Commit Graph

120 Commits

Author SHA1 Message Date
Linus Torvalds bfb764440d Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management updates from Zhang Rui:

 - Introduce generic ADC thermal driver, based on OF thermal (Laxman
   Dewangan)

 - Introduce new thermal driver for Tango chips (Marc Gonzalez)

 - Rockchip driver support for RK3399, RK3366, and some fixes (Caesar
   Wang, Elaine Zhang and Shawn Lin)

 - Add CPU power cooling model to Mediatek thermal driver (Dawei Chien)

 - Wider usage of dev_thermal_zone_of_sensor_register (Eduardo Valentin)

 - TI thermal driver gained a new maintainer (Keerthy).

 - Enabled powerclamp driver by checking CPU feature and package cstate
   counter instead of CPU whitelist (Jacob Pan)

 - Various fixes on thermal governor, OF thermal, Tegra, and RCAR

* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (50 commits)
  thermal: tango: initialize TEMPSI_CFG
  thermal: rockchip: use the usleep_range instead of udelay
  thermal: rockchip: add the notes for better reading
  thermal: rockchip: Support RK3366 SoCs in the thermal driver
  thermal: rockchip: handle the power sequence for tsadc controller
  thermal: rockchip: update the tsadc table for rk3399
  thermal: rockchip: fixes the code_to_temp for tsadc driver
  thermal: rockchip: disable thermal->clk in err case
  thermal: tegra: add Tegra132 specific SOC_THERM driver
  thermal: fix ptr_ret.cocci warnings
  thermal: mediatek: Add cpu dynamic power cooling model.
  thermal: generic-adc: Add ADC based thermal sensor driver
  thermal: generic-adc: Add DT binding for ADC based thermal sensor
  thermal: tegra: fix static checker warning
  thermal: tegra: mark PM functions __maybe_unused
  thermal: add temperature sensor support for tango SoC
  thermal: hisilicon: fix IRQ imbalance enabling
  thermal: hisilicon: support to use any sensor
  thermal: rcar: Remove binding docs for r8a7794
  thermal: tegra: add PM support
  ...
2016-05-26 09:23:43 -07:00
Laxman Dewangan b3aef78f76 thermal: generic-adc: Add ADC based thermal sensor driver
In some of platform, thermal sensors like NCT thermistors are
connected to the one of ADC channel. The temperature is read by
reading the voltage across the sensor resistance via ADC. Lookup
table for ADC read value to temperature is referred to get
temperature. ADC is read via IIO framework.

Add support for thermal sensor driver which read the voltage across
sensor resistance from ADC through IIO framework.

Acked-by: Jonathan Cameron <jic23@kernel.org>
Signed-off-by: Laxman Dewangan <ldewangan@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-05-17 07:28:31 -07:00
Marc Gonzalez 0b58c08b59 thermal: add temperature sensor support for tango SoC
The Tango thermal driver provides support for the primitive temperature
sensor embedded in Tango chips since the SMP8758.

This sensor only generates a 1-bit signal to indicate whether the die
temperature exceeds a programmable threshold.

Signed-off-by: Marc Gonzalez <marc_gonzalez@sigmadesigns.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-05-17 07:28:30 -07:00
Wei Ni a4dff94ffd thermal: tegra: move tegra thermal files into tegra directory
Move Tegra soctherm driver to tegra directory, it's easy to maintain
and add more new function support for Tegra platforms.
This will also help to split soctherm driver into common parts and
chip specific data related parts.

Signed-off-by: Wei Ni <wni@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-05-17 07:28:27 -07:00
Aaron Lu a3c89334f0 Thermal / ACPI / video: add INT3406 thermal driver
INT3406 ACPI device object resembles an ACPI video output device, but its
_BCM is said to be deprecated and should not be used. So we will make
use of the raw interface to do the actual cooling.

Signed-off-by: Aaron Lu <aaron.lu@intel.com>
Acked-by: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Rafael J. Wysocki <rafael.j.wysocki@intel.com>
2016-05-11 02:15:31 +02:00
Johannes Berg a6f4850dbc thermal: fix Mediatek thermal controller build
At least with CONFIG_COMPILE_TEST, there's no reason to assume
that CONFIG_RESET_CONTROLLER is set, but the code for this
controller requires it since it calls device_reset().

Make CONFIG_MTK_THERMAL properly depend on CONFIG_RESET_CONTROLLER.

Signed-off-by: Johannes Berg <johannes.berg@intel.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-04-20 21:13:21 -07:00
Randy Dunlap 62e14f6fd3 thermal: fix mtk_thermal build dependency
Fix build errors when MTK_THERMAL=y and NVMEM=m by preventing that
Kconfig combination.

drivers/built-in.o: In function `mtk_thermal_probe':
mtk_thermal.c:(.text+0xffa8f): undefined reference to `nvmem_cell_get'
mtk_thermal.c:(.text+0xffabe): undefined reference to `nvmem_cell_read'
mtk_thermal.c:(.text+0xffac9): undefined reference to `nvmem_cell_put'

Signed-off-by: Randy Dunlap <rdunlap@infradead.org>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: <linux-pm@vger.kernel.org>
Cc: Sascha Hauer <s.hauer@pengutronix.de>
Cc: Hanyi Wu <hanyi.wu@mediatek.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-04-20 16:22:46 -07:00
Zhang Rui 032f4a1e5a Merge branch 'linus' of git://git.kernel.org/pub/scm/linux/kernel/git/evalenti/linux-soc-thermal into thermal-soc 2016-03-15 07:53:01 +08:00
Eduardo Valentin 74e5053cd7 thermal: mtk: allow compile testing on UM
Following the fix on thermal Kconfig, this
patch adds dependency on HAS_IOMEM so driver
properly compile test on UM arch.

Cc: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Matthias Brugger <matthias.bgg@gmail.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-mediatek@lists.infradead.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-03-08 13:34:25 -08:00
Krzysztof Kozlowski bf82c350e9 thermal: Fix build error of missing devm_ioremap_resource on UM
The devres.o gets linked if HAS_IOMEM is present so on ARCH=um
allyesconfig (COMPILE_TEST) failed on many files with:

drivers/built-in.o: In function `kirkwood_thermal_probe':
kirkwood_thermal.c:(.text+0x390a25): undefined reference to `devm_ioremap_resource'
drivers/built-in.o: In function `exynos_tmu_probe':
exynos_tmu.c:(.text+0x39246b): undefined reference to `devm_ioremap'

The users of devm_ioremap_resource() which are compile-testable should
depend on HAS_IOMEM.

Signed-off-by: Krzysztof Kozlowski <k.kozlowski@samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-03-08 12:22:35 -08:00
Simon Horman 8255e4e237 thermal: rcar: Use ARCH_RENESAS
Make use of ARCH_RENESAS in place of ARCH_SHMOBILE.

This is part of an ongoing process to migrate from ARCH_SHMOBILE to
ARCH_RENESAS the motivation for which being that RENESAS seems to be a more
appropriate name than SHMOBILE for the majority of Renesas ARM based SoCs.

Acked-by: Geert Uytterhoeven <geert+renesas@glider.be>
Signed-off-by: Simon Horman <horms+renesas@verge.net.au>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-03-08 11:55:58 -08:00
Luis de Bethencourt 527860fe46 thermal: db8500_cpufreq_cooling: Compile with COMPILE_TEST
This driver only has runtime but no build time dependencies, so it can be
built for testing purposes if the Kconfig COMPILE_TEST option is enabled.

This is useful to have more build coverage and make sure that drivers are
not affected by changes that could cause build regressions.

Signed-off-by: Luis de Bethencourt <luisbg@osg.samsung.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-03-08 11:29:29 -08:00
Sascha Hauer a92db1c808 thermal: Add Mediatek thermal controller support
This adds support for the Mediatek thermal controller found on MT8173
and likely other SoCs.
The controller is a bit special. It does not have its own ADC, instead
it controls the on-SoC AUXADC via AHB bus accesses. For this reason
we need the physical address of the AUXADC. Also it controls a mux
using AHB bus accesses, so we need the APMIXEDSYS physical address aswell.

Signed-off-by: Sascha Hauer <s.hauer@pengutronix.de>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-02-18 07:20:36 -08:00
Arnd Bergmann 26716ce124 thermal: allow u8500-thermal driver to be a module
When the thermal subsystem is a loadable module, the u8500 driver
fails to build:

drivers/thermal/built-in.o: In function `db8500_thermal_probe':
db8500_thermal.c:(.text+0x96c): undefined reference to `thermal_zone_device_register'
drivers/thermal/built-in.o: In function `db8500_thermal_work':
db8500_thermal.c:(.text+0xab4): undefined reference to `thermal_zone_device_update'

This changes the symbol to a tristate, so Kconfig can track the
dependency correctly.

Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-02-09 14:18:23 -08:00
Arnd Bergmann 4d2f1794c0 thermal: allow spear-thermal driver to be a module
When the thermal subsystem is a loadable module, the spear driver
fails to build:

drivers/thermal/built-in.o: In function `spear_thermal_exit':
spear_thermal.c:(.text+0xf8): undefined reference to `thermal_zone_device_unregister'
drivers/thermal/built-in.o: In function `spear_thermal_probe':
spear_thermal.c:(.text+0x230): undefined reference to `thermal_zone_device_register'

This changes the symbol to a tristate, so Kconfig can track the
dependency correctly.

Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2016-02-09 14:16:08 -08:00
Arnd Bergmann e4217468ae Revert "thermal: qcom_spmi: allow compile test"
This just caused build errors:

warning: (QCOM_SPMI_TEMP_ALARM) selects REGMAP_SPMI which has unmet direct dependencies (SPMI)
drivers/built-in.o: In function `regmap_spmi_ext_gather_write':
:(.text+0x609b0): undefined reference to `spmi_ext_register_write'
:(.text+0x609f0): undefined reference to `spmi_ext_register_writel'

While it's generally a good idea to allow compile testing, in this
case, it just doesn't work, so reverting the patch that
introduced the compile-test variant seems the most appropriate
solution.

Note that SPMI also has a 'depends on ARCH_QCOM || COMPILE_TEST'
statement, so we should be able to enable SPMI on all architectures
for compile testing already.

Signed-off-by: Arnd Bergmann <arnd@arndb.de>
Fixes: cb7fb4d342 ("thermal: qcom_spmi: allow compile test")
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-11-23 15:33:56 -08:00
Zhang Rui 7c5b2759bf Merge branches 'thermal-core', 'thermal-intel' and 'thermal-soc' into next 2015-11-06 09:32:10 +08:00
Ørjan Eide a76caf55e5 thermal: Add devfreq cooling
Add a generic thermal cooling device for devfreq, that is similar to
cpu_cooling.

The device must use devfreq.  In order to use the power extension of the
cooling device, it must have registered its OPPs using the OPP library.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Ørjan Eide <orjan.eide@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-10-30 10:21:01 -07:00
Srinivas Pandruvada 98cadf25da thermal: kconfig: select THERMAL_WRITABLE_TRIPS for x86 thermal
After the commit "thermal: core: Add Kconfig option to enable writable
trips", by default the trips are read only. This cause user space thermal
controllers to poll for temperature as they can't set temperature
thresholds for getting a notification via uevents. These programs use RW
trip in a zone to register thresholds. Since we need to enable the new
config introduced by above commit to allow writable trips, selecting
CONFIG_THERMAL_WRITABLE_TRIP for x86 thermal drivers.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
2015-10-10 09:49:21 +08:00
Eduardo Valentin ec2feb475f thermal: ti-soc: Kconfig fix to avoid menu showing wrongly
Move the dependencies to menu, so we avoid showing it wrongly.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-omap@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-13 19:33:53 -07:00
Eduardo Valentin cb7fb4d342 thermal: qcom_spmi: allow compile test
Adding COMPILE_TEST flag to qcom_spmi driver to facilitate
maintenance.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-13 19:33:52 -07:00
Eduardo Valentin 2bf427353e thermal: exynos: allow compile test
Adding COMPILE_TEST flag to exynos driver to facilitate
maintenance.

Cc: Lukasz Majewski <l.majewski@samsung.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-samsung-soc@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-13 19:33:52 -07:00
Eduardo Valentin 1b15826721 thermal: armada: allow compile test
Adding COMPILE_TEST flag to armada driver to facilitate
maintenance.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-13 19:33:52 -07:00
Eduardo Valentin 07fffd5cca thermal: dove: allow compile test
Adding COMPILE_TEST flag to dove driver to facilitate
maintenance.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-13 19:33:51 -07:00
Eduardo Valentin 9c8aa959e1 thermal: kirkwood: allow compile test
Adding COMPILE_TEST flag to kirkwood driver to facilitate
maintenance.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-13 19:33:51 -07:00
Eduardo Valentin 444f9b0007 thermal: rockchip: allow compile test
Adding COMPILE_TEST flag to rockchip driver to facilitate
maintenance.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Heiko Stuebner <heiko@sntech.de>
Cc: linux-pm@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-rockchip@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-13 19:33:51 -07:00
Eduardo Valentin aa2937b73a thermal: spear: allow compile test
Adding COMPILE_TEST flag to spear driver to facilitate
maintenance.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Acked-by: Viresh Kumar <viresh.kumar@linaro.org>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-13 19:33:51 -07:00
Eduardo Valentin f9e2b05218 thermal: hisi: allow compile test
Adding COMPILE_TEST flag to hisi driver to facilitate maintenance.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: linux-pm@vger.kernel.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-09-13 19:33:51 -07:00
Tushar Dave d0a12625d2 thermal: Add Intel PCH thermal driver
This change adds a thermal driver for Wildcat Point platform controller
hub. This driver register PCH thermal sensor as a thermal zone and
associate critical and hot trips if present.

Signed-off-by: Tushar Dave <tushar.n.dave@intel.com>
Reviewed-by: Pandruvada, Srinivas <srinivas.pandruvada@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2015-08-04 10:06:08 +08:00
Zhang Rui 111b23cf89 Merge branches 'release' and 'thermal-soc' of .git into next 2015-06-11 12:52:14 +08:00
kongxinwei 9a5238a9c6 thermal: hisilicon: add new hisilicon thermal sensor driver
This patch adds the support for hisilicon thermal sensor, within
hisilicon SoC. there will register sensors for thermal framework
and use device tree to bind cooling device.

Signed-off-by: Leo Yan <leo.yan@linaro.org>
Signed-off-by: kongxinwei <kong.kongxinwei@hisilicon.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-06-03 15:58:52 -07:00
Javi Merino db6cb88b8f thermal: remove stale THERMAL_POWER_ACTOR select
A previous version of this patch had a config for THERMAL_POWER_ACTOR
but it was dropped.  Remove the select as it is not doing anything.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Reported-by: Valentin Rothberg <valentinrothberg@gmail.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:53 -07:00
Punit Agrawal 35e946447f thermal: core: Add Kconfig option to enable writable trips
Add a Kconfig option to allow system integrators to control whether
userspace tools can change trip temperatures. This option overrides
the thermal zone setup in the driver code and must be enabled for
platform specified writable trips to come into effect.

The original behaviour of requiring root privileges to change trip
temperatures remains unchanged.

Cc: Eduardo Valentin <edubezval@gmail.com>
Cc: Zhang Rui <rui.zhang@intel.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:53 -07:00
Javi Merino 6b775e870c thermal: introduce the Power Allocator governor
The power allocator governor is a thermal governor that controls system
and device power allocation to control temperature.  Conceptually, the
implementation divides the sustainable power of a thermal zone among
all the heat sources in that zone.

This governor relies on "power actors", entities that represent heat
sources.  They can report current and maximum power consumption and
can set a given maximum power consumption, usually via a cooling
device.

The governor uses a Proportional Integral Derivative (PID) controller
driven by the temperature of the thermal zone.  The output of the
controller is a power budget that is then allocated to each power
actor that can have bearing on the temperature we are trying to
control.  It decides how much power to give each cooling device based
on the performance they are requesting.  The PID controller ensures
that the total power budget does not exceed the control temperature.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Eduardo Valentin <edubezval@gmail.com>
Signed-off-by: Punit Agrawal <punit.agrawal@arm.com>
Signed-off-by: Javi Merino <javi.merino@arm.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:52 -07:00
Ivan T. Ivanov c610afaa21 thermal: Add QPNP PMIC temperature alarm driver
Add support for the temperature alarm peripheral found inside
Qualcomm plug-and-play (QPNP) PMIC chips. The temperature alarm
peripheral outputs a pulse on an interrupt line whenever the
thermal over temperature stage value changes.

Register a thermal sensor. The temperature reported by this thermal
sensor device should reflect the actual PMIC die temperature if an
ADC is present on the given PMIC. If no ADC is present, then the
reported temperature should be estimated from the over temperature
stage value.

Cc: David Collins <collinsd@codeaurora.org>
Signed-off-by: Ivan T. Ivanov <iivanov@mm-sol.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2015-05-04 21:27:51 -07:00
Ong, Boon Leong 8c18769396 thermal: intel Quark SoC X1000 DTS thermal driver
In Intel Quark SoC X1000, there is one on-die digital temperature sensor(DTS).
The DTS offers both hot & critical trip points.

However, in current distribution of UEFI BIOS for Quark platform, only
critical trip point is configured to be 105 degree Celsius (based on Quark
SW ver1.0.1 and hot trip point is not used due to lack of IRQ.

There is no active cooling device for Quark SoC, so Quark SoC thermal
management logic expects Linux distro to orderly power-off when temperature
of the DTS exceeds the configured critical trip point.

Kernel param "polling_delay" in milliseconds is used to control the frequency
the DTS temperature is read by thermal framework. It defaults to 2-second.
To change it, use kernel boot param "intel_quark_dts_thermal.polling_delay=X".

User interacts with Quark SoC DTS thermal driver through sysfs via:
/sys/class/thermal/thermal_zone0/

For example:
 - to read DTS temperature
   $ cat temp
 - to read critical trip point
   $ cat trip_point_0_temp
 - to read trip point type
   $ cat trip_point_0_type
 - to emulate temperature raise to test orderly shutdown by Linux distro
   $ echo 105 > emul_temp

Tested-by: Bryan O'Donoghue <pure.logic@nexus-software.ie>
Signed-off-by: Ong Boon Leong <boon.leong.ong@intel.com>
Reviewed-by: Bryan O'Donoghue <pure.logic@nexus-software.ie>
Reviewed-by: Kweh, Hock Leong <hock.leong.kweh@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2015-05-01 11:20:43 +08:00
Srinivas Pandruvada 4d0dd6c157 Thermal/int340x/processor_thermal: Enable auxiliary DTS for Braswell
Support two auxiliary DTS present on Braswell platform using side band
IOSF interface. This supports two read write trips, which can be used
to get notification on trip violation.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
2015-05-01 11:20:42 +08:00
Srinivas Pandruvada 3a2419f865 Thermal: Intel SoC: DTS thermal use common APIs
There is no change in functionality but using the common IOSF core APIs.
This driver is now just responsible for enumeration and call relevant
API to create thermal zone and register critical trip.
Also cpuid 0x4c is now handled in the int340x processor thermal driver
with the same functionality.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
2015-05-01 11:20:42 +08:00
Srinivas Pandruvada ee073604db Thermal: Intel SoC: DTS thermal IOSF core
This is becoming a common feature for Intel SoCs to expose the additional
digital temperature sensors (DTSs) using side band interface (IOSF). This
change remove common IOSF DTS handler function from the existing driver
intel_soc_dts_thermal.c and creates a stand alone module, which can
be selected from the SoC specific drivers. In this way there is less
code duplication.

Signed-off-by: Srinivas Pandruvada <srinivas.pandruvada@linux.intel.com>
2015-05-01 11:20:42 +08:00
Caesar Wang cbac8f6394 thermal: rockchip: add driver for thermal
Thermal is TS-ADC Controller module supports
user-defined mode and automatic mode.

User-defined mode refers,TSADC all the control signals entirely by
software writing to register for direct control.

Automaic mode refers to the module automatically poll TSADC output,
and the results were checked.If you find that the temperature High
in a period of time,an interrupt is generated to the processor
down-measures taken;If the temperature over a period of time High,
the resulting TSHUT gave CRU module,let it reset the entire chip,
or via GPIO give PMIC.

Signed-off-by: zhaoyifeng <zyf@rock-chips.com>
Signed-off-by: Caesar Wang <caesar.wang@rock-chips.com>
Reviewed-by: Dmitry Torokhov <dmitry.torokhov@gmail.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-11-24 14:35:07 -04:00
Mikko Perttunen 66fb848051 thermal: Add Tegra SOCTHERM thermal management driver
This adds support for the Tegra SOCTHERM thermal sensing and management
system found in the Tegra124 system-on-chip. This initial driver supports
temperature polling for four thermal zones.

Signed-off-by: Mikko Perttunen <mperttunen@nvidia.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-11-20 10:43:17 -04:00
Eduardo Valentin f9df89d897 thermal: introduce clock cooling device
This patch introduces a new thermal cooling device based on common clock
framework. The original motivation to write this cooling device is to be
able to cool down thermal zones using clocks that feed co-processors, such
as GPUs, DSPs, Image Processing Co-processors, etc. But it is written
in a way that it can be used on top of any clock.

The implementation is pretty straight forward. The code creates
a thermal cooling device based on a pair of a struct device and a clock name.
The struct device is assumed to be usable by the OPP layer. The OPP layer
is used as source of the list of possible frequencies. The (cpufreq) frequency
table is then used as a map from frequencies to cooling states. Cooling
states are indexes to the frequency table.

The logic sits on top of common clock framework, specifically on clock
pre notifications. Any PRE_RATE_CHANGE is hijacked, and the transition is
only allowed when the new rate is within the thermal limit (cooling state -> freq).

When a thermal cooling device state transition is requested, the clock
is also checked to verify if the current clock rate is within the new
thermal limit.

Cc: Zhang Rui <rui.zhang@intel.com>
Cc: Mike Turquette <mturquette@linaro.org>
Cc: Nishanth Menon <nm@ti.com>
Cc: Pavel Machek <pavel@ucw.cz>
Cc: "Rafael J. Wysocki" <rjw@sisk.pl>
Cc: Len Brown <len.brown@intel.com>
Cc: Greg Kroah-Hartman <gregkh@linuxfoundation.org>
Cc: linux-pm@vger.kernel.org
Cc: linux-arm-kernel@lists.infradead.org
Cc: linux-kernel@vger.kernel.org
Signed-off-by: Eduardo Valentin <eduardo.valentin@ti.com>
Signed-off-by: Eduardo Valentin <edubezval@gmail.com>
2014-11-20 10:43:16 -04:00
Linus Torvalds 8264fce6de Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management updates from Zhang Rui:
 "Sorry that I missed the merge window as there is a bug found in the
  last minute, and I have to fix it and wait for the code to be tested
  in linux-next tree for a few days.  Now the buggy patch has been
  dropped entirely from my next branch.  Thus I hope those changes can
  still be merged in 3.18-rc2 as most of them are platform thermal
  driver changes.

  Specifics:

   - introduce ACPI INT340X thermal drivers.

     Newer laptops and tablets may have thermal sensors and other
     devices with thermal control capabilities that are exposed for the
     OS to use via the ACPI INT340x device objects.  Several drivers are
     introduced to expose the temperature information and cooling
     ability from these objects to user-space via the normal thermal
     framework.

     From: Lu Aaron, Lan Tianyu, Jacob Pan and Zhang Rui.

   - introduce a new thermal governor, which just uses a hysteresis to
     switch abruptly on/off a cooling device.  This governor can be used
     to control certain fan devices that can not be throttled but just
     switched on or off.  From: Peter Feuerer.

   - introduce support for some new thermal interrupt functions on
     i.MX6SX, in IMX thermal driver.  From: Anson, Huang.

   - introduce tracing support on thermal framework.  From: Punit
     Agrawal.

   - small fixes in OF thermal and thermal step_wise governor"

* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (25 commits)
  Thermal: int340x thermal: select ACPI fan driver
  Thermal: int3400_thermal: use acpi_thermal_rel parsing APIs
  Thermal: int340x_thermal: expose acpi thermal relationship tables
  Thermal: introduce int3403 thermal driver
  Thermal: introduce INT3402 thermal driver
  Thermal: move the KELVIN_TO_MILLICELSIUS macro to thermal.h
  ACPI / Fan: support INT3404 thermal device
  ACPI / Fan: add ACPI 4.0 style fan support
  ACPI / fan: convert to platform driver
  ACPI / fan: use acpi_device_xxx_power instead of acpi_bus equivelant
  ACPI / fan: remove no need check for device pointer
  ACPI / fan: remove unused macro
  Thermal: int3400 thermal: register to thermal framework
  Thermal: int3400 thermal: add capability to detect supporting UUIDs
  Thermal: introduce int3400 thermal driver
  ACPI: add ACPI_TYPE_LOCAL_REFERENCE support to acpi_extract_package()
  ACPI: make acpi_create_platform_device() an external API
  thermal: step_wise: fix: Prevent from binary overflow when trend is dropping
  ACPI: introduce ACPI int340x thermal scan handler
  thermal: Added Bang-bang thermal governor
  ...
2014-10-24 11:21:43 -07:00
Zhang Rui 6ceaf58abe Merge branch 'int340x-thermal' of .git into next 2014-10-17 14:30:58 +08:00
Zhang Rui d8054749c6 Thermal: int340x thermal: select ACPI fan driver
we share the same driver for both ACPI predefined Fan device
and INT3404 Fan device, thus we should select the ACPI Fan
driver when int340x thermal drivers are enabeld.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-10-17 14:30:41 +08:00
Jacob Pan 52b1c69d7e Thermal: int340x_thermal: expose acpi thermal relationship tables
ACPI 4.0 introduced two thermal relationship tables via _ART
(active cooling) and  _TRT (passive cooling) objects. These
tables contain many to many relationships among thermal sensors
and cooling devices.

This patch parses _ART and _TRT and makes the result available to
the userspace via an misc device interface. At the same time,
kernel drivers can also request parsing results from internal
kernel APIs.

The results include source and target devices, influence, and
sampling rate in case of _TRT. For _ART, the result shows source
device, target device, and weight percentage.

Signed-off-by: Jacob Pan <jacob.jun.pan@linux.intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-10-11 09:35:48 +08:00
Lan Tianyu 4384b8fe16 Thermal: introduce int3403 thermal driver
ACPI INT3403 device object can be used to retrieve temperature date
from temperature sensors present in the system, and to expose
device' performance control.

The previous INT3403 thermal driver supports temperature reporting only,
thus remove it and introduce this new & enhanced one.

Signed-off-by: Lan Tianyu <tianyu.lan@intel.com>
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-10-11 09:35:36 +08:00
Zhang Rui 0ab15365ff Thermal: int3400 thermal: register to thermal framework
Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-10-10 13:57:10 +08:00
Zhang Rui 816cab931f Thermal: introduce int3400 thermal driver
Introduce int3400 thermal driver. And make INT3400 driver
enumerate the other int340x thermal components shown in _ART/_TRT.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-10-10 13:57:09 +08:00
Zhang Rui 3230bbfce8 ACPI: introduce ACPI int340x thermal scan handler
Newer laptops and tablets that use ACPI may have thermal sensors and
other devices with thermal control capabilities outside the core CPU/SOC,
for thermal safety reasons.
They are exposed for the OS to use via
1) INT3400 ACPI device object as the master.
2) INT3401 ~ INT340B ACPI device objects as the slaves.

This patch introduces a scan handler to enumerate the INT3400
ACPI device object to platform bus, and prevent its slaves
from being enumerated before the controller driver being probed.

Signed-off-by: Zhang Rui <rui.zhang@intel.com>
2014-09-11 23:35:15 +08:00