linux/drivers/thermal
Linus Torvalds 91466574be Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux
Pull thermal management updates from Zhang Rui:
 "This time, the biggest change is the work of representing hardware
  thermal properties in device tree infrastructure.

  This work includes the introduction of a device tree bindings for
  describing the hardware thermal behavior and limits, and also a parser
  to read and interpret the data, and build thermal zones and thermal
  binding parameters.  It also contains three examples on how to use the
  new representation on sensor devices, using three different drivers to
  accomplish it.  One driver is in thermal subsystem, the TI SoC
  thermal, and the other two drivers are in hwmon subsystem.

  Actually, this would be the first step of the complete work because we
  still need to check other potential drivers to be converted and then
  validate the proposed API.  But the reason why I include it in this
  pull request is that, first, this change does not hurt any others
  without using this approach, second, the principle and concept of this
  change would not break after converting the remaining drivers.  BTW,
  as you can see, there are several points in this change that do not
  belong to thermal subsystem.  Because it has been suggested by Guenter
  R that in such cases, it is recommended to send the complete series
  via one single subsystem.

  Specifics:

   - representing hardware thermal properties in device tree
     infrastructure

   - fix a regression that the imx thermal driver breaks system suspend.

   - introduce ACPI INT3403 thermal driver to retrieve temperature data
     from the INT3403 ACPI device object present on some systems.

   - introduce debug statement for thermal core and step_wise governor.

   - assorted fixes and cleanups for thermal core, cpu cooling, exynos
     thrmal, intel powerclamp and imx thermal driver"

* 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux: (34 commits)
  thermal: remove const flag from .ops of imx thermal
  Thermal: update thermal zone device after setting emul_temp
  intel_powerclamp: Fix cstate counter detection.
  thermal: imx: add necessary clk operation
  Thermal cpu cooling: return error if no valid cpu frequency entry
  thermal: fix cpu_cooling max_level behavior
  thermal: rcar-thermal: Enable driver compilation with COMPILE_TEST
  thermal: debug: add debug statement for core and step_wise
  thermal: imx_thermal: add module device table
  drivers: thermal: Mark function as static in x86_pkg_temp_thermal.c
  thermal:samsung: fix compilation warning
  thermal: imx: correct suspend/resume flow
  thermal: exynos: fix error return code
  Thermal: ACPI INT3403 thermal driver
  MAINTAINERS: add thermal bindings entry in thermal domain
  arm: dts: make OMAP4460 bandgap node to belong to OCP
  arm: dts: make OMAP443x bandgap node to belong to OCP
  arm: dts: add cooling properties on omap5 cpu node
  arm: dts: add omap5 thermal data
  arm: dts: add omap5 CORE thermal data
  ...
2014-01-24 17:13:49 -08:00
..
samsung Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux 2014-01-24 17:13:49 -08:00
ti-soc-thermal thermal: ti-soc-thermal: use thermal DT infrastructure 2013-12-04 09:34:25 -04:00
Kconfig Merge branches 'misc', 'soc', 'soc-eduardo' and 'int3404-thermal' of .git into next 2014-01-02 14:22:28 +08:00
Makefile Merge branches 'misc', 'soc', 'soc-eduardo' and 'int3404-thermal' of .git into next 2014-01-02 14:22:28 +08:00
armada_thermal.c Merge branches 'misc', 'drv_cleanup', 'devm-cleanup' and 'ti-soc' of .git into next 2013-05-28 10:46:46 +08:00
cpu_cooling.c Merge branches 'misc', 'soc', 'soc-eduardo' and 'int3404-thermal' of .git into next 2014-01-02 14:22:28 +08:00
db8500_cpufreq_cooling.c thermal: db8500_cpufreq_cooling: remove usage of IS_ERR_OR_NULL() 2013-04-27 09:28:38 +08:00
db8500_thermal.c thermal: db8500: Fix missing mutex_unlock() in probe error paths 2013-03-26 22:08:08 +08:00
dove_thermal.c Merge branches 'misc', 'drv_cleanup', 'devm-cleanup' and 'ti-soc' of .git into next 2013-05-28 10:46:46 +08:00
fair_share.c Thermal: build thermal governors into thermal_sys module 2013-04-14 23:28:43 +08:00
imx_thermal.c Merge branch 'misc' of .git into next 2014-01-06 22:48:19 +08:00
int3403_thermal.c Thermal: ACPI INT3403 thermal driver 2014-01-02 09:42:12 +08:00
intel_powerclamp.c Merge branch 'next' of git://git.kernel.org/pub/scm/linux/kernel/git/rzhang/linux 2014-01-24 17:13:49 -08:00
kirkwood_thermal.c Merge branches 'misc', 'drv_cleanup', 'devm-cleanup' and 'ti-soc' of .git into next 2013-05-28 10:46:46 +08:00
of-thermal.c thermal: introduce device tree parser 2013-12-04 09:31:34 -04:00
rcar_thermal.c thermal: rcar: comment spelling 2014-01-08 10:11:36 +01:00
spear_thermal.c Merge branches 'misc', 'drv_cleanup', 'devm-cleanup' and 'ti-soc' of .git into next 2013-05-28 10:46:46 +08:00
step_wise.c thermal: debug: add debug statement for core and step_wise 2014-01-02 10:52:48 +08:00
thermal_core.c Merge branches 'misc' and 'soc' of .git into next 2014-01-03 22:55:04 +08:00
thermal_core.h thermal: introduce device tree parser 2013-12-04 09:31:34 -04:00
thermal_hwmon.c Revert "drivers: thermal: parent virtual hwmon with thermal zone" 2013-10-21 11:16:29 +08:00
thermal_hwmon.h thermal: hwmon: move hwmon support to single file 2013-09-03 09:09:12 -04:00
user_space.c Thermal: build thermal governors into thermal_sys module 2013-04-14 23:28:43 +08:00
x86_pkg_temp_thermal.c drivers: thermal: Mark function as static in x86_pkg_temp_thermal.c 2014-01-02 10:34:37 +08:00