linux/drivers/thermal/Makefile

34 lines
1.2 KiB
Makefile

#
# Makefile for sensor chip drivers.
#
obj-$(CONFIG_THERMAL) += thermal_sys.o
thermal_sys-y += thermal_core.o
# interface to/from other layers providing sensors
thermal_sys-$(CONFIG_THERMAL_HWMON) += thermal_hwmon.o
thermal_sys-$(CONFIG_THERMAL_OF) += of-thermal.o
# governors
thermal_sys-$(CONFIG_THERMAL_GOV_FAIR_SHARE) += fair_share.o
thermal_sys-$(CONFIG_THERMAL_GOV_STEP_WISE) += step_wise.o
thermal_sys-$(CONFIG_THERMAL_GOV_USER_SPACE) += user_space.o
# cpufreq cooling
thermal_sys-$(CONFIG_CPU_THERMAL) += cpu_cooling.o
# platform thermal drivers
obj-$(CONFIG_SPEAR_THERMAL) += spear_thermal.o
obj-$(CONFIG_RCAR_THERMAL) += rcar_thermal.o
obj-$(CONFIG_KIRKWOOD_THERMAL) += kirkwood_thermal.o
obj-y += samsung/
obj-$(CONFIG_DOVE_THERMAL) += dove_thermal.o
obj-$(CONFIG_DB8500_THERMAL) += db8500_thermal.o
obj-$(CONFIG_ARMADA_THERMAL) += armada_thermal.o
obj-$(CONFIG_IMX_THERMAL) += imx_thermal.o
obj-$(CONFIG_DB8500_CPUFREQ_COOLING) += db8500_cpufreq_cooling.o
obj-$(CONFIG_INTEL_POWERCLAMP) += intel_powerclamp.o
obj-$(CONFIG_X86_PKG_TEMP_THERMAL) += x86_pkg_temp_thermal.o
obj-$(CONFIG_TI_SOC_THERMAL) += ti-soc-thermal/
obj-$(CONFIG_ACPI_INT3403_THERMAL) += int3403_thermal.o