08:00
Eduardo Valentin f7188b3dde thermal: cpu_cooling: update Kconfig entry
There is no support for hotplug or any other means of reducing
temperature. So, this patch removes these references from Kconfig.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-25 00:34:40 +08:00
Zhang Rui bbf7fc88c7 Thermal: build cpu_cooling code into thermal_sys module
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
Acked-by: Eduardo Valentin <eduardo.valentin@ti.com>
Acked-by: Durgadoss R <durgadoss.r@intel.com>
2013-04-14 23:28:49 +08:00
Eduardo Valentin 8837295a73 thermal: add a warning for temperature emulation feature
Because this feature is for debuging purposes, it is highly
recommended to do not enable this on production systems.
This patch adds warnings for system integrators, so that
people are aware of this potential security issue.

Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-02 21:34:42 +08:00
Amit Daniel Kachhap bffd1f8ac8 thermal: exynos: Adapt to temperature emulation core thermal framework
This removes the driver specific sysfs support of the temperature
emulation and uses the newly added core thermal framework for thermal
emulation. An exynos platform specific handler is added to support this.

In this patch, the exynos senor(tmu) related code and exynos framework
related (thermal zone, cooling devices) code are intentionally kept separate.
So an emulated function pointer is passed from sensor to framework. This is
beneficial in adding more sensor support using the same framework code
which is an ongoing work. The goal is to finally split them totally. Even
the existing read_temperature also follows the same execution method.

Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-02 21:29:54 +08:00
Ezequiel Garcia fa0d654c84 thermal: Add driver for Armada 370/XP SoC thermal management
This driver supports both Armada 370 and Armada XP SoC
thermal management controllers.

Armada 370 has a register to check a valid temperature, whereas
Armada XP does not. Each has a different initialization (i.e. calibration)
function. The temperature conversion formula is the same for both.

The controller present in each SoC have a very similar feature set,
so it corresponds to have one driver to support both of them.

Although this driver may present similarities to Dove and Kirkwood
thermal driver, the exact differences and coincidences are not fully
known. For this reason, support is given through a separate driver.

Signed-off-by: Ezequiel Garcia <ezequiel.garcia@free-electrons.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-04-02 21:04:09 +08:00
Zhang Rui 9d185d0417 Thermal: rename thermal governor Kconfig option to avoid generic naming
Currently, we have three Kconfig options for thermal governors, aka,
CONFIG_FAIR_SHARE, CONFIG_USER_SPACE and CONFIG_STEP_WISE.
But these names are too generic that may bring confusion to users.

Rename them to CONFIG_THERMAL_GOV_FAIR_SHARE,
CONFIG_THERMAL_GOV_USER_SPACE, CONFIG_THERMAL_GOV_STEP_WISE
to avoid the generic naming.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08 20:33:42 +08:00
Andrew Lunn 74ffa64c23 Thermal: Dove: Add Themal sensor support for Dove.
The Marvell Dove SoC has a thermal sensor. Add a driver using the
thermal framework.

Signed-off-by: Andrew Lunn <andrew@lunn.ch>
Signed-off-by: Sebastian Hesselbarth <sebastian.hesselbarth@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08 20:26:02 +08:00
Nobuhiro Iwamatsu 7060aa3664 thermal: Add support for the thermal sensor on Kirkwood SoCs
This patch adds support for Kirkwood 88F6282 and 88F6283 thermal sensor.

Signed-off-by: Nobuhiro Iwamatsu <iwamatsu@nigauri.org>
Signed-off-by: Andrew Lunn <andrew@lunn.ch>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-08 20:25:56 +08:00
Amit Daniel Kachhap e6e238c38b thermal: sysfs: Add a new sysfs node emul_temp for thermal emulation
This patch adds support to set the emulated temperature method in
thermal zone (sensor). After setting this feature thermal zone may
report this temperature and not the actual temperature. The emulation
implementation may be based on sensor capability through platform
specific handler or pure software emulation if no platform handler defined.

This is useful in debugging different temperature threshold and its
associated cooling action. Critical threshold's cannot be emulated.
Writing 0 on this node should disable emulation.

Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Acked-by: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-06 13:45:42 +08:00
Jacob Pan d6d71ee4a1 PM: Introduce Intel PowerClamp Driver
Intel PowerClamp driver performs synchronized idle injection across
all online CPUs. The goal is to maintain a given package level C-state
ratio.

Compared to other throttling methods already exist in the kernel,
such as ACPI PAD (taking CPUs offline) and clock modulation, this is often
more efficient in terms of performance per watt.

Please refer to Documentation/thermal/intel_powerclamp.txt for more details.

Signed-off-by: Arjan van de Ven <arjan@linux.intel.com>
Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-02-06 13:45:00 +08:00
Jonghwa Lee bbf63be4f3 Thermal: exynos: Add sysfs node supporting exynos's emulation mode.
This patch supports exynos's emulation mode with newly created sysfs node.
Exynos 4x12 (4212, 4412) and 5 series provide emulation mode for thermal
management unit. Thermal emulation mode supports software debug for TMU's
operation. User can set temperature manually with software code and TMU
will read current temperature from user value not from sensor's value.
This patch includes also documentary placed under Documentation/thermal/.

Signed-off-by: Jonghwa Lee <jonghwa3.lee@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2013-01-04 15:22:37 +08:00
Linus Torvalds a2013a13e6 Merge branch 'for-linus' of git://git.kernel.org/pub/scm/linux/kernel/git/jikos/trivial
Pull trivial branch from Jiri Kosina:
 "Usual stuff -- comment/printk typo fixes, documentation updates, dead
  code elimination."

* 'for-linus' of git://git.kernel.org/pub/scm/linux/kernel/git/jikos/trivial: (39 commits)
  HOWTO: fix double words typo
  x86 mtrr: fix comment typo in mtrr_bp_init
  propagate name change to comments in kernel source
  doc: Update the name of profiling based on sysfs
  treewide: Fix typos in various drivers
  treewide: Fix typos in various Kconfig
  wireless: mwifiex: Fix typo in wireless/mwifiex driver
  messages: i2o: Fix typo in messages/i2o
  scripts/kernel-doc: check that non-void fcts describe their return value
  Kernel-doc: Convention: Use a "Return" section to describe return values
  radeon: Fix typo and copy/paste error in comments
  doc: Remove unnecessary declarations from Documentation/accounting/getdelays.c
  various: Fix spelling of "asynchronous" in comments.
  Fix misspellings of "whether" in comments.
  eisa: Fix spelling of "asynchronous".
  various: Fix spelling of "registered" in comments.
  doc: fix quite a few typos within Documentation
  target: iscsi: fix comment typos in target/iscsi drivers
  treewide: fix typo of "suport" in various comments and Kconfig
  treewide: fix typo of "suppport" in various comments
  ...
2012-12-13 12:00:02 -08:00
Masanari Iida e41e85cc17 treewide: Fix typos in various Kconfig
Correct spelling typo within various Kconfig.

Signed-off-by: Masanari Iida <standby24x7@gmail.com>
Signed-off-by: Jiri Kosina <jkosina@suse.cz>
2012-12-03 11:03:56 +01:00
Eduardo Valentin 4ba115b1e1 thermal: cpu cooling: allow module builds
As thermal drivers can be built as modules and also
the thermal framework itself, building cpu cooling
only as built-in can cause linking errors. For instance:
* Generic Thermal sysfs driver
*
Generic Thermal sysfs driver (THERMAL) [M/n/y/?] m
  generic cpu cooling support (CPU_THERMAL) [N/y/?] (NEW) y

with the following drive:
CONFIG_OMAP_BANDGAP=m

generates:
ERROR: "cpufreq_cooling_unregister" [drivers/staging/omap-thermal/omap-thermal.ko] undefined!
ERROR: "cpufreq_cooling_register" [drivers/staging/omap-thermal/omap-thermal.ko] undefined!

This patch changes cpu cooling driver to allow it
to be built as module.

Reported-by: Enric Balletbo i Serra <eballetbo@gmail.com>
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Reviewed-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-22 15:59:52 +08:00
hongbo.zhang aa1acb0451 Thermal: Add ST-Ericsson DB8500 thermal driver.
This driver is based on the thermal management framework in thermal_sys.c. A
thermal zone device is created with the trip points to which cooling devices
can be bound, the current cooling device is cpufreq, e.g. CPU frequency is
clipped down to cool the CPU, and other cooling devices can be added and bound
to the trip points dynamically.  The platform specific PRCMU interrupts are
used to active thermal update when trip points are reached.

Signed-off-by: hongbo.zhang <hongbo.zhang@linaro.com>
Reviewed-by: Viresh Kumar <viresh.kumar@linaro.org>
Reviewed-by: Francesco Lavra <francescolavra.fl@gmail.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 20:50:34 +08:00
Zhang Rui ec54c74c8f Exynos: Add missing dependency
CPU_FREQ_TABLE depends on CPU_FREQ. Selecting CPU_FREQ_TABLE without checking
for dependencies gives the following compilation warnings:
warning: (ARCH_TEGRA_2x_SOC && ARCH_TEGRA_3x_SOC && UX500_SOC_DB8500 &&
CPU_THERMAL && EXYNOS_THERMAL) selects CPU_FREQ_TABLE which has unmet
direct dependencies (ARCH_HAS_CPUFREQ && CPU_FREQ)

Based-on-patch-by: Sachin Kamat <sachin.kamat@linaro.org>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 20:41:46 +08:00
Zhang Rui 72e1989782 Refactor drivers/thermal/Kconfig
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-15 20:41:30 +08:00
Durgadoss R a56757af8e Thermal: Provide option to choose default thermal governor
This patch provides option to choose the default thermal
governor. If no option is provided, the step_wise
governor is selected by default.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:09 +08:00
Durgadoss R 1cc807a234 Thermal: Add a thermal notifier for user space
This patch registers a governor which will let the
user land manage the platform thermals. Whenever a
trip happens, this governor just notifies the user
space using kobj_uevent().

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:08 +08:00
Durgadoss R e151a202a0 Thermal: Introduce a step_wise thermal governor
This patch adds a simple step_wise governor to the
generic thermal layer. This algorithm throttles the
cooling devices in a linear fashion. If the 'trend'
is heating, it throttles by one step. And if the
thermal trend is cooling it de-throttles by one step.

This actually moves the throttling logic from thermal_sys.c
and puts inside step_wise.c, without any change.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:07 +08:00
Durgadoss R 4ccc5743ae Thermal: Introduce fair_share thermal governor
This patch introduces a simple 'weight' based
governor named fair_share governor. Whenever the
thermal framework gets notified of the trip point
violation, this governor (if configured), throttles
the cooling devices associated with a thermal zone.

This mapping between a thermal zone and a cooling device
and the effectiveness of cooling are provided in the
platform layer.

Signed-off-by: Durgadoss R <durgadoss.r@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-11-05 14:00:07 +08:00
David Rientjes dd8e8c4a2c thermal, cpufreq: Fix build when CPU_FREQ_TABLE isn't configured
Commit 0236141837 ("thermal: add generic cpufreq cooling
implementation") requires cpufreq_frequency_get_table(), but that
function is only defined for CONFIG_CPU_FREQ_TABLE resulting in the
following build error:

  drivers/built-in.o: In function `cpufreq_get_max_state':
  drivers/thermal/cpu_cooling.c:259: undefined reference to `cpufreq_frequency_get_table'
  drivers/built-in.o: In function `get_cpu_frequency':
  drivers/thermal/cpu_cooling.c:129: undefined reference to `cpufreq_frequency_get_table'

Fix it by selecting CONFIG_CPU_FREQ_TABLE for such a configuration.

It turns out CONFIG_EXYNOS_THERMAL also needs CONFIG_CPU_FREQ_TABLE, so
select it there as well.

Signed-off-by: David Rientjes <rientjes@google.com>
Signed-off-by: Linus Torvalds <torvalds@linux-foundation.org>
2012-10-15 14:00:07 -07:00
Amit Daniel Kachhap f22d9c03cc thermal: exynos5: add exynos5250 thermal sensor driver support
Insert exynos5 TMU sensor changes into the thermal driver.  Some exynos4
changes are made generic for exynos series.

[akpm@linux-foundation.org: fix comment layout]
Signed-off-by: SangWook Ju <sw.ju@samsung.com>
Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:38 +08:00
Amit Daniel Kachhap c48cbba6fe hwmon: exynos4: move thermal sensor driver to driver/thermal directory
This movement is needed because the hwmon entries and corresponding sysfs
interface is a duplicate of utilities already provided by
driver/thermal/thermal_sys.c.  The goal is to place it in thermal folder
and add necessary functions to use the in-kernel thermal interfaces.

Signed-off-by: Amit Daniel Kachhap <amit.kachhap@linaro.org>
Acked-by: Guenter Roeck <guenter.roeck@ericsson.com>
Cc: SangWook Ju <sw.ju@samsung.com>
Cc: Durgadoss <durgadoss.r@intel.com>
Cc: Len Brown <lenb@kernel.org>
Cc: Jean Delvare <khali@linux-fr.org>
Cc: Kyungmin Park <kmpark@infradead.org>
Cc: Kukjin Kim <kgene.kim@samsung.com>
Signed-off-by: Andrew Morton <akpm@linux-foundation.org>
Signed-off-by: Amit Daniel Kachhap <amit.daniel@samsung.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2012-09-24 14:44:38 +08:00